公开(公告)号：US20160336372A1

公开(公告)日：2016-11-17

申请号：US15222755

申请日：2016-07-28

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Itaru OSHIYAMA ,  Takayuki ENOMOTO ,  Harumi IKEDA ,  Shinichiro IZAWA ,  Atsuhiko YAMAMOTO ,  Kazunobu OTA

IPC: H01L27/146

CPC classification number: H01L27/146 ,  H01L27/1461 ,  H01L27/14612 ,  H01L27/14614 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/1463 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14641 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14689

Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.

Abstract translation: 本技术涉及固态成像装置，固态成像装置的制造方法和电子装置，其可以提供具有进一步改善的特征的固态成像装置，例如减少的光学混色等。 此外，提供了使用其固态成像装置的电子装置。 根据具有基板和形成在基板上的多个光电转换器的固态成像装置，绝缘膜形成嵌入元件分离单元。 元件分离单元由具有固定电荷的绝缘膜构成，该绝缘膜形成为在从基板的光输入侧沿深度方向形成的槽部内的槽部的内壁面上涂布。

公开(公告)号：US20190027520A1

公开(公告)日：2019-01-24

申请号：US16130666

申请日：2018-09-13

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Itaru OSHIYAMA ,  Takayuki ENOMOTO ,  Harumi IKEDA ,  Shinichiro IZAWA ,  Atsuhiko YAMAMOTO ,  Kazunobu OTA

IPC: H01L27/146

CPC classification number: H01L27/1463 ,  H01L27/146 ,  H01L27/1461 ,  H01L27/14612 ,  H01L27/14614 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14641 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14689

Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.

公开(公告)号：US20180277587A1

公开(公告)日：2018-09-27

申请号：US15992479

申请日：2018-05-30

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Suguru SAITO ,  Kaoru KOIKE

IPC: H01L27/146

CPC classification number: H01L27/14645 ,  H01L27/14607 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/1464

Abstract: An image pickup device according to the present disclosure includes a first pixel and a second pixel each including a photodetection section and a light condensing section, the photodetection section including a photoelectric conversion element, the light condensing section condensing incident light toward the photodetection section, the first pixel and the second pixel being adjacent to each other and each having a step part on a photodetection surface of the photodetection section, in which at least a part of a wall surface of the step part is covered with a first light shielding section.

公开(公告)号：US20170170217A1

公开(公告)日：2017-06-15

申请号：US15435476

申请日：2017-02-17

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Itaru OSHIYAMA ,  Takayuki ENOMOTO ,  Harumi IKEDA ,  Shinichiro IZAWA ,  Atsuhiko YAMAMOTO ,  Kazunobu OTA

IPC: H01L27/146

CPC classification number: H01L27/146 ,  H01L27/1461 ,  H01L27/14612 ,  H01L27/14614 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/1463 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14641 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14689

Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.

公开(公告)号：US20160049439A1

公开(公告)日：2016-02-18

申请号：US14778738

申请日：2014-03-27

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Suguru SAITO ,  Kaoru KOIKE

IPC: H01L27/146

CPC classification number: H01L27/14645 ,  H01L27/14607 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/1464

Abstract: An image pickup device according to the present disclosure includes a first pixel and a second pixel each including a photodetection section and a light condensing section, the photodetection section including a photoelectric conversion element, the light condensing section condensing incident light toward the photodetection section, the first pixel and the second pixel being adjacent to each other and each having a step part on a photodetection surface of the photodetection section, in which at least a part of a wall surface of the step part is covered with a first light shielding section.

