公开(公告)号：US09704727B2

公开(公告)日：2017-07-11

申请号：US14569293

申请日：2014-12-12

Applicant: SINFONIA TECHNOLOGY CO., LTD.

Inventor： Mikio Segawa ,  Yasushi Taniyama ,  Mitsuo Natsume ,  Atsushi Suzuki ,  Toshihiro Kawai ,  Kunihiko Sato

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67017 ,  H01L21/67115 ,  H01L21/67766 ,  H01L21/67772 ,  H01L21/67778

Abstract: An EFEM includes a housing 3 that constitutes a wafer transport chamber 9 that is substantially closed by connecting load ports 4 to an opening 31a provided on a wall 31, and connecting a processing apparatus 6; a wafer transport apparatus 2, and transports a wafer between the processing apparatus 6 and the FOUPs 7 mounted on the load ports 4; a gas delivery port 11; a gas suction port 12; a gas feedback path 10; and a FFU 13 that includes a filter 13b that is provided in the gas delivery port 11, and eliminates particles contained in the delivered gas, wherein the gas in the wafer transport chamber 9 is circulated by generating a downward gasflow in the wafer transport chamber 9 and feeding back the gas through the gas feedback path 10.

公开(公告)号：US20150170945A1

公开(公告)日：2015-06-18

申请号：US14569293

申请日：2014-12-12

Applicant: SINFONIA TECHNOLOGY CO., LTD.

Inventor： Mikio Segawa ,  Yasushi Taniyama ,  Mitsuo Natsume ,  Atsushi Suzuki ,  Toshihiro Kawai ,  Kunihiko Sato

IPC: H01L21/673 ,  H01L21/677

CPC classification number: H01L21/67017 ,  H01L21/67115 ,  H01L21/67766 ,  H01L21/67772 ,  H01L21/67778

Abstract: An EFEM includes a housing 3 that constitutes a wafer transport chamber 9 that is substantially closed by connecting load ports 4 to an opening 31a provided on a wall 31, and connecting a processing apparatus 6; a wafer transport apparatus 2, and transports a wafer between the processing apparatus 6 and the FOUPs 7 mounted on the load ports 4; a gas delivery port 11; a gas suction port 12; a gas feedback path 10; and a FFU 13 that includes a filter 13b that is provided in the gas delivery port 11, and eliminates particles contained in the delivered gas, wherein the gas in the wafer transport chamber 9 is circulated by generating a downward gasflow in the wafer transport chamber 9 and feeding back the gas through the gas feedback path 10.

Abstract translation: EFEM包括壳体3，其构成通过将负载端口4连接到设置在壁31上的开口31a而基本上闭合的晶片运送室9，并且连接处理装置6; 晶片传送装置2，并且在处理装置6和安装在装载端口4上的FOUP 7之间传送晶片; 气体输送口11; 气体吸入口12; 气体反馈路径10; 以及FFU13，其包括设置在气体输送口11中的过滤器13b，并且消除了包含在输送气体中的颗粒，其中晶片输送室9中的气体通过在晶片输送室9中产生向下的气流而循环 并且通过气体反馈路径10反馈气体。

公开(公告)号：US09412634B2

公开(公告)日：2016-08-09

申请号：US14537477

申请日：2014-11-10

Applicant: SINFONIA TECHNOLOGY CO., LTD.

Inventor： Mikio Segawa ,  Yasushi Taniyama ,  Shin Kawahisa ,  Mitsuo Natsume

IPC: H01L21/677 ,  H01L21/673

CPC classification number: H01L21/67772 ,  H01L21/67389 ,  H01L21/67742

Abstract: The present invention provides an atmosphere replacement apparatus capable of replacing the atmosphere on the surface of a wafer with a small amount of gas. The apparatus is configured to have a cover capable of facing and covering the wafer to be transported, and a gas supply means that supplies gas having properties different from a surrounding atmosphere from the cover, and replaces the atmosphere on the surface of the wafer by the gas.

Abstract translation: 本发明提供一种能够用少量气体代替晶片表面的气氛的气氛置换装置。 该装置被配置为具有能够面对和覆盖要输送的晶片的盖，以及气体供给装置，其将与周围大气不同的性质的气体与盖接触，并且通过 加油站。

公开(公告)号：US20150128441A1

公开(公告)日：2015-05-14

申请号：US14537477

申请日：2014-11-10

Applicant: SINFONIA TECHNOLOGY CO., LTD.

Inventor： Mikio Segawa ,  Yasushi Taniyama ,  Shin Kawahisa ,  Mitsuo Natsume

IPC: F26B25/00 ,  H01L21/677

CPC classification number: H01L21/67772 ,  H01L21/67389 ,  H01L21/67742

Abstract: The present invention provides an atmosphere replacement apparatus capable of replacing the atmosphere on the surface of a wafer with a small amount of gas. The apparatus is configured to have a cover capable of facing and covering the wafer to be transported, and a gas supply means that supplies gas having properties different from a surrounding atmosphere from the cover, and replaces the atmosphere on the surface of the wafer by the gas.

Abstract translation: 本发明提供一种能够用少量气体代替晶片表面的气氛的气氛置换装置。 该装置被配置为具有能够面对和覆盖要输送的晶片的盖，以及气体供给装置，其将与周围大气不同的性质的气体与盖接触，并且通过 加油站。