公开(公告)号：US09773831B1

公开(公告)日：2017-09-26

申请号：US15258006

申请日：2016-09-07

Applicant: SK hynix Inc.

Inventor： Yun-Hui Yang ,  Young-Hun Choi

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  H01L21/76898 ,  H01L23/481 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14689

Abstract: An image sensor having a lower device, an upper devise, and a TSV structure is provides. The lower device may include a lower substrate, a lower TSV pad, and a lower interlayer insulating layer. The lower TSV pad may be formed over the lower substrate. The lower interlayer insulating layer may cover the lower TSV pad. The upper device may include an upper substrate, an upper TSV pad, and an upper interlayer insulating layer. The upper TSV pad may be formed over the upper substrate. The upper interlayer insulating layer may cover the upper TSV pad. The TSV structure may vertically pass through the upper device and electrically connect the upper TSV pad to the lower TSV pad. The upper TSV pad may include an upper opening. The lower TSV pad may include a unit pad and a lower opening. The unit pad may be exposed through the upper opening and contacts the TSV structure in a top view.

公开(公告)号：US09853078B2

公开(公告)日：2017-12-26

申请号：US15280657

申请日：2016-09-29

Applicant: SK hynix Inc.

Inventor： Yun-Hui Yang ,  Sung-Bo Hwang ,  Young-Hun Choi

IPC: H01L21/3105 ,  H01L27/146

CPC classification number: H01L27/14632 ,  H01L21/31053 ,  H01L21/31056 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14636

Abstract: A wafer level curved image sensor may include a substrate having a central region, a peripheral region, and an edge region, the peripheral region being formed between the central region and the edge region, supporting patterns formed over the substrate, first fixed patterns formed between the supporting patterns, and an image sensing chip formed over the supporting patterns. The supporting patterns and the first fixed patterns, in combination, form a planar lower surface and a concavely-curved upper surface. The image sensing chip has a curved lower surface and a curved upper surface.