Abstract translation: 根据本公开的图像拾取装置包括第一像素和第二像素，每个像素和第二像素均包括光电检测部分和聚光部分，光电检测部分包括光电转换元件，聚光部分将入射光聚焦到光电检测部分， 第一像素和第二像素彼此相邻，并且每个具有在光电检测部分的光电检测表面上的台阶部分，其中台阶部分的壁表面的至少一部分被第一遮光部分覆盖。

公开(公告)号：US20170287976A1

公开(公告)日：2017-10-05

申请号：US15512246

申请日：2015-08-06

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Yasushi TATESHITA ,  Kazunobu OTA

IPC: H01L27/146

CPC classification number: H01L27/14692 ,  H01L27/14605 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14649 ,  H01L27/14685 ,  H01L27/14689 ,  H01L27/148 ,  H04N5/374

Abstract: Image quality is improved.In an image pickup element, an interval between adjacent light receiving elements on a light receiving surface is changed depending on a position on the light receiving surface. Further, the image pickup element is manufactured by a method of manufacturing the image pickup element including layering photodiodes by repeatedly performing a silicon epitaxial process and an ion injection process. Further, the image pickup element is manufactured by the method of manufacturing the image pickup element including changing an interval between the photodiodes adjacent on the light receiving surface of the image pickup element in each layer depending on a position on the light receiving surface in addition to the layering thereof.

公开(公告)号：US20170271385A1

公开(公告)日：2017-09-21

申请号：US15610345

申请日：2017-05-31

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Itaru OSHIYAMA ,  Takayuki ENOMOTO ,  Harumi IKEDA ,  Shinichiro IZAWA ,  Atsuhiko YAMAMOTO ,  Kazunobu OTA

IPC: H01L27/146

CPC classification number: H01L27/1463 ,  H01L27/146 ,  H01L27/1461 ,  H01L27/14612 ,  H01L27/14614 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14641 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14689

Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.

公开(公告)号：US20160211288A1

公开(公告)日：2016-07-21

申请号：US15084287

申请日：2016-03-29

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Itaru OSHIYAMA ,  Takayuki ENOMOTO ,  Harumi IKEDA ,  Shinichiro IZAWA ,  Atsuhiko YAMAMOTO ,  Kazunobu OTA

IPC: H01L27/146

CPC classification number: H01L27/146 ,  H01L27/1461 ,  H01L27/14612 ,  H01L27/14614 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/1463 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14641 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14689

Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate 12 and multiple photoelectric converters 40 that are formed on the substrate 12, an insulating film 21 forms an embedded element separating unit 19. The element separating unit 19 is configured of an insulating film 20 having a fixed charge that is formed so as to coat the inner wall face of a groove portion 30, within the groove portion 30 which is formed in the depth direction from the light input side of the substrate 12.

Abstract translation: 本技术涉及固态成像装置，固态成像装置的制造方法和电子装置，其可以提供具有进一步改善的特征的固态成像装置，例如减少的光学混色等。 此外，提供了使用其固态成像装置的电子装置。 根据具有形成在基板12上的基板12和多个光电转换器40的固态成像装置，绝缘膜21形成嵌入元件分离单元19.元件分离单元19由绝缘膜20构成，绝缘膜20具有 形成为在从基板12的光输入侧在深度方向形成的槽部30内形成为涂覆槽部30的内壁面的固定电荷。

公开(公告)号：US20190206911A1

公开(公告)日：2019-07-04

申请号：US16295719

申请日：2019-03-07

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Itaru OSHIYAMA ,  Takayuki ENOMOTO ,  Harumi IKEDA ,  Shinichiro IZAWA ,  Atsuhiko YAMAMOTO ,  Kazunobu OTA

IPC: H01L27/146

CPC classification number: H01L27/1463 ,  H01L27/146 ,  H01L27/1461 ,  H01L27/14612 ,  H01L27/14614 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14641 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14689

Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.

公开(公告)号：US20160351615A1

公开(公告)日：2016-12-01

申请号：US15234821

申请日：2016-08-11

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Suguru SAITO ,  Kaoru KOIKE

IPC: H01L27/146

CPC classification number: H01L27/14645 ,  H01L27/14607 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/1464

Abstract: An image pickup device according to the present disclosure includes a first pixel and a second pixel each including a photodetection section and a light condensing section, the photodetection section including a photoelectric conversion element, the light condensing section condensing incident light toward the photodetection section, the first pixel and the second pixel being adjacent to each other and each having a step part on a photodetection surface of the photodetection section, in which at least a part of a wall surface of the step part is covered with a first light shielding section.