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公开(公告)号：US20210098355A1
公开(公告)日：2021-04-01
申请号：US16586643
申请日：2019-09-27
Applicant: STMICROELECTRONICS S.r.l. , STMICROELECTRONICS (MALTA) LTD
Inventor： Marco DEL SARTO , Alex GRITTI , Pierpaolo RECANATINI , Michael BORG
IPC: H01L23/498 , H01L23/31
Abstract: The present disclosure is directed to a semiconductor package including a substrate having a lower surface with a plurality of slot structures. The plurality of slot structures are multi-layer structures that encourage the formation of solder joints. The semiconductor package is desirable for high reliability applications in which each solder joint termination should be checked by visual systems to ensure a proper electrical connection has been made.
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公开(公告)号：US20200307994A1
公开(公告)日：2020-10-01
申请号：US16834042
申请日：2020-03-30
Applicant: STMicroelectronics (Malta) Ltd , STMicroelectronics S.r.l.
Inventor： Kevin FORMOSA , Marco DEL SARTO
Abstract: A first electronic component, such as a sensor having opposed first and second surfaces and a first thickness, is arranged on a support member with the second surface facing towards the support member. A second electronic component, such as an integrated circuit mounted on a substrate and having a second thickness less than the first thickness, is arranged on the support member with a substrate surface opposed the second electronic component facing towards the support member. A package molding material is molded onto the support member to encapsulate the second electronic component while leaving exposed the first surface of the first electronic component. The support member is then removed to expose the second surface of the first electronic component and the substrate surface of the substrate.
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公开(公告)号：US20230110259A1
公开(公告)日：2023-04-13
申请号：US18079704
申请日：2022-12-12
Applicant: STMicroelectronics (MALTA) Ltd , STMicroelectronics S.r.l.
Inventor： Kevin FORMOSA , Marco DEL SARTO
Abstract: A first electronic component, such as a sensor having opposed first and second surfaces and a first thickness, is arranged on a support member with the second surface facing towards the support member. A second electronic component, such as an integrated circuit mounted on a substrate and having a second thickness less than the first thickness, is arranged on the support member with a substrate surface opposed the second electronic component facing towards the support member. A package molding material is molded onto the support member to encapsulate the second electronic component while leaving exposed the first surface of the first electronic component. The support member is then removed to expose the second surface of the first electronic component and the substrate surface of the substrate.
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公开(公告)号：US20230171911A1
公开(公告)日：2023-06-01
申请号：US18056081
申请日：2022-11-16
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Luca MAGGI , Marco DEL SARTO , Alex GRITTI , Amedeo MAIERNA
IPC: H05K7/14
CPC classification number: H05K7/1427
Abstract: The electronic module has a three-dimensional frame, a printed circuit board and a plurality of electronic devices. The printed circuit board is fixed to the three-dimensional frame and has a plurality of support portions which extend transversely to each other in space. The electronic devices are fixed to the printed circuit board and are operatively coupled to each other. The electronic devices are arranged on at least one support portion of the printed circuit board.
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5.发明公开公开(公告)号：US20230389426A1
公开(公告)日：2023-11-30
申请号：US18318612
申请日：2023-05-16
Applicant: STMicroelectronics S.r.l.
Inventor： Paolo FERRARI , Flavio Francesco VILLA , Marco DEL SARTO
Abstract: MEMS thermoelectric generator comprising: a thermoelectric cell including one or more thermoelectric elements partially extending on a cavity of the thermoelectric cell; a thermoplastic layer extending on the thermoelectric cell and having a top surface and a bottom surface opposite to each other along a first axis, the bottom surface facing the thermoelectric cell and the thermoplastic layer being of thermally insulating material and configured to be processed through laser direct structuring, LDS, technique; a heat sink configured to exchange heat with the thermoelectric cell interposed, along the first axis, between the heat sink and the thermoplastic layer; and a thermal via of metal material, extending through the thermoplastic layer from the top surface to the bottom surface so that it is superimposed, along the first axis, on the cavity, wherein the thermoelectric cell may exchange heat with a thermal source through the thermal via.
