公开(公告)号：US20180190575A1

公开(公告)日：2018-07-05

申请号：US15399536

申请日：2017-01-05

Applicant: STMicroelectronics, Inc.

Inventor： Rennier Rodriguez ,  Raymond Albert Narvadez ,  Ernesto Antilano, JR.

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H05K1/11

CPC classification number: H01L23/49555 ,  H01L21/4842 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83005 ,  H01L2224/85005 ,  H01L2924/1815 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The present disclosure is directed to a leadframe package having leads with protrusions on an underside of the leadframe. The protrusions come in various shapes and sizes. The protrusions extend from a body of encapsulant around the leadframe to couple to surface contacts on a substrate. The protrusions have a recess that is filled with encapsulant. Additionally, the protrusions may be part of the lead or may be a conductive layer on the lead. In some embodiments a die pad of the leadframe supporting a semiconductor die also has a protrusion on the underside of the leadframe. The protrusion on the die pad has a recess that houses an adhesive and at least part of the semiconductor die. The die pad with a protrusion may include anchor locks at the ends of the die pad to couple to the encapsulant.

公开(公告)号：US20180016133A1

公开(公告)日：2018-01-18

申请号：US15212107

申请日：2016-07-15

Applicant: STMicroelectronics, Inc.

Inventor： Aaron Cadag ,  Frederick Arellano ,  Ernesto Antilano, JR.

IPC: B81B7/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/495 ,  H01L23/00 ,  B81C1/00

Abstract: A MEMS pressure sensor packaged with a molding compound. The MEMS pressure sensor features a lead frame, a MEMS semiconductor die, a second semiconductor die, multiple pluralities of bonding wires, and a molding compound. The MEMS semiconductor die has an internal chamber, a sensing component, and apertures. The MEMS semiconductor die and the apertures are exposed to an ambient atmosphere. A method is desired to form a MEMS pressure sensor package that reduces defects caused by mold flashing and die cracking. Fabrication of the MEMS pressure sensor package comprises placing a lead frame on a lead frame tape; placing a MEMS semiconductor die adjacent to the lead frame and on the lead frame tape with the apertures facing the tape and being sealed thereby; attaching a second semiconductor die to the MEMS semiconductor die; attaching pluralities of bonding wires to form electrical connections between the MEMS semiconductor die, the second semiconductor die, and the lead frame; and forming a molding compound.