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公开(公告)号：US20230110259A1
公开(公告)日：2023-04-13
申请号：US18079704
申请日：2022-12-12
发明人： Kevin FORMOSA , Marco DEL SARTO
摘要： A first electronic component, such as a sensor having opposed first and second surfaces and a first thickness, is arranged on a support member with the second surface facing towards the support member. A second electronic component, such as an integrated circuit mounted on a substrate and having a second thickness less than the first thickness, is arranged on the support member with a substrate surface opposed the second electronic component facing towards the support member. A package molding material is molded onto the support member to encapsulate the second electronic component while leaving exposed the first surface of the first electronic component. The support member is then removed to expose the second surface of the first electronic component and the substrate surface of the substrate.
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公开(公告)号：US20170006368A1
公开(公告)日：2017-01-05
申请号：US15143207
申请日：2016-04-29
CPC分类号： H04R1/04 , B81B7/0061 , B81B7/008 , B81B2201/0257 , B81B2203/0127 , B81B2207/012 , B81B2207/07 , H04R1/06 , H04R19/005 , H04R19/04 , H04R31/00 , H04R31/006 , H04R2201/003 , H04R2499/11
摘要： A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.
摘要翻译： 微机电麦克风包括：基板; 传感器芯片，集成了微机电电声换能器; 以及可操作地耦合到所述传感器芯片的控制芯片。 在一个实施例中，传感器芯片和控制芯片被结合到基板，并且传感器芯片覆盖控制芯片或者至少部分覆盖在控制芯片上。 在另一个实施例中，传感器被结合到基板上，并且屏障位于传感器芯片的至少一部分周围。
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公开(公告)号：US20200307994A1
公开(公告)日：2020-10-01
申请号：US16834042
申请日：2020-03-30
发明人： Kevin FORMOSA , Marco DEL SARTO
摘要： A first electronic component, such as a sensor having opposed first and second surfaces and a first thickness, is arranged on a support member with the second surface facing towards the support member. A second electronic component, such as an integrated circuit mounted on a substrate and having a second thickness less than the first thickness, is arranged on the support member with a substrate surface opposed the second electronic component facing towards the support member. A package molding material is molded onto the support member to encapsulate the second electronic component while leaving exposed the first surface of the first electronic component. The support member is then removed to expose the second surface of the first electronic component and the substrate surface of the substrate.
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公开(公告)号：US20200307991A1
公开(公告)日：2020-10-01
申请号：US16831302
申请日：2020-03-26
发明人： Kevin FORMOSA , Eftal SARIBAS
摘要： An electronic integrated circuit (IC) component is mounted to a substrate. A cap member is applied onto the substrate and covers the electronic IC component. The cap member includes an outer wall defining an opening and an inner wall surrounding the electronic IC component. The inner wall extends from a proximal end at the substrate towards a distal end facing the opening in the outer wall to provide a reception chamber for the electronic IC component and a peripheral chamber between the inner wall and the outer wall of the cap member. An encapsulant material is provided in the reception chamber to seal the electronic IC component without being present in the peripheral chamber.
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