公开(公告)号：US20230238376A1

公开(公告)日：2023-07-27

申请号：US17649005

申请日：2022-01-26

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： GunHyuck Lee ,  SangHyun Son ,  Yujeong Jang ,  Hyeoneui Lee

IPC: H01L25/00 ,  H01L25/10 ,  H01L21/683 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L25/50 ,  H01L25/105 ,  H01L21/6835 ,  H01L21/568 ,  H01L21/4846 ,  H01L21/4853 ,  H01L2225/1041 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2221/68359

Abstract: A semiconductor device has a first semiconductor package including a substrate and an encapsulant deposited over the substrate. An adhesive tape is disposed on the encapsulant. A conductive via is formed by trench cutting through the adhesive tape and encapsulant to expose the substrate. A second semiconductor package is disposed over the adhesive tape opposite the first semiconductor package. The first semiconductor package and second semiconductor package are bonded together by the adhesive tape.

公开(公告)号：US12176335B2

公开(公告)日：2024-12-24

申请号：US17649005

申请日：2022-01-26

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： GunHyuck Lee ,  SangHyun Son ,  Yujeong Jang ,  Hyeoneui Lee

IPC: H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00 ,  H01L25/10

Abstract: A semiconductor device has a first semiconductor package including a substrate and an encapsulant deposited over the substrate. An adhesive tape is disposed on the encapsulant. A conductive via is formed by trench cutting through the adhesive tape and encapsulant to expose the substrate. A second semiconductor package is disposed over the adhesive tape opposite the first semiconductor package. The first semiconductor package and second semiconductor package are bonded together by the adhesive tape.