公开(公告)号：US09397757B2

公开(公告)日：2016-07-19

申请号：US14318529

申请日：2014-06-27

Applicant: SK HYNIX INC.

Inventor： In Chul Hwang ,  Il Hwan Cho ,  Ki Young Kim ,  Kyoung Mo Yang ,  Jae Joon Ahn ,  Chong Ho Cho

IPC: H04B10/80 ,  H04B10/40 ,  G02B6/42 ,  H05K1/18

CPC classification number: H04B10/801 ,  G02B6/42 ,  H01L2224/16145 ,  H01L2224/16225 ,  H04B10/40 ,  H05K1/181 ,  H05K2201/10121 ,  H05K2201/10515 ,  Y02P70/611

Abstract: A semiconductor package includes a package substrate, a first semiconductor substrate and a second semiconductor substrate stacked on the package substrate, and an optical transceiver that generates and receives an optical signal travelling between the package substrate and the second semiconductor substrate using an infrared (IR) ray that passes through the first semiconductor substrate.

Abstract translation: 半导体封装包括封装衬底，堆叠在封装衬底上的第一半导体衬底和第二半导体衬底，以及使用红外线（IR）产生并接收在封装衬底和第二半导体衬底之间行进的光信号的光收发器， 射线穿过第一半导体衬底。