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公开(公告)号:US11481272B2
公开(公告)日:2022-10-25
申请号:US16945068
申请日:2020-07-31
Applicant: SK hynix Inc.
Inventor: Ki Young Kim
Abstract: The present technology relates to an electronic device. A memory controller controls a memory device such that a life of the memory device is increased. The memory controller that controls the memory device includes a flash translation layer configured to generate a device health descriptor based on device information received from the memory device, and a bad block controller configured to generate a bad block table based on bad block information received from the memory device, and generate recycling information for recycling pages in bad blocks recorded in the bad block table based on the device health descriptor.
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公开(公告)号:US09184147B2
公开(公告)日:2015-11-10
申请号:US14305527
申请日:2014-06-16
Applicant: SK hynix Inc.
Inventor: Jin Ho Bae , Ki Young Kim , Jong Hyun Nam
IPC: H01L23/02 , H01L23/48 , H01L23/28 , H01L23/52 , H01L29/40 , H05K7/00 , H05K1/18 , H01L23/00 , H01L25/065 , H01L23/498
CPC classification number: H01L24/17 , H01L23/49816 , H01L24/09 , H01L24/16 , H01L24/18 , H01L24/20 , H01L24/29 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L2224/0401 , H01L2224/04105 , H01L2224/17104 , H01L2224/18 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/49113 , H01L2224/73265 , H01L2224/73267 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06562 , H01L2225/06586 , H01L2924/00014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
Abstract: A stacked semiconductor chip includes a main substrate supporting a semiconductor chip module, wherein the semiconductor module comprises at least two sub semiconductor chip modules each having a sub substrate in which a first semiconductor chip is embedded and at least two second semiconductor chips are stacked on the sub substrate.
Abstract translation: 叠层半导体芯片包括支撑半导体芯片模块的主衬底,其中半导体模块包括至少两个次半导体芯片模块,每个子半导体芯片模块具有嵌入第一半导体芯片的子衬底,并且至少两个第二半导体芯片堆叠在 副底物。
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公开(公告)号:US11995352B2
公开(公告)日:2024-05-28
申请号:US17746304
申请日:2022-05-17
Applicant: SK hynix Inc.
Inventor: Ki Young Kim
IPC: G06F3/06 , H04L67/1097
CPC classification number: G06F3/0659 , G06F3/0607 , G06F3/0658 , G06F3/0679 , H04L67/1097
Abstract: The embodiments of the present disclosure relate to a memory controller and operating method thereof. According to embodiments of the present disclosure, the memory controller may include a memory configured to store an activation candidate list including one or more nodes each indicating a logical address range that satisfies a preset activation candidate condition, and a processor configured to determine a target node based on activation parameters of logical address ranges indicated by respective nodes included in the activation candidate list, determine, as activation logical address ranges, one or more logical address ranges from the activation candidate list based on the target node, and transmit information indicating the activation logical address range to a host.
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公开(公告)号:US09786590B2
公开(公告)日:2017-10-10
申请号:US15070184
申请日:2016-03-15
Applicant: SK Hynix Inc.
Inventor: In Chul Hwang , Ki Young Kim , Myung Geun Park
CPC classification number: H01L23/4985 , H01L23/49838 , H01L23/49894 , H01L24/17 , H01L2224/17104 , H05K1/111 , H05K1/189 , H05K3/32 , H05K3/3436 , H05K2201/0281 , H05K2201/029 , H05K2201/10962 , Y02P70/613
Abstract: A semiconductor package may be provided. The semiconductor package may include a substrate formed with one or more connection pads. The semiconductor package may include a semiconductor device including at least one bump. The semiconductor package may include an anisotropic conductive fabric including conductive fibers and configured to electrically couple the at least one connection pad to the at least one bump.
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公开(公告)号:US09397757B2
公开(公告)日:2016-07-19
申请号:US14318529
申请日:2014-06-27
Applicant: SK HYNIX INC.
Inventor: In Chul Hwang , Il Hwan Cho , Ki Young Kim , Kyoung Mo Yang , Jae Joon Ahn , Chong Ho Cho
CPC classification number: H04B10/801 , G02B6/42 , H01L2224/16145 , H01L2224/16225 , H04B10/40 , H05K1/181 , H05K2201/10121 , H05K2201/10515 , Y02P70/611
Abstract: A semiconductor package includes a package substrate, a first semiconductor substrate and a second semiconductor substrate stacked on the package substrate, and an optical transceiver that generates and receives an optical signal travelling between the package substrate and the second semiconductor substrate using an infrared (IR) ray that passes through the first semiconductor substrate.
Abstract translation: 半导体封装包括封装衬底,堆叠在封装衬底上的第一半导体衬底和第二半导体衬底,以及使用红外线(IR)产生并接收在封装衬底和第二半导体衬底之间行进的光信号的光收发器, 射线穿过第一半导体衬底。
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公开(公告)号:US11901907B2
公开(公告)日:2024-02-13
申请号:US17521603
申请日:2021-11-08
Applicant: SK hynix Inc.
