公开(公告)号：US20180108697A1

公开(公告)日：2018-04-19

申请号：US15567289

申请日：2016-07-15

Applicant: SONY CORPORATION

Inventor： Hiroyasu MATSUGAI ,  Hiroyuki ITOU ,  Suguru SAITO ,  Keiji OHSHIMA ,  Masanori IWASAKI ,  Toshihiko HAYASHI ,  Shuzo SATO ,  Nobutoshi FUJII ,  Hiroshi TAZAWA ,  Toshiaki SHIRAIWA ,  Minoru ISHIDA

IPC: H01L27/146 ,  G02B13/00 ,  B29D11/00

CPC classification number: H01L27/14627 ,  B29D11/00375 ,  G02B1/11 ,  G02B13/0085 ,  H01L27/14632 ,  H01L27/14685 ,  H01L27/14687

Abstract: A deformation of a stacked lens is suppressed. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.

公开(公告)号：US20160351615A1

公开(公告)日：2016-12-01

申请号：US15234821

申请日：2016-08-11

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Suguru SAITO ,  Kaoru KOIKE

IPC: H01L27/146

CPC classification number: H01L27/14645 ,  H01L27/14607 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/1464

Abstract: An image pickup device according to the present disclosure includes a first pixel and a second pixel each including a photodetection section and a light condensing section, the photodetection section including a photoelectric conversion element, the light condensing section condensing incident light toward the photodetection section, the first pixel and the second pixel being adjacent to each other and each having a step part on a photodetection surface of the photodetection section, in which at least a part of a wall surface of the step part is covered with a first light shielding section.

公开(公告)号：US20180277587A1

公开(公告)日：2018-09-27

申请号：US15992479

申请日：2018-05-30

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Suguru SAITO ,  Kaoru KOIKE

IPC: H01L27/146

CPC classification number: H01L27/14645 ,  H01L27/14607 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/1464

Abstract: An image pickup device according to the present disclosure includes a first pixel and a second pixel each including a photodetection section and a light condensing section, the photodetection section including a photoelectric conversion element, the light condensing section condensing incident light toward the photodetection section, the first pixel and the second pixel being adjacent to each other and each having a step part on a photodetection surface of the photodetection section, in which at least a part of a wall surface of the step part is covered with a first light shielding section.

公开(公告)号：US20160049439A1

公开(公告)日：2016-02-18

申请号：US14778738

申请日：2014-03-27

Applicant: SONY CORPORATION

Inventor： Takeshi YANAGITA ,  Suguru SAITO ,  Kaoru KOIKE

IPC: H01L27/146

CPC classification number: H01L27/14645 ,  H01L27/14607 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/1464

Abstract: An image pickup device according to the present disclosure includes a first pixel and a second pixel each including a photodetection section and a light condensing section, the photodetection section including a photoelectric conversion element, the light condensing section condensing incident light toward the photodetection section, the first pixel and the second pixel being adjacent to each other and each having a step part on a photodetection surface of the photodetection section, in which at least a part of a wall surface of the step part is covered with a first light shielding section.

Abstract translation: 根据本公开的图像拾取装置包括第一像素和第二像素，每个像素和第二像素均包括光电检测部分和聚光部分，光电检测部分包括光电转换元件，聚光部分将入射光聚焦到光电检测部分， 第一像素和第二像素彼此相邻，并且每个具有在光电检测部分的光电检测表面上的台阶部分，其中台阶部分的壁表面的至少一部分被第一遮光部分覆盖。

公开(公告)号：US20200006415A1

公开(公告)日：2020-01-02

申请号：US16564444

申请日：2019-09-09

Applicant: SONY CORPORATION

Inventor： Hiroyasu MATSUGAI ,  Hiroyuki ITOU ,  Suguru SAITO ,  Keiji OHSHIMA ,  Masanori IWASAKI ,  Toshihiko HAYASHI ,  Shuzo SATO ,  Nobutoshi FUJII ,  Hiroshi TAZAWA ,  Toshiaki SHIRAIWA ,  Minoru ISHIDA

IPC: H01L27/146 ,  B29D11/00 ,  G02B13/00

Abstract: A deformation of a stacked lens is suppressed.A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.