公开(公告)号：US20190027518A1

公开(公告)日：2019-01-24

申请号：US16069304

申请日：2017-01-06

Applicant: SONY CORPORATION

Inventor： Satoe MIYATA ,  Itaru OSHIYAMA

IPC: H01L27/146

Abstract: The present technology relates to an image pickup device and an electronic apparatus that are configured to enhance characteristics. A solid-state image pickup device includes a photoelectric conversion section that is arranged on a semiconductor substrate and configured to photoelectrically convert an incident light, a moth-eye section that includes recesses and projections formed on a surface on a light incident side in the semiconductor substrate and has, when a cross section approximately parallel to a direction toward the photoelectric conversion section from the light incident side is viewed, a recessed portion protruding toward the side of the photoelectric conversion section, the recessed portion having a curvature or a polygonal shape, and a region that is arranged adjacent to and opposite to the photoelectric conversion section of the moth-eye section and has a refractive index different from a refractive index of the semiconductor substrate.

公开(公告)号：US20160336372A1

公开(公告)日：2016-11-17

申请号：US15222755

申请日：2016-07-28

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Itaru OSHIYAMA ,  Takayuki ENOMOTO ,  Harumi IKEDA ,  Shinichiro IZAWA ,  Atsuhiko YAMAMOTO ,  Kazunobu OTA

IPC: H01L27/146

CPC classification number: H01L27/146 ,  H01L27/1461 ,  H01L27/14612 ,  H01L27/14614 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/1463 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14641 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14689

Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.

Abstract translation: 本技术涉及固态成像装置，固态成像装置的制造方法和电子装置，其可以提供具有进一步改善的特征的固态成像装置，例如减少的光学混色等。 此外，提供了使用其固态成像装置的电子装置。 根据具有基板和形成在基板上的多个光电转换器的固态成像装置，绝缘膜形成嵌入元件分离单元。 元件分离单元由具有固定电荷的绝缘膜构成，该绝缘膜形成为在从基板的光输入侧沿深度方向形成的槽部内的槽部的内壁面上涂布。

公开(公告)号：US20190206911A1

公开(公告)日：2019-07-04

申请号：US16295719

申请日：2019-03-07

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Itaru OSHIYAMA ,  Takayuki ENOMOTO ,  Harumi IKEDA ,  Shinichiro IZAWA ,  Atsuhiko YAMAMOTO ,  Kazunobu OTA

IPC: H01L27/146

CPC classification number: H01L27/1463 ,  H01L27/146 ,  H01L27/1461 ,  H01L27/14612 ,  H01L27/14614 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14641 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14689

Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.

公开(公告)号：US20190189696A1

公开(公告)日：2019-06-20

申请号：US16301105

申请日：2017-05-02

Applicant: SONY CORPORATION

Inventor： Tetsuji YAMAGUCHI ,  Atsushi TODA ,  Itaru OSHIYAMA

IPC: H01L27/30 ,  H01L27/28 ,  G02B5/20

CPC classification number: H01L27/307 ,  G02B5/20 ,  G02B5/208 ,  G02B5/28 ,  H01L27/146 ,  H01L27/281 ,  H01L27/286 ,  H01L31/10 ,  H04N5/332 ,  H04N5/369 ,  H04N5/3745 ,  H04N5/378 ,  H04N9/07

Abstract: A solid-state imaging apparatus includes a pixel array part having a plurality of pixels are two-dimensionally arranged, in which each pixel has a first photoelectric conversion region formed above a semiconductor layer, a second photoelectric conversion region formed in the semiconductor layer, a first filter configured to transmit a light in a predetermined wavelength region corresponding to a color component, and a second filter having different transmission characteristics from the first filter, one photoelectric conversion region out of the first photoelectric conversion region and the second photoelectric conversion region photoelectrically converts a light in a visible light region, the other photoelectric conversion region photoelectrically converts a light in an infrared region, the first filter is formed above the first photoelectric conversion region, and the second filter has transmission characteristics of making wavelengths of light in an infrared region absorbed in the other photoelectric conversion region formed below the first filter the same.

公开(公告)号：US20170271385A1

公开(公告)日：2017-09-21

申请号：US15610345

申请日：2017-05-31

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Itaru OSHIYAMA ,  Takayuki ENOMOTO ,  Harumi IKEDA ,  Shinichiro IZAWA ,  Atsuhiko YAMAMOTO ,  Kazunobu OTA

IPC: H01L27/146

CPC classification number: H01L27/1463 ,  H01L27/146 ,  H01L27/1461 ,  H01L27/14612 ,  H01L27/14614 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14641 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14689

Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.

