Abstract:
A semiconductor system includes a controller configured to apply a command address, a first chip selection signal, and a second chip selection signal, and a semiconductor device including a first rank and a second rank configured to calibrate each termination resistance, based on the command address, the first chip selection signal, and the second chip selection signal.
Abstract:
A repair system for a semiconductor apparatus includes a tester configured to generate memory repair data including a die identification information and repair addresses, and a command to perform a repair process; and a semiconductor apparatus including a plurality of dies configured to receive the memory repair data, wherein one of the dies corresponding to the die identification information performs a repair operation according to the repair addresses and the command.
Abstract:
A semiconductor system includes a controller configured to transmit a command address and a plurality of read strobe signals, and a semiconductor device including a first rank and a second rank that are configured to receive the command address and the plurality of read strobe signals and to perform a write operation and a read operation based on the command address. In the semiconductor device, the first rank is configured to calibrate a termination resistance value of the first rank to a target resistance value when a write operation for the first rank is performed. In the semiconductor device, the first rank is configured to calibrate the termination resistance value of the first rank to a dynamic resistance value based on the plurality of read strobe signals when a write operation for the second rank is performed.
Abstract:
A semiconductor circuit includes a test control unit configured to generate a driving activation signal and a sensing activation signal in response to a command and an address; a pad; a driver configured to drive the pad to a predetermined level in response to activation of the driving activation signal; and a sensing unit configured to compare a voltage level of the pad with a reference voltage in response to activation of the sensing activation signal, and output a sensing signal.
Abstract:
A semiconductor memory apparatus includes a plurality of cell arrays; and a use information storage block configured to determine whether a data write operation has already been performed for the plurality of cell arrays, and generate a plurality of control signals, wherein the semiconductor memory apparatus is configured to control a refresh operation for the plurality of cell arrays according to the plurality of control signals.
Abstract:
A fuse circuit includes an E-fuse array including a plurality of E-fuse elements configured to store fuse data; a latch block including a plurality of latch groups configured to latch the fuse data read from the E-fuse array; and a control block configured to output latch reset signals corresponding to the plurality of latch groups in response to an apparatus reset signal and a clock signal, wherein the control block sequentially enables the latch reset signals.