公开(公告)号：US20150357294A1

公开(公告)日：2015-12-10

申请号：US14815527

申请日：2015-07-31

Applicant: STMicroeletronics S.R.L.

Inventor： Federico Giovanni Ziglioli ,  Alberto Pagani

IPC: H01L23/64 ,  H01L21/441 ,  H01L21/768 ,  H01L49/02

CPC classification number: H01L23/642 ,  H01L21/441 ,  H01L21/50 ,  H01L21/561 ,  H01L21/768 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49575 ,  H01L23/49805 ,  H01L23/49822 ,  H01L23/5385 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L25/105 ,  H01L28/40 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/07802 ,  H01L2924/00

Abstract: A packaged semiconductor device includes a communication pad formed in a side surface, which is operatively coupled to a communication circuit so as to enable the establishing of a wireless communication channel to an adjacently positioned packaged semiconductor device. The communication pad may be formed upon cutting a block including the packaged semiconductor device and an appropriately positioned and dimensioned conductor.

Abstract translation: 封装的半导体器件包括形成在侧表面上的通信焊盘，其可操作地耦合到通信电路，以便能够建立到相邻定位的封装半导体器件的无线通信信道。 可以在切割包括封装的半导体器件的块和适当定位和尺寸的导体时形成通信焊盘。

公开(公告)号：US20140182394A1

公开(公告)日：2014-07-03

申请号：US14108688

申请日：2013-12-17

Applicant: STMICROELETRONICS S.R.L.

Inventor： Alberto Pagani ,  Federico Giovanni Ziglioli ,  Bruno Murari

IPC: G01L1/18 ,  G01B7/16

CPC classification number: G01L1/18 ,  G01B7/18 ,  G01L1/26 ,  G01M5/0041 ,  G01M5/0083

Abstract: The integrated electronic device is for detecting a local parameter related to a force experienced in a predetermined direction within a solid structure. The device includes a semiconductor substrate having a substantially planar region that defines a plane substantially perpendicular to the predetermined direction. At least one sensor detects the local parameter at least in the predetermined direction with a piezo-resistive effect. At least one substantially planar face is arranged in a portion of the integrated electronic device, the face belonging to a inclined plane by a predetermined angle relative to the plane perpendicular to the predetermined direction, which plane is defined by the substantially planar region of the substrate. The predetermined angle is defined such as to reduce forces acting in directions other than the predetermined direction at the portion of the device around the at least one sensor.

Abstract translation: 集成电子装置用于检测与固体结构内的预定方向上经受的力有关的局部参数。 该器件包括具有限定基本上垂直于预定方向的平面的基本平坦的区域的半导体衬底。 至少一个传感器至少在预定方向上以压阻效应来检测局部参数。 至少一个基本上平坦的面布置在集成电子设备的一部分中，该面部属于倾斜平面，相对于垂直于该预定方向的平面成预定角度，该平面由基板的基本平坦的区域限定 。 预定角度被限定为在围绕该至少一个传感器的装置的部分处减小作用于除了预定方向以外的方向的力。

公开(公告)号：US08978483B2

公开(公告)日：2015-03-17

申请号：US14108688

申请日：2013-12-17

Applicant: STMicroeletronics S.R.L.

Inventor： Alberto Pagani ,  Federico Giovanni Ziglioli ,  Bruno Murari

IPC: G01L1/22 ,  G01L1/18 ,  G01M5/00 ,  G01L1/26 ,  G01B7/16

CPC classification number: G01L1/18 ,  G01B7/18 ,  G01L1/26 ,  G01M5/0041 ,  G01M5/0083

Abstract: The integrated electronic device is for detecting a local parameter related to a force experienced in a predetermined direction within a solid structure. The device includes a semiconductor substrate having a substantially planar region that defines a plane substantially perpendicular to the predetermined direction. At least one sensor detects the local parameter at least in the predetermined direction with a piezo-resistive effect. At least one substantially planar face is arranged in a portion of the integrated electronic device, the face belonging to a inclined plane by a predetermined angle relative to the plane perpendicular to the predetermined direction, which plane is defined by the substantially planar region of the substrate. The predetermined angle is defined such as to reduce forces acting in directions other than the predetermined direction at the portion of the device around the at least one sensor.

Abstract translation: 集成电子装置用于检测与固体结构内的预定方向上经受的力有关的局部参数。 该器件包括具有限定基本上垂直于预定方向的平面的基本平坦的区域的半导体衬底。 至少一个传感器至少在预定方向上以压阻效应来检测局部参数。 至少一个基本上平坦的面布置在集成电子设备的一部分中，该面部属于倾斜平面，相对于垂直于该预定方向的平面成预定角度，该平面由基板的基本平坦的区域限定 。 预定角度被限定为在围绕该至少一个传感器的装置的部分处减小作用于除了预定方向以外的方向的力。