公开(公告)号：US20180108697A1

公开(公告)日：2018-04-19

申请号：US15567289

申请日：2016-07-15

Applicant: SONY CORPORATION

Inventor： Hiroyasu MATSUGAI ,  Hiroyuki ITOU ,  Suguru SAITO ,  Keiji OHSHIMA ,  Masanori IWASAKI ,  Toshihiko HAYASHI ,  Shuzo SATO ,  Nobutoshi FUJII ,  Hiroshi TAZAWA ,  Toshiaki SHIRAIWA ,  Minoru ISHIDA

IPC: H01L27/146 ,  G02B13/00 ,  B29D11/00

CPC classification number: H01L27/14627 ,  B29D11/00375 ,  G02B1/11 ,  G02B13/0085 ,  H01L27/14632 ,  H01L27/14685 ,  H01L27/14687

Abstract: A deformation of a stacked lens is suppressed. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.

公开(公告)号：US20190326344A1

公开(公告)日：2019-10-24

申请号：US16503062

申请日：2019-07-03

Applicant: SONY CORPORATION

Inventor： Satoru WAKIYAMA ,  Naoki JYO ,  Kan SHIMIZU ,  Toshihiko HAYASHI ,  Takuya NAKAMURA

IPC: H01L27/146 ,  H01L23/48 ,  H01L23/31 ,  H01L23/00

Abstract: There is provided semiconductor devices and methods of forming the same, the semiconductor devices including: a first semiconductor element having a first electrode; a second semiconductor element having a second electrode; a Sn-based micro-solder bump formed on the second electrode; and a concave bump pad including the first electrode opposite to the micro-solder bump, where the first electrode is connected to the second electrode via the micro-solder bump and the concave bump pad.

公开(公告)号：US20200006415A1

公开(公告)日：2020-01-02

申请号：US16564444

申请日：2019-09-09

Applicant: SONY CORPORATION

Inventor： Hiroyasu MATSUGAI ,  Hiroyuki ITOU ,  Suguru SAITO ,  Keiji OHSHIMA ,  Masanori IWASAKI ,  Toshihiko HAYASHI ,  Shuzo SATO ,  Nobutoshi FUJII ,  Hiroshi TAZAWA ,  Toshiaki SHIRAIWA ,  Minoru ISHIDA

IPC: H01L27/146 ,  B29D11/00 ,  G02B13/00

Abstract: A deformation of a stacked lens is suppressed.A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.

公开(公告)号：US20170053960A1

公开(公告)日：2017-02-23

申请号：US15118575

申请日：2015-04-15

Applicant: SONY CORPORATION

Inventor： Satoru WAKIYAMA ,  Naoki JYO ,  Kan SHIMIZU ,  Toshihiko HAYASHI ,  Takuya NAKAMURA

IPC: H01L27/146 ,  H01L23/48 ,  H01L23/00

Abstract: There is provided semiconductor devices and methods of forming the same, the semiconductor devices including: a first semiconductor element having a first electrode; a second semiconductor element having a second electrode; a Sn-based micro-solder bump formed on the second electrode; and a concave bump pad including the first electrode opposite to the micro-solder bump, where the first electrode is connected to the second electrode via the micro-solder bump and the concave bump pad.

Abstract translation: 提供了半导体器件及其形成方法，所述半导体器件包括：具有第一电极的第一半导体元件; 具有第二电极的第二半导体元件; 形成在所述第二电极上的基于Sn的微焊料凸块; 以及包括与微焊料凸块相对的第一电极的凹凸块，其中第一电极经由微焊料凸块和凹凸块焊接到第二电极。