公开(公告)号：US11008651B2

公开(公告)日：2021-05-18

申请号：US15478283

申请日：2017-04-04

Applicant: SPTS TECHNOLOGIES LIMITED

Inventor： Scott Haymore ,  Amit Rastogi ,  Rhonda Hyndman ,  Steve Burgess ,  Ian Moncrieff ,  Chris Kendal

IPC: C23C14/06 ,  C23C14/34 ,  C23C14/35 ,  C23C14/50 ,  C23C14/54 ,  H01J37/32 ,  H01J37/34

Abstract: A DC magnetron sputtering apparatus is for depositing a film on a substrate. The apparatus includes a chamber, a substrate support positioned within the chamber, a DC magnetron, and an electrical signal supply device for supplying an electrical bias signal that, in use, causes ions to bombard a substrate positioned on the substrate support. The substrate support includes a central region surrounded by an edge region, the central region being raised with respect to the edge region.