公开(公告)号：US20160211288A1

公开(公告)日：2016-07-21

申请号：US15084287

申请日：2016-03-29

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Itaru OSHIYAMA ,  Takayuki ENOMOTO ,  Harumi IKEDA ,  Shinichiro IZAWA ,  Atsuhiko YAMAMOTO ,  Kazunobu OTA

IPC: H01L27/146

CPC classification number: H01L27/146 ,  H01L27/1461 ,  H01L27/14612 ,  H01L27/14614 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/1463 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14641 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14689

Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate 12 and multiple photoelectric converters 40 that are formed on the substrate 12, an insulating film 21 forms an embedded element separating unit 19. The element separating unit 19 is configured of an insulating film 20 having a fixed charge that is formed so as to coat the inner wall face of a groove portion 30, within the groove portion 30 which is formed in the depth direction from the light input side of the substrate 12.

Abstract translation: 本技术涉及固态成像装置，固态成像装置的制造方法和电子装置，其可以提供具有进一步改善的特征的固态成像装置，例如减少的光学混色等。 此外，提供了使用其固态成像装置的电子装置。 根据具有形成在基板12上的基板12和多个光电转换器40的固态成像装置，绝缘膜21形成嵌入元件分离单元19.元件分离单元19由绝缘膜20构成，绝缘膜20具有 形成为在从基板12的光输入侧在深度方向形成的槽部30内形成为涂覆槽部30的内壁面的固定电荷。

公开(公告)号：US20210043687A1

公开(公告)日：2021-02-11

申请号：US17069610

申请日：2020-10-13

Applicant: SONY CORPORATION

Inventor： Tetsuji YAMAGUCHI ,  Atsushi TODA ,  Itaru OSHIYAMA

IPC: H01L27/30 ,  H01L27/146 ,  H01L27/28 ,  G02B5/20 ,  H04N5/33 ,  H01L31/10 ,  H04N9/07 ,  H04N5/369 ,  H04N9/04 ,  H04N5/378 ,  H04N5/3745

Abstract: A solid-state imaging apparatus includes a pixel array part in which a plurality of pixels are two-dimensionally arranged, in which each pixel has a first photoelectric conversion region formed above a semiconductor layer, a second photoelectric conversion region formed in the semiconductor layer, a first filter configured to transmit a light in a predetermined wavelength region corresponding to a color component, and a second filter having different transmission characteristics from the first filter, one photoelectric conversion region out of the first photoelectric conversion region and the second photoelectric conversion region photoelectrically converts a light in a visible light region, the other photoelectric conversion region photoelectrically converts a light in an infrared region, the first filter is formed above the first photoelectric conversion region, and the second filter has transmission characteristics of making wavelengths of lights in an infrared region absorbed in the other photoelectric conversion region formed below the first filter the same.

公开(公告)号：US20190252424A1

公开(公告)日：2019-08-15

申请号：US16391040

申请日：2019-04-22

Applicant: SONY CORPORATION

Inventor： Satoe MIYATA ,  Itaru OSHIYAMA

IPC: H01L27/146

CPC classification number: H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/1463 ,  H01L27/14636 ,  H01L27/14645

Abstract: The present technology relates to an image pickup device and an electronic apparatus that are configured to enhance characteristics. A solid-state image pickup device includes a photoelectric conversion section that is arranged on a semiconductor substrate and configured to photoelectrically convert an incident light, a moth-eye section that includes recesses and projections formed on a surface on a light incident side in the semiconductor substrate and has, when a cross section approximately parallel to a direction toward the photoelectric conversion section from the light incident side is viewed, a recessed portion protruding toward the side of the photoelectric conversion section, the recessed portion having a curvature or a polygonal shape, and a region that is arranged adjacent to and opposite to the photoelectric conversion section of the moth-eye section and has a refractive index different from a refractive index of the semiconductor substrate.

公开(公告)号：US20190027520A1

公开(公告)日：2019-01-24

申请号：US16130666

申请日：2018-09-13

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Itaru OSHIYAMA ,  Takayuki ENOMOTO ,  Harumi IKEDA ,  Shinichiro IZAWA ,  Atsuhiko YAMAMOTO ,  Kazunobu OTA

IPC: H01L27/146

CPC classification number: H01L27/1463 ,  H01L27/146 ,  H01L27/1461 ,  H01L27/14612 ,  H01L27/14614 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14641 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14689

Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.

公开(公告)号：US20170170217A1

公开(公告)日：2017-06-15

申请号：US15435476

申请日：2017-02-17

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Itaru OSHIYAMA ,  Takayuki ENOMOTO ,  Harumi IKEDA ,  Shinichiro IZAWA ,  Atsuhiko YAMAMOTO ,  Kazunobu OTA

IPC: H01L27/146

CPC classification number: H01L27/146 ,  H01L27/1461 ,  H01L27/14612 ,  H01L27/14614 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/1463 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14641 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14689

Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.