公开(公告)号：US20080075456A1

公开(公告)日：2008-03-27

申请号：US11687142

申请日：2007-03-16

Applicant: STEVEN WEBSTER ,  YU-CHIEH CHENG

Inventor： STEVEN WEBSTER ,  YU-CHIEH CHENG

IPC: H04N1/46

CPC classification number: H04N5/2252 ,  H01L2224/48091 ,  H04N5/2257 ,  H01L2924/00014

Abstract: A portable electronic device (400) includes a housing (402) and a digital camera module (200). The housing has at least one arcuate housing surface section (4024) at one end thereof. The digital camera module is received in the housing proximate the one end thereof. The digital camera module includes at least one contact portion. Each contact portion has an arcuate contact surface (6400), and each such contact portion tightly engages a corresponding arcuate housing surface section. Owing to the tight engagement of such arcuate surfaces, the top surface of the digital camera module may fit closely against the housing so as to more fully use the space in the portable electronic device. This would help satisfy the miniaturization requirement of the portable electronic device.

Abstract translation: 便携式电子设备（400）包括壳体（402）和数字照相机模块（200）。 壳体在其一端具有至少一个弧形的壳体表面部分（4024）。 数码相机模块被接收在靠近其一端的壳体中。 数字照相机模块包括至少一个接触部分。 每个接触部分具有弓形接触表面（6400），并且每个这样的接触部分紧密地接合相应的弧形壳体表面部分。 由于这种弧形表面的紧密接合，数字照相机模块的顶表面可以紧密地配合在壳体上，以便更充分地使用便携式电子设备中的空间。 这将有助于满足便携式电子设备的小型化要求。

公开(公告)号：US20090166833A1

公开(公告)日：2009-07-02

申请号：US12061914

申请日：2008-04-03

Applicant: STEVEN WEBSTER ,  YING-CHENG WU ,  MENG-LUNG YU ,  SHIH-MIN LO

Inventor： STEVEN WEBSTER ,  YING-CHENG WU ,  MENG-LUNG YU ,  SHIH-MIN LO

IPC: H01L23/02 ,  H01L21/00

CPC classification number: H01L25/50 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/107 ,  H05K1/0284 ,  H05K1/119 ,  H05K1/183 ,  H05K3/0052 ,  H05K2201/10545 ,  H05K2201/10734

Abstract: A semiconductor unit includes an interface plate, a supporting plate integrally formed with the interface plate, two chip packages positioned at opposite sides of the supporting plate, and leading traces running in the interface plate and the supporting plate, connected with the chip packages respectively.

Abstract translation: 半导体单元包括接口板，与接口板一体形成的支撑板，位于支撑板的相对侧的两个芯片封装，以及分别与芯片封装相连接的界面板和支撑板中的导线。

公开(公告)号：US20080100934A1

公开(公告)日：2008-05-01

申请号：US11682275

申请日：2007-03-05

Applicant: STEVEN WEBSTER ,  YING-CHENG WU ,  CHUN-HUNG LIN

Inventor： STEVEN WEBSTER ,  YING-CHENG WU ,  CHUN-HUNG LIN

IPC: G02B7/02

CPC classification number: G02B7/021 ,  G02B7/023 ,  G02B7/025 ,  H04N5/2257

Abstract: A digital camera module (100) includes a lens module (20) and a chip package (50) mounted in a light path of the lens module. The lens module includes a first lens assembly (21) and a second lens assembly (23). The first lens assembly includes a first fixture (211) having a through hole (212) defined therein and at least one lens (218) received in the through hole. The second assembly includes a second fixture (23) having a through hole (232) defined therein and at least one lens (238) attached therein. One of the first fixture and the second fixture has a slotted annular ring (213) protruding therefrom with an annular slot (214) defined therein. The other has a male annular ring (235) extending therefrom, and the slotted annular ring and the male annular ring matingly engage with each other to fix the first lens assembly and second assembly together.

Abstract translation: 数字照相机模块（100）包括安装在透镜模块的光路中的透镜模块（20）和芯片封装（50）。 透镜模块包括第一透镜组件（21）和第二透镜组件（23）。 第一透镜组件包括其中限定有通孔（212）的第一固定件（211）和容纳在通孔中的至少一个透镜（218）。 第二组件包括具有限定在其中的通孔（232）的第二固定件（23）和附接在其中的至少一个透镜（238）。 第一固定装置和第二固定装置之一具有从其中突出的开槽环形圈（213），其中限定有环形槽（214）。 另一个具有从其延伸的阳环形环（235），并且开槽的环形环和阳环形环彼此配合地接合以将第一透镜组件和第二组件固定在一起。

