公开(公告)号：US12176335B2

公开(公告)日：2024-12-24

申请号：US17649005

申请日：2022-01-26

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： GunHyuck Lee ,  SangHyun Son ,  Yujeong Jang ,  Hyeoneui Lee

IPC: H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00 ,  H01L25/10

Abstract: A semiconductor device has a first semiconductor package including a substrate and an encapsulant deposited over the substrate. An adhesive tape is disposed on the encapsulant. A conductive via is formed by trench cutting through the adhesive tape and encapsulant to expose the substrate. A second semiconductor package is disposed over the adhesive tape opposite the first semiconductor package. The first semiconductor package and second semiconductor package are bonded together by the adhesive tape.

公开(公告)号：US20240063194A1

公开(公告)日：2024-02-22

申请号：US17820502

申请日：2022-08-17

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： GunHyuck Lee ,  Yujeong Jang ,  Gayeun Kim ,  YoungUk Noh

IPC: H01L25/16 ,  H01L21/56 ,  H01L25/00 ,  H01L25/065 ,  H01L23/552 ,  H01L23/498 ,  H01L23/538 ,  H01L23/48

CPC classification number: H01L25/162 ,  H01L21/56 ,  H01L25/50 ,  H01L25/0655 ,  H01L23/552 ,  H01L23/49833 ,  H01L23/5389 ,  H01L23/481 ,  H01L23/5383 ,  H01L24/16

Abstract: A semiconductor device has a first semiconductor package, second semiconductor package, and RDL. The first semiconductor package is disposed over a first surface of the RDL and the second semiconductor package is disposed over a second surface of the RDL opposite the first surface of the RDL. A carrier is initially disposed over the second surface of the RDL and removed after disposing the first semiconductor package over the first surface of the RDL. The first semiconductor package has a substrate, plurality of conductive pillars formed over the substrate, electrical component disposed over the substrate, and encapsulant deposited around the conductive pillars and electrical component. A shielding frame can be disposed around the electrical component. An antenna can be disposed over the first semiconductor package. A portion of the encapsulant is removed to planarize a surface of the encapsulant and expose the conductive pillars.

公开(公告)号：US20230238376A1

公开(公告)日：2023-07-27

申请号：US17649005

申请日：2022-01-26

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： GunHyuck Lee ,  SangHyun Son ,  Yujeong Jang ,  Hyeoneui Lee

IPC: H01L25/00 ,  H01L25/10 ,  H01L21/683 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L25/50 ,  H01L25/105 ,  H01L21/6835 ,  H01L21/568 ,  H01L21/4846 ,  H01L21/4853 ,  H01L2225/1041 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2221/68359

Abstract: A semiconductor device has a first semiconductor package including a substrate and an encapsulant deposited over the substrate. An adhesive tape is disposed on the encapsulant. A conductive via is formed by trench cutting through the adhesive tape and encapsulant to expose the substrate. A second semiconductor package is disposed over the adhesive tape opposite the first semiconductor package. The first semiconductor package and second semiconductor package are bonded together by the adhesive tape.