-
公开(公告)号:US11428714B2
公开(公告)日:2022-08-30
申请号:US16616608
申请日:2018-04-18
Applicant: SONY CORPORATION , SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Inventor: Atsushi Yamada , Kyohei Yoshimitsu , Hiroyuki Mita , Sachio Iida , Seiji Kobayashi , Toshiyuki Hiroi
Abstract: A sensor device according to an embodiment of the present technology includes a sensor head and a measurement unit. The sensor head includes a first probe and a second probe, the first probe including a first antenna section used for transmission, the second probe including a second antenna section used for reception, the second probe being situated at a specified distance from the first probe and facing the first probe. The measurement unit includes a signal generator that generates a measurement signal that includes information regarding characteristics of a propagation of an electromagnetic wave in a medium between the first and second antenna sections.
-
公开(公告)号:US12066461B2
公开(公告)日:2024-08-20
申请号:US17517366
申请日:2021-11-02
Inventor: Atsushi Yamada , Kyohei Yoshimitsu , Hiroyuki Mita , Sachio Iida , Seiji Kobayashi , Toshiyuki Hiroi
CPC classification number: G01R1/07307 , G01N22/04 , G01R1/06772
Abstract: A sensor device according to an embodiment of the present technology includes a sensor head and a measurement unit. The sensor head includes a first probe and a second probe, the first probe including a first antenna section used for transmission, the second probe including a second antenna section used for reception, the second probe being situated at a specified distance from the first probe and facing the first probe. The measurement unit includes a signal generator that generates a measurement signal that includes information regarding characteristics of a propagation of an electromagnetic wave in a medium between the first and second antenna sections.
-
公开(公告)号:US10281400B2
公开(公告)日:2019-05-07
申请号:US15741882
申请日:2016-05-09
Applicant: SONY CORPORATION
Inventor: Shuji Fujita , Kyohei Yoshimitsu , Seiji Yamada , Daisuke Yamaguchi , Yoshio Goto
IPC: C09K11/02 , C09K11/06 , G01N21/64 , G01N33/533 , C09B23/08
Abstract: A method for enhancing luminescence of a luminous material, a substance detection method, a substance detection apparatus, and a luminescence enhancer are provided. A method for enhancing luminescence of a luminous material, the method including: holding, in a luminescence detection unit, the luminous material and a white colloidal particle both contained in a liquid; and irradiating the luminescence detection unit with light, in which the luminescence detection unit has an inner diameter of 300 μm or less in an optical axis direction.
-
公开(公告)号:US11459537B2
公开(公告)日:2022-10-04
申请号:US16632111
申请日:2018-04-19
Applicant: Sony Corporation
Inventor: Ichiro Takemura , Daisuke Yamaguchi , Yoshio Goto , Kyohei Yoshimitsu
Abstract: A sensor device according to the present technology includes a stack sensor. The stack sensor includes a first sensor layer and a second sensor layer. The first sensor layer has, as a detection target, a first substrate in a culture solution, the first substrate being changed in accordance with a change in a state of a cell. The second sensor layer has, as a detection target, a second substrate in the culture solution and is provided on the first sensor layer, the second substrate being changed in accordance with the change in the state.
-
公开(公告)号:US11312942B2
公开(公告)日:2022-04-26
申请号:US16303987
申请日:2017-05-02
Applicant: SONY CORPORATION
Inventor: Shunichi Suwa , Kunihiko Nagamine , Masahiro Matsumoto , Daisuke Yamaguchi , Yoshio Goto , Kyohei Yoshimitsu
IPC: C12N5/09 , C07D403/04 , C07D225/02 , G01N33/543 , C07K17/00 , G01N33/50
Abstract: Provided is a material-fixing substrate that does not have to use copper as a catalyst because the substrate-bonding site includes a cyclic alkyne to form a covalent bond with a surface of the substrate, and therefore that can reduce damage to a cell, for example, in a case where a to-be-fixed material is the cell. The material-fixing substrate has a to-be-fixed material fixed thereon via a material-fixing agent. The material-fixing agent includes: a substrate-bonding site that forms a covalent bond with a surface of the substrate and includes at least a cyclic alkyne; a hydrophilic site that is bonded to the substrate-bonding site; a light-responsive site that is bonded to the hydrophilic site and changes the skeleton thereof by irradiation with light; and an attachment site to which the to-be-fixed material is attached.
-
-
-
-