Inventor: Sang Eun Je , Ki Young Kim
CPC classification number: H03M1/002 , G06N3/065 , G11C13/003
Abstract: An electronic device includes analog-to-digital converters each configured to receive an analog input signal and output a digital output signal corresponding to the analog input signal, an analog input signal generator configured to generate analog input signals provided to each analog-to-digital converter based on input voltages and weight data, an input signal distribution information generator configured to generate input signal distribution information indicating a distribution of the analog input signals for each of the analog-to-digital converters, an analog-to-digital converter group classifier configured to classify the analog-to-digital converters into a plurality of first analog-to-digital converter groups based on the input signal distribution information, and an analog-to-digital converter input range optimizer configured to determine an input range of each first analog-to-digital converter group based on the input signal distribution information, and each analog-to-digital converter is configured to operate according to an input range of a corresponding first analog-to-digital converter groups.
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公开(公告)号:US11449449B2
公开(公告)日:2022-09-20
申请号:US16997256
申请日:2020-08-19
Applicant: SK hynix Inc.
Inventor: Ki Young Kim
IPC: G06F13/372 , G06F13/374 , G06F1/14 , G06F9/38 , G06F9/48
Abstract: A data processing apparatus includes a master device configured to transmit commands for destinations, a slave device including a plurality of command processing regions respectively corresponding to the destinations, and a controller configured to relay communication between the master device and the slave device. The controller assigns time stamp value to the commands as an initial value when the commands was received by the controller and increment the time stamp value every command arbitration cycle, selects a command having a largest time stamp value among the commands in a tournament manner by comparing commands having different destinations every command arbitration cycle, stores a command selection history of each comparison of commands, selects the command based on a command selection history corresponding to the compared commands when respective time stamp values of the compared commands are the same or substantially the same as each other.
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公开(公告)号:US09793235B2
公开(公告)日:2017-10-17
申请号:US15139072
申请日:2016-04-26
Applicant: SK hynix Inc.
Inventor: Ki Young Kim , In Chul Hwang
IPC: H01L23/48 , H01L23/00 , H01L23/498 , H01L23/31
CPC classification number: H01L24/17 , H01L23/3128 , H01L23/3135 , H01L23/3142 , H01L23/49811 , H01L23/49827 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L2224/0401 , H01L2224/05568 , H01L2224/13012 , H01L2224/13016 , H01L2224/13023 , H01L2224/13078 , H01L2224/13147 , H01L2224/136 , H01L2224/16105 , H01L2224/16227 , H01L2224/16235 , H01L2224/16237 , H01L2224/16238 , H01L2224/73204 , H01L2224/81193 , H01L2224/81801 , H01L2924/1434 , H01L2924/15311 , H01L2924/18161 , H01L2924/3512 , H01L2924/381 , H01L2924/3841 , H01L2924/00014
Abstract: A semiconductor package may be provided. The semiconductor package may include a substrate having a first surface over which bond fingers are arranged, the other surface facing away from the first surface and over which ball lands are arranged, and terminals which are respectively formed over the bond fingers. The semiconductor package may include a semiconductor chip disposed over the first surface of the substrate, and having an active surface facing the first surface and over which bonding pads are arranged. The semiconductor package may include bumps respectively formed over the bonding pads of the semiconductor chip, and including pillars and layers which are formed over first side surfaces of the pillars and are joined with the terminals of the substrate.
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公开(公告)号:US11507501B2
公开(公告)日:2022-11-22
申请号:US17384543
申请日:2021-07-23
Applicant: SK hynix Inc.
Inventor: Ki Young Kim
IPC: G06F12/02
Abstract: A memory system includes a memory device including memory blocks, each memory block including a memory cell capable of storing a multi-bit data item. The memory device includes a write booster region including at least one memory block among the plurality of memory blocks, the at least one memory block including a memory cell storing a single-bit data item. A controller is configured to assign a memory block in the write booster region to a host performance booster (HPB) region when the memory block is closed and transmit to a host an indication that the memory block is assigned to the HPB region.
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公开(公告)号:US11217544B2
公开(公告)日:2022-01-04
申请号:US17002422
申请日:2020-08-25
Applicant: SK hynix Inc.
Inventor: Jong Hyun Kim , Seung Hwan Kim , Hyun Chul Seo , Ki Young Kim
IPC: H01L23/00 , H01L25/065 , H01L23/528 , H01L23/532
Abstract: A semiconductor package includes: a package substrate; a first semiconductor chip disposed over the package substrate and having a center region and an edge region; and a package redistribution layer disposed over the first semiconductor chip, wherein the first semiconductor chip comprises: a lower structure; a redistribution conductive layer disposed over the lower structure and electrically connected to the lower structure, the redistribution conductive layer including a redistribution pad disposed in the center region; and a protective layer covering the lower structure and the redistribution conductive layer, and having an opening exposing the redistribution pad, wherein the package redistribution layer comprises: a package redistribution conductive layer connected to the redistribution pad and extending to the edge region, the package redistribution conductive layer including a package redistribution pad disposed in the edge region, and, wherein, in the edge region, the redistribution conductive layer is omitted.
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