Abstract:
An integrated memory circuit includes at least one memory cell formed by a single transistor whose gate (GR) has a lower face insulated from a channel region by an insulation layer containing a succession of potential wells, which are substantially arranged at a distance from the gate and from the channel region in a plane substantially parallel to the lower face of the gate. The potential wells are capable of containing an electric charge which is confined in the plane and can be controlled to move in the plane towards a first confinement region next to the source region or towards a second confinement region next to the drain region so as to define two memory states for the cell.
Abstract:
The source, drain and channel regions are produced in a silicon layer completely isolated vertically from a carrier substrate by an insulating layer, and are bounded laterally by a lateral isolation region of the shallow trench type.
Abstract:
An integrated memory location structure includes an isolated semiconductor layer between the source region and the drain region of a transistor, and between the channel region and the control gate of the transistor. The isolated semiconductor layer includes two potential well zones separated by a potential barrier zone under the control gate of the transistor. A write circuit biases the memory location structure to confine charge carriers selectively in one of the two potential well zones. A read circuit biases the memory location structure to measure the drain current of the transistor and determine therefrom the stored logic state imposed by the position of the charges in one of the potential well zones.