公开(公告)号：US20160043052A1

公开(公告)日：2016-02-11

申请号：US14824967

申请日：2015-08-12

Applicant: SOCIONEXT INC.

Inventor： Ian Juso DEDIC ,  Ghazanfer ALI

IPC: H01L23/00 ,  H01L23/12

CPC classification number: H01L24/17 ,  H01L23/12 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/552 ,  H01L24/14 ,  H01L2224/16225 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00

Abstract: A low-noise flip-chip package, comprising: a carrier substrate having first and second opposing main faces; and a flip-chip substrate connected in a face-down manner onto the first main face of the carrier substrate via a connection array, wherein: the flip-chip substrate comprises at least first and second circuitry portions spaced apart from one another; the flip-chip substrate comprises a substrate-contact boundary located between the first and second circuitry portions; and each of the first circuitry portion, the second circuitry portion and the substrate-contact boundary has its own separate signal-reference connection extending via a respective connection of the connection array through the carrier substrate to a respective electrical contact at the second main face of the carrier substrate for connection to a common signal-reference element in an external circuit.