SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS
    1.
    发明申请
    SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS 有权
    固态成像装置和成像装置

    公开(公告)号:US20130234220A1

    公开(公告)日:2013-09-12

    申请号:US13756124

    申请日:2013-01-31

    CPC classification number: H01L31/0232 H04N5/2254 H04N5/37457

    Abstract: An imaging device includes a basic cell having two or more the pixels that share floating diffusion. The imaging device also includes a transistor shared by the two or more pixels in the basic cell and arranged on the outside of the two or more pixels. The imaging device further includes a light receiving unit connected to the floating diffusion shared by the pixels in the basic cell through a transfer gate. In the imaging device, on-chip lenses are arranged substantially at regular intervals. Also, an optical waveguide is formed so that the position thereof in the surface of the solid-state imaging device is located at a position shifted from the center of the light receiving unit to the transistor and in the inside of the light receiving unit and the inside of the on-chip lens.

    Abstract translation: 成像装置包括具有两个或更多个共享浮动扩散的像素的基本单元。 成像装置还包括由基本单元中的两个或更多像素共享的并且布置在两个或更多个像素的外侧上的晶体管。 成像装置还包括光接收单元,其通过传送门连接到基本单元中的像素共享的浮动扩散。 在成像装置中,片上透镜基本上以规则的间隔布置。 此外,形成光波导,使得其在固态成像装置的表面中的位置位于从光接收单元的中心偏移到晶体管和光接收单元的内部的位置,并且 片内镜头内。

    IMAGING ELEMENT, ELECTRONIC DEVICE, AND INFORMATION PROCESSING DEVICE
    3.
    发明申请
    IMAGING ELEMENT, ELECTRONIC DEVICE, AND INFORMATION PROCESSING DEVICE 有权
    成像元件,电子设备和信息处理设备

    公开(公告)号:US20150171146A1

    公开(公告)日:2015-06-18

    申请号:US14415195

    申请日:2013-07-12

    Abstract: The present disclosure relates to an imaging element, an electronic device, and an information processing device capable of more easily providing a wider variety of photoelectric conversion outputs.An imaging element of the present disclosure includes: a photoelectric conversion element layer containing a photoelectric conversion element that photoelectrically converts incident light; a wiring layer formed in the photoelectric conversion element layer on the side opposite to a light entering plane of the incident light, and containing a wire for reading charges from the photoelectric conversion element; and a support substrate laminated on the photoelectric conversion element layer and the wiring layer, and containing another photoelectric conversion element. The present disclosure is applicable to an imaging element, an electronic device, and an information processing device.

    Abstract translation: 本公开涉及能够更容易地提供更多种类的光电转换输出的成像元件,电子设备和信息处理设备。 本公开的成像元件包括:光电转换元件层,包含光电转换入射光的光电转换元件; 在所述光电转换元件层的与入射光的入射面相反的一侧形成的布线层,并且包含用于从所述光电转换元件读取电荷的布线; 以及层叠在光电转换元件层和布线层上的支撑基板,并且包含另一光电转换元件。 本公开可应用于成像元件,电子设备和信息处理设备。

    Imaging element, electronic device, and information processing device

    公开(公告)号:US10784293B2

    公开(公告)日:2020-09-22

    申请号:US16131856

    申请日:2018-09-14

    Abstract: The present disclosure relates to an imaging element, an electronic device, and an information processing device capable of more easily providing a wider variety of photoelectric conversion outputs.An imaging element of the present disclosure includes: a photoelectric conversion element layer containing a photoelectric conversion element that photoelectrically converts incident light; a wiring layer formed in the photoelectric conversion element layer on the side opposite to a light entering plane of the incident light, and containing a wire for reading charges from the photoelectric conversion element; and a support substrate laminated on the photoelectric conversion element layer and the wiring layer, and containing another photoelectric conversion element. The present disclosure is applicable to an imaging element, an electronic device, and an information processing device.

    Imaging element, electronic device, and information processing device
    5.
    发明授权
    Imaging element, electronic device, and information processing device 有权
    成像元件,电子设备和信息处理设备

    公开(公告)号:US09577012B2

    公开(公告)日:2017-02-21

    申请号:US14415195

    申请日:2013-07-12

    Abstract: The present disclosure relates to an imaging element, an electronic device, and an information processing device capable of more easily providing a wider variety of photoelectric conversion outputs. An imaging element of the present disclosure includes: a photoelectric conversion element layer containing a photoelectric conversion element that photoelectrically converts incident light; a wiring layer formed in the photoelectric conversion element layer on the side opposite to a light entering plane of the incident light, and containing a wire for reading charges from the photoelectric conversion element; and a support substrate laminated on the photoelectric conversion element layer and the wiring layer, and containing another photoelectric conversion element. The present disclosure is applicable to an imaging element, an electronic device, and an information processing device.

    Abstract translation: 本公开涉及能够更容易地提供更多种类的光电转换输出的成像元件,电子设备和信息处理设备。 本公开的成像元件包括:光电转换元件层,包含光电转换入射光的光电转换元件; 在所述光电转换元件层的与入射光的入射面相反的一侧形成的布线层,并且包含用于从所述光电转换元件读取电荷的布线; 以及层叠在光电转换元件层和布线层上的支撑基板,并且包含另一光电转换元件。 本公开可应用于成像元件,电子设备和信息处理设备。

    Solid-State imaging device and imaging apparatus having offset optical waveguides
    6.
    发明授权
    Solid-State imaging device and imaging apparatus having offset optical waveguides 有权
    具有偏移光波导的固态成像装置和成像装置

    公开(公告)号:US08817164B2

    公开(公告)日:2014-08-26

    申请号:US13756124

    申请日:2013-01-31

    CPC classification number: H01L31/0232 H04N5/2254 H04N5/37457

    Abstract: An imaging device includes a basic cell having two or more the pixels that share floating diffusion. The imaging device also includes a transistor shared by the two or more pixels in the basic cell and arranged on the outside of the two or more pixels. The imaging device further includes a light receiving unit connected to the floating diffusion shared by the pixels in the basic cell through a transfer gate. In the imaging device, on-chip lenses are arranged substantially at regular intervals. Also, an optical waveguide is formed so that the position thereof in the surface of the solid-state imaging device is located at a position shifted from the center of the light receiving unit to the transistor and in the inside of the light receiving unit and the inside of the on-chip lens.

    Abstract translation: 成像装置包括具有两个或更多个共享浮动扩散的像素的基本单元。 成像装置还包括由基本单元中的两个或更多像素共享的并且布置在两个或更多个像素的外侧上的晶体管。 成像装置还包括光接收单元,其通过传送门连接到基本单元中的像素共享的浮动扩散。 在成像装置中,片上透镜基本上以规则的间隔布置。 此外,形成光波导,使得其在固态成像装置的表面中的位置位于从光接收单元的中心偏移到晶体管和光接收单元的内部的位置,并且 片内镜头内。

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