公开(公告)号：US20160336372A1

公开(公告)日：2016-11-17

申请号：US15222755

申请日：2016-07-28

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Itaru OSHIYAMA ,  Takayuki ENOMOTO ,  Harumi IKEDA ,  Shinichiro IZAWA ,  Atsuhiko YAMAMOTO ,  Kazunobu OTA

IPC: H01L27/146

CPC classification number: H01L27/146 ,  H01L27/1461 ,  H01L27/14612 ,  H01L27/14614 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/1463 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14641 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14689

Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.

Abstract translation: 本技术涉及固态成像装置，固态成像装置的制造方法和电子装置，其可以提供具有进一步改善的特征的固态成像装置，例如减少的光学混色等。 此外，提供了使用其固态成像装置的电子装置。 根据具有基板和形成在基板上的多个光电转换器的固态成像装置，绝缘膜形成嵌入元件分离单元。 元件分离单元由具有固定电荷的绝缘膜构成，该绝缘膜形成为在从基板的光输入侧沿深度方向形成的槽部内的槽部的内壁面上涂布。

公开(公告)号：US20190206911A1

公开(公告)日：2019-07-04

申请号：US16295719

申请日：2019-03-07

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Itaru OSHIYAMA ,  Takayuki ENOMOTO ,  Harumi IKEDA ,  Shinichiro IZAWA ,  Atsuhiko YAMAMOTO ,  Kazunobu OTA

IPC: H01L27/146

CPC classification number: H01L27/1463 ,  H01L27/146 ,  H01L27/1461 ,  H01L27/14612 ,  H01L27/14614 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14641 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14689

Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.

公开(公告)号：US20190027520A1

公开(公告)日：2019-01-24

申请号：US16130666

申请日：2018-09-13

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Itaru OSHIYAMA ,  Takayuki ENOMOTO ,  Harumi IKEDA ,  Shinichiro IZAWA ,  Atsuhiko YAMAMOTO ,  Kazunobu OTA

IPC: H01L27/146

CPC classification number: H01L27/1463 ,  H01L27/146 ,  H01L27/1461 ,  H01L27/14612 ,  H01L27/14614 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14641 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14689

Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.

公开(公告)号：US20170170217A1

公开(公告)日：2017-06-15

申请号：US15435476

申请日：2017-02-17

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Itaru OSHIYAMA ,  Takayuki ENOMOTO ,  Harumi IKEDA ,  Shinichiro IZAWA ,  Atsuhiko YAMAMOTO ,  Kazunobu OTA

IPC: H01L27/146

CPC classification number: H01L27/146 ,  H01L27/1461 ,  H01L27/14612 ,  H01L27/14614 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/1463 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14641 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14689

Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.

公开(公告)号：US20160156862A1

公开(公告)日：2016-06-02

申请号：US14904779

申请日：2014-07-08

Applicant: SONY CORPORATION

Inventor： Kyohei YOSHIMURA ,  Atsushi MASAGAKI ,  Ikuo YOSHIHARA ,  Ryoji SUZUKI ,  Takashi MACHIDA ,  Shinichiro IZAWA

IPC: H04N5/374 ,  H04N5/355 ,  H04N5/378

CPC classification number: H04N5/374 ,  H04N5/35563 ,  H04N5/378

Abstract: The present disclosure relates to a solid-state image pickup device and an electronic apparatus capable of generating highly-accurate image pickup signals having a large dynamic range.Pixels each include a high-sensitivity pixel and a low-sensitivity pixel having a lower sensitivity than the high-sensitivity pixel. A control gate controls a potential of a photoelectric conversion device of the low-sensitivity pixel. The present disclosure is applicable to, for example, a CMOS image sensor that includes both the high-sensitivity pixel and the low-sensitivity pixel having a lower sensitivity than the high-sensitivity pixel and controls a potential of the photoelectric conversion device of the low-sensitivity pixel.

Abstract translation: 本公开涉及能够产生具有大动态范围的高精度摄像信号的固态图像拾取装置和电子装置。 每个像素包括具有比高灵敏度像素低的灵敏度的高灵敏度像素和低灵敏度像素。 控制栅极控制低灵敏度像素的光电转换装置的电位。 本公开可应用于例如包括具有比高灵敏度像素低的灵敏度的高灵敏度像素和低灵敏度像素的CMOS图像传感器，并且将光电转换器件的电位控制为低 敏感度像素。

公开(公告)号：US20170271385A1

公开(公告)日：2017-09-21

申请号：US15610345

申请日：2017-05-31

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Itaru OSHIYAMA ,  Takayuki ENOMOTO ,  Harumi IKEDA ,  Shinichiro IZAWA ,  Atsuhiko YAMAMOTO ,  Kazunobu OTA

IPC: H01L27/146

CPC classification number: H01L27/1463 ,  H01L27/146 ,  H01L27/1461 ,  H01L27/14612 ,  H01L27/14614 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14641 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14689

Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.

公开(公告)号：US20160211288A1

公开(公告)日：2016-07-21

申请号：US15084287

申请日：2016-03-29

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Itaru OSHIYAMA ,  Takayuki ENOMOTO ,  Harumi IKEDA ,  Shinichiro IZAWA ,  Atsuhiko YAMAMOTO ,  Kazunobu OTA

IPC: H01L27/146

CPC classification number: H01L27/146 ,  H01L27/1461 ,  H01L27/14612 ,  H01L27/14614 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/1463 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14641 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14689

Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate 12 and multiple photoelectric converters 40 that are formed on the substrate 12, an insulating film 21 forms an embedded element separating unit 19. The element separating unit 19 is configured of an insulating film 20 having a fixed charge that is formed so as to coat the inner wall face of a groove portion 30, within the groove portion 30 which is formed in the depth direction from the light input side of the substrate 12.

Abstract translation: 本技术涉及固态成像装置，固态成像装置的制造方法和电子装置，其可以提供具有进一步改善的特征的固态成像装置，例如减少的光学混色等。 此外，提供了使用其固态成像装置的电子装置。 根据具有形成在基板12上的基板12和多个光电转换器40的固态成像装置，绝缘膜21形成嵌入元件分离单元19.元件分离单元19由绝缘膜20构成，绝缘膜20具有 形成为在从基板12的光输入侧在深度方向形成的槽部30内形成为涂覆槽部30的内壁面的固定电荷。