公开(公告)号：US09876042B2

公开(公告)日：2018-01-23

申请号：US14855160

申请日：2015-09-15

Applicant: SK hynix Inc.

Inventor： Kyung-Dong Yoo ,  Sun-Ha Hwang ,  Sung-Bo Hwang

IPC: H01L29/04 ,  H01L27/148 ,  H01L27/146

CPC classification number: H01L27/14614 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/1464 ,  H01L27/1469

Abstract: The present disclosure provides an image sensor. An image sensor may include: a transfer gate formed over a first substrate, and having a through-hole; a column-shaped epitaxial body having a first portion filled in the through-hole and a second portion formed over the transfer gate; a photoelectric conversion element formed in the second portion of the epitaxial body; and a floating diffusion region formed in the first substrate, and contacting the first portion of the epitaxial body.

公开(公告)号：US09853078B2

公开(公告)日：2017-12-26

申请号：US15280657

申请日：2016-09-29

Applicant: SK hynix Inc.

Inventor： Yun-Hui Yang ,  Sung-Bo Hwang ,  Young-Hun Choi

IPC: H01L21/3105 ,  H01L27/146

CPC classification number: H01L27/14632 ,  H01L21/31053 ,  H01L21/31056 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14636

Abstract: A wafer level curved image sensor may include a substrate having a central region, a peripheral region, and an edge region, the peripheral region being formed between the central region and the edge region, supporting patterns formed over the substrate, first fixed patterns formed between the supporting patterns, and an image sensing chip formed over the supporting patterns. The supporting patterns and the first fixed patterns, in combination, form a planar lower surface and a concavely-curved upper surface. The image sensing chip has a curved lower surface and a curved upper surface.