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Patent Agency Ranking
公开(公告)号：US20220185661A1
公开(公告)日：2022-06-16
申请号：US17684317
申请日：2022-03-01
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri DUQI , Marco DEL SARTO , Lorenzo BALDO
Abstract: A MEMS device formed by a substrate, having a surface; a MEMS structure arranged on the surface; a first coating region having a first Young's modulus, surrounding the MEMS structure at the top and at the sides and in contact with the surface of the substrate; and a second coating region having a second Young's modulus, surrounding the first coating region at the top and at the sides and in contact with the surface of the substrate. The first Young's modulus is higher than the second Young's modulus.
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7.发明申请公开(公告)号：US20190210868A1
公开(公告)日：2019-07-11
申请号：US15866380
申请日：2018-01-09
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri DUQI , Lorenzo BALDO , Marco DEL SARTO , Mikel AZPEITIA URQUIA
Abstract: A micro-electro-mechanical device, comprising a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region facing the first buried cavity; a second cavity facing the first buried cavity; a decoupling trench extending from the monolithic body and separating the sensitive region from a peripheral portion of the monolithic body; a cap die, forming an ASIC, bonded to and facing the first face of the monolithic body; and a first gap between the cap die and the monolithic body. The device also comprises at least one spacer element between the monolithic body and the cap die; at least one stopper element between the monolithic body and the cap die; and a second gap between the stopper element and one between the monolithic body and the cap die. The second gap is smaller than the first gap.
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公开(公告)号：US20240230596A9
公开(公告)日：2024-07-11
申请号：US18489737
申请日：2023-10-18
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Domenico GIUSTI , Marco DEL SARTO , Fabio QUAGLIA , Enri DUQI
CPC classification number: G01N29/04 , G01N29/2406 , G01N29/2437 , G01N2291/0231 , G01N2291/0289 , G01N2291/106
Abstract: An integrated electronic system is provided with a package formed by a support base and a coating region arranged on the support base and having at least a first system die, including semiconductor material, coupled to the support base and arranged in the coating region. The integrated electronic system also has, within the package, a monitoring system configured to determine the onset of defects within the coating region, through the emission of acoustic detection waves and the acquisition of corresponding received acoustic waves, whose characteristics are affected by, and therefore are indicative of, the aforementioned defects.
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公开(公告)号：US20240133843A1
公开(公告)日：2024-04-25
申请号：US18489737
申请日：2023-10-17
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Domenico GIUSTI , Marco DEL SARTO , Fabio QUAGLIA , Enri DUQI
CPC classification number: G01N29/04 , G01N29/2406 , G01N29/2437 , G01N2291/0231 , G01N2291/0289 , G01N2291/106
Abstract: An integrated electronic system is provided with a package formed by a support base and a coating region arranged on the support base and having at least a first system die, including semiconductor material, coupled to the support base and arranged in the coating region. The integrated electronic system also has, within the package, a monitoring system configured to determine the onset of defects within the coating region, through the emission of acoustic detection waves and the acquisition of corresponding received acoustic waves, whose characteristics are affected by, and therefore are indicative of, the aforementioned defects.
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10.发明申请公开(公告)号：US20220099957A1
公开(公告)日：2022-03-31
申请号：US17480634
申请日：2021-09-21
Applicant: STMicroelectronics S.r.l.
Inventor： Marco DEL SARTO , Alex GRITTI , Amedeo MAIERNA , Luca MAGGI
Abstract: An electronic module includes a first die of semiconductor material including a first reflector, a second die of semiconductor material including a second reflector, and a frame including a first supporting portion and a second supporting portion parallel to one another. The first and second dies are carried, respectively, by the first and second supporting portions and are respectively arranged so that the first reflector faces the second supporting portion and the second reflector faces the first supporting portion. An incoming light beam impinges upon the first reflector and is reflected on the second reflector so as to be supplied at output from the electronic module.
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