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公开(公告)号：US09673235B2
公开(公告)日：2017-06-06
申请号：US15084287
申请日：2016-03-29
Applicant: SONY CORPORATION
Inventor： Takeshi Yanagita , Itaru Oshiyama , Takayuki Enomoto , Harumi Ikeda , Shinichiro Izawa , Atsuhiko Yamamoto , Kazunobu Ota
IPC: H01L27/146
CPC classification number: H01L27/146 , H01L27/1461 , H01L27/14612 , H01L27/14614 , H01L27/1462 , H01L27/14621 , H01L27/14623 , H01L27/14625 , H01L27/14627 , H01L27/14629 , H01L27/1463 , H01L27/14636 , H01L27/1464 , H01L27/14641 , H01L27/14643 , H01L27/14645 , H01L27/14685 , H01L27/14689
Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate 12 and multiple photoelectric converters 40 that are formed on the substrate 12, an insulating film 21 forms an embedded element separating unit 19. The element separating unit 19 is configured of an insulating film 20 having a fixed charge that is formed so as to coat the inner wall face of a groove portion 30, within the groove portion 30 which is formed in the depth direction from the light input side of the substrate 12.
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公开(公告)号：US10602084B2
公开(公告)日：2020-03-24
申请号：US15741921
申请日：2016-07-01
Applicant: SONY CORPORATION
Inventor： Tomoo Mitsunaga , Hayato Wakabayashi , Kenichi Okumura , Yasunobu Hitomi , Daisuke Iso , Tomonori Masuno , Shinichiro Izawa , Kyoko Izuha , Kouichi Harada
Abstract: The present disclosure relates to an imaging apparatus comprising an image sensor that includes an imaging surface in which many pixels are arranged vertically and horizontally, a pixel control unit that controls the image sensor, selects a pixel corresponding to a sampling function among pixels configuring a block by applying the sampling function for each block acquired by partitioning the imaging surface of the image sensor into a plurality of blocks, and outputs a sampling signal based on a pixel value of the selected pixel, and a reduced image generating unit that generates a reduced image on the basis of the sampling signal for each block output from the image sensor.
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Patent Agency Ranking
公开(公告)号：US10418404B2
公开(公告)日：2019-09-17
申请号：US16130666
申请日：2018-09-13
Applicant: SONY CORPORATION
Inventor： Takeshi Yanagita , Itaru Oshiyama , Takayuki Enomoto , Harumi Ikeda , Shinichiro Izawa , Atsuhiko Yamamoto , Kazunobu Ota
IPC: H01L27/146
Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.
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公开(公告)号：US09923010B2
公开(公告)日：2018-03-20
申请号：US15435476
申请日：2017-02-17
Applicant: SONY CORPORATION
Inventor： Takeshi Yanagita , Itaru Oshiyama , Takayuki Enomoto , Harumi Ikeda , Shinichiro Izawa , Atsuhiko Yamamoto , Kazunobu Ota
IPC: H01L27/146
CPC classification number: H01L27/146 , H01L27/1461 , H01L27/14612 , H01L27/14614 , H01L27/1462 , H01L27/14621 , H01L27/14623 , H01L27/14625 , H01L27/14627 , H01L27/14629 , H01L27/1463 , H01L27/14636 , H01L27/1464 , H01L27/14641 , H01L27/14643 , H01L27/14645 , H01L27/14685 , H01L27/14689
Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.
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5.发明授权Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic device 有权固态成像装置，固态成像装置的制造方法和电子装置公开(公告)号：US09595557B2
公开(公告)日：2017-03-14
申请号：US15222755
申请日：2016-07-28
Applicant: SONY CORPORATION
Inventor： Takeshi Yanagita , Itaru Oshiyama , Takayuki Enomoto , Harumi Ikeda , Shinichiro Izawa , Atsuhiko Yamamoto , Kazunobu Ota
IPC: H01L27/146
CPC classification number: H01L27/146 , H01L27/1461 , H01L27/14612 , H01L27/14614 , H01L27/1462 , H01L27/14621 , H01L27/14623 , H01L27/14625 , H01L27/14627 , H01L27/14629 , H01L27/1463 , H01L27/14636 , H01L27/1464 , H01L27/14641 , H01L27/14643 , H01L27/14645 , H01L27/14685 , H01L27/14689
Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.
Abstract translation: 本技术涉及固态成像装置，固态成像装置的制造方法和电子装置，其可以提供具有进一步改善的特征的固态成像装置，例如减少的光学混色等。 此外，提供了使用其固态成像装置的电子装置。 根据具有基板和形成在基板上的多个光电转换器的固态成像装置，绝缘膜形成嵌入元件分离单元。 元件分离单元由具有固定电荷的绝缘膜构成，该绝缘膜形成为在从基板的光输入侧沿深度方向形成的槽部内的槽部的内壁面上涂布。
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公开(公告)号：US10128291B2
公开(公告)日：2018-11-13
申请号：US15610345
申请日：2017-05-31
Applicant: SONY CORPORATION
Inventor： Takeshi Yanagita , Itaru Oshiyama , Takayuki Enomoto , Harumi Ikeda , Shinichiro Izawa , Atsuhiko Yamamoto , Kazunobu Ota
IPC: H01L31/062 , H01L27/146
Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.
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公开(公告)号：US10096638B2
公开(公告)日：2018-10-09
申请号：US15610345
申请日：2017-05-31
Applicant: SONY CORPORATION
Inventor： Takeshi Yanagita , Itaru Oshiyama , Takayuki Enomoto , Harumi Ikeda , Shinichiro Izawa , Atsuhiko Yamamoto , Kazunobu Ota
IPC: H01L31/062 , H01L27/146
Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.
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