公开(公告)号：US20090322929A1

公开(公告)日：2009-12-31

申请号：US12329616

申请日：2008-12-07

Applicant: STEVEN WEBSTER

Inventor： STEVEN WEBSTER

IPC: H04N5/225

CPC classification number: H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/15184 ,  H01L2924/00014

Abstract: A camera module includes an image sensor package and a lens module. The image sensor package includes a base having an interior surface and an opposite exterior surface, an image sensor, a carrier plate and a plurality of passive elements. A cavity is defined on the interior surface of the base. The image sensor chip having a sensitive region is received in the cavity of the base and is electrically connected to the base. The carrier plate, comprising a light transparent area and an electrode area surrounding the transparent area, is formed on the base. A plurality of electrodes attached on the electrode area of the carrier plate and electrically connected to the base. The passive elements are mechanically and electrically attached on the electrode area of the carrier plate. The lens module is attached on the carrier plate for receiving the passive elements therein.

Abstract translation: 相机模块包括图像传感器封装和透镜模块。 图像传感器封装包括具有内表面和相对外表面的基底，图像传感器，载体板和多个无源元件。 在基座的内表面上限定空腔。 具有敏感区域的图像传感器芯片被接收在基座的空腔中并且电连接到基座。 包括透明区域的载体板和围绕透明区域的电极区域形成在基座上。 多个电极，其安装在承载板的电极区域上并电连接到基座。 无源元件机械地和电连接在载体板的电极区域上。 透镜模块附接在承载板上用于接收其中的无源元件。

公开(公告)号：US20090166837A1

公开(公告)日：2009-07-02

申请号：US12060106

申请日：2008-03-31

Applicant: STEVEN WEBSTER ,  YING-CHENG WU ,  CHAO-YUAN CHAN ,  SHIH-MIN LO

Inventor： STEVEN WEBSTER ,  YING-CHENG WU ,  CHAO-YUAN CHAN ,  SHIH-MIN LO

IPC: H01L23/488

CPC classification number: H01L25/105 ,  H01L23/13 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1052 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A combination includes a first chip package unit and a second chip package unit on which the first chip package unit is placed. Each of the first and second chip package units includes a substrate having a first surface, a second surface, a chip package electrically connected to the first surface, and a plurality of bonding pads formed on the first and second surfaces. The bonding pads on the first surface of the first chip package unit are respectively electrically connected with the bonding pads on the surface of the second chip package unit. The chip packages electrically connected to the first surfaces are enclosed by the substrates, and the bonding pads on the second surfaces are configured as interface terminals of the combination.

Abstract translation: 组合包括第一芯片封装单元和放置第一芯片封装单元的第二芯片封装单元。 第一和第二芯片封装单元中的每一个包括具有第一表面，第二表面，电连接到第一表面的芯片封装的衬底和形成在第一表面和第二表面上的多个焊盘。 第一芯片封装单元的第一表面上的焊盘分别与第二芯片封装单元的表面上的焊盘电连接。 电连接到第一表面的芯片封装被基板封闭，并且第二表面上的焊盘被配置为该组合的接口端子。

公开(公告)号：US20090153706A1

公开(公告)日：2009-06-18

申请号：US12100297

申请日：2008-04-09

Applicant: STEVEN WEBSTER ,  YING-CHENG WU ,  SHUO-WEI HUANG ,  SHIH-MIN LO

Inventor： STEVEN WEBSTER ,  YING-CHENG WU ,  SHUO-WEI HUANG ,  SHIH-MIN LO

IPC: H04N5/335

CPC classification number: H01L25/16 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0232 ,  H01L2224/48091 ,  H01L2224/8592 ,  H04N5/2257 ,  H01L2924/00014

Abstract: An imaging module package includes a substrate, an imaging sensor chip, a functional unit, a housing, and a lens module positioned in the housing. The substrate defines an upper chamber extending through a top surface thereof, and a lower chamber extending through a bottom surface thereof. The imaging sensor chip is positioned in the upper chamber and is electrically connected to the substrate. The functional unit is positioned in the lower chamber and is electrically connected to the substrate. The housing is mounted on the top surface of the substrate and is disposed above the imaging sensor chip.

Abstract translation: 成像模块封装包括基板，成像传感器芯片，功能单元，壳体和位于壳体中的透镜模块。 衬底限定了通过其顶表面延伸的上室，以及延伸穿过其底表面的下室。 成像传感器芯片定位在上部腔室中并且电连接到衬底。 功能单元位于下腔室中，并与电极连接。 壳体安装在基板的顶表面上并且设置在成像传感器芯片的上方。