公开(公告)号：US20240218251A1

公开(公告)日：2024-07-04

申请号：US18403539

申请日：2024-01-03

Applicant: SK enpulse Co., Ltd.

Inventor： Seung Chul HONG ,  Kangsik MYUNG ,  Deok Su HAN ,  Han Teo PARK ,  Yongsoo CHOI

IPC: C09K13/04 ,  A01N43/80 ,  A01N59/08 ,  B24B37/04 ,  C09K13/00 ,  H01L21/3105

CPC classification number: C09K13/04 ,  A01N43/80 ,  A01N59/08 ,  B24B37/044 ,  C09K13/00 ,  H01L21/31053

Abstract: A composition for semiconductor processing includes polishing particles, water, and a biocide. The biocide includes a first biocide and a second biocide, the first biocide includes a thiazolinone-based compound, and the second biocide includes a chloric acid-based compound.

公开(公告)号：US20230332017A1

公开(公告)日：2023-10-19

申请号：US18297260

申请日：2023-04-07

Applicant: SK enpulse Co., Ltd.

Inventor： Seung Chul HONG ,  Kangsik MYUNG ,  Han Teo PARK ,  Deok Su HAN ,  Yongsoo CHOI

IPC: H01L21/768 ,  C09G1/02

CPC classification number: C09G1/02 ,  H01L21/76819 ,  H01L21/7684 ,  H01L21/76898

Abstract: A composition for semiconductor processing includes abrasive particles, and a dishing control additive, comprising a first dishing control additive and a second dishing control additive. The first dishing control additive includes a compound having a betaine group and a salicylic group or a derivative thereof, and the second dishing control additive includes an azole-based compound. The first dishing control additive includes 0.07 parts by weight or more based on 100 parts by weight of the abrasive particles, and the second dishing control additive includes 0.13 parts by weight or less based on 100 parts by weight of the abrasive particles.