-
1.
公开(公告)号:US20220238485A1
公开(公告)日:2022-07-28
申请号:US17580480
申请日:2022-01-20
Applicant: STMICROELECTRONICS S.r.l.
Inventor: Dario PACI , Silvia ADORNO , Marco DEL SARTO , Fabrizio CERINI , Alex GRITTI
IPC: H01L25/065 , H01L23/64 , H01L23/00 , H01L23/538
Abstract: A packaged electronic system having a support formed by an insulating organic substrate housing a buried conductive region that is floating. A first die is fixed to the support and carries, on a first main surface, a first die contact region capacitively coupled to a first portion of the buried conductive region. A second die is fixed to the support and carries, on a first main surface, a second die contact region capacitively coupled to a second portion of the buried conductive region. A packaging mass encloses the first die, the second die, the first die contact region, the second die contact region, and, at least partially, the support.
-
2.
公开(公告)号:US20200236470A1
公开(公告)日:2020-07-23
申请号:US16749579
申请日:2020-01-22
Applicant: STMICROELECTRONICS S.r.l.
Inventor: Fabrizio CERINI , Enri DUQI , Silvia ADORNO , Lorenzo BALDO
Abstract: An actuation structure of a MEMS electroacoustic transducer is formed in a die of semiconductor material having a monolithic body with a front surface and a rear surface extending in a horizontal plane x-y plane and defined in which are: a frame; an actuator element arranged in a central opening defined by the frame; cantilever elements, coupled at the front surface between the actuator element and the frame; and piezoelectric regions arranged on the cantilever elements and configured to be biased to cause a deformation of the cantilever elements by the piezoelectric effect. A first stopper arrangement is integrated in the die and configured to interact with the cantilever elements to limit a movement thereof in a first direction of a vertical axis orthogonal to the horizontal plane, x-y plane towards the underlying central opening.
-
公开(公告)号:US20210114867A1
公开(公告)日:2021-04-22
申请号:US17072813
申请日:2020-10-16
Applicant: STMicroelectronics S.r.l.
Inventor: Enri DUQI , Fabrizio CERINI , Lorenzo BALDO
Abstract: A MEMS switch is actuatable by a fluid, and includes a piezoelectric pressure sensor that detects the movement of a fluid generating a negative pressure. The piezoelectric pressure sensor is formed by a chip of semiconductor material having a through cavity and a sensitive membrane, which extends over the through cavity and has a first and a second surface. The piezoelectric pressure sensor is mounted on a face of a board having a through hole so that the through cavity overlies and is in fluid connection with the through hole. The board has a fixing structure, which enables securing in an opening of a partition wall separating a first and a second space from each other. The board is arranged so that the first surface of the sensitive membrane faces the first space, and the second surface of the sensitive membrane faces the second space.
-
公开(公告)号:US20200221234A1
公开(公告)日:2020-07-09
申请号:US16813477
申请日:2020-03-09
Applicant: STMICROELECTRONICS S.R.L.
Inventor: Fabrizio CERINI , Silvia ADORNO , Federico VERCESI
IPC: H04R17/02 , B81B3/00 , B81C1/00 , H01L41/113
Abstract: A piezoelectric MEMS transducer formed in a body of semiconductor material, which has a central axis and a peripheral area and comprises a plurality of beams, transverse to the central axis and having a first end, coupled to the peripheral area of the body, and a second end, facing the central axis; a membrane, transverse to the central axis and arranged underneath the plurality of beams; and a pillar, parallel to the central axis and rigid with the second end of the beams and to the membrane. The MEMS transducer further comprises a plurality of piezoelectric sensing elements arranged on the plurality of beams.
-
5.
公开(公告)号:US20220123105A1
公开(公告)日:2022-04-21
申请号:US17494475
申请日:2021-10-05
Applicant: STMicroelectronics S.r.l.
Inventor: Fabrizio CERINI , Silvia ADORNO , Dario PACI , Marco SALINA
IPC: H01L49/02 , H01L23/522
Abstract: An electrode structure includes a pad of conductive material, and a conductive strip having a first end physically and electrically coupled to the pad. The pad includes an annular element internally defining a through opening. The first end of the conductive strip is physically and electrically coupled to the annular element by a transition region so that, when the conductive strip undergoes expansion by the thermal effect, a stress spreads from the conductive strip to the annular element by the transition region.
-
公开(公告)号:US20200382876A1
公开(公告)日:2020-12-03
申请号:US16882343
申请日:2020-05-22
Applicant: STMICROELECTRONICS S.R.L.
Inventor: Fabrizio CERINI , Silvia ADORNO
IPC: H04R17/02 , H01L41/09 , B81B3/00 , B81C1/00 , H01L41/113
Abstract: A piezoelectric microelectromechanical acoustic transducer, having a semiconductor substrate with a frame portion and a through cavity defined internally by the frame portion; an active membrane, suspended above the through cavity and anchored, at a peripheral portion thereof, to the frame portion of the substrate by an anchorage structure, a plurality of piezoelectric sensing elements carried by a front surface of the active membrane so as to detect mechanical stresses of the active membrane; a passive membrane, suspended above the through cavity, underneath the active membrane, interposed between the through cavity and a rear surface of the active membrane; and a pillar element, which fixedly couples, and is centrally interposed between, the active membrane and the passive membrane. A ventilation hole passes through the entire active membrane, the passive membrane and the pillar element to set the through cavity in fluidic communication with the front surface of the active membrane.
-
公开(公告)号:US20190327562A1
公开(公告)日:2019-10-24
申请号:US16389833
申请日:2019-04-19
Applicant: STMICROELECTRONICS S.R.L.
Inventor: Fabrizio CERINI , Silvia ADORNO , Federico VERCESI
IPC: H04R17/02 , H01L41/113 , B81B3/00 , B81C1/00
Abstract: A piezoelectric MEMS transducer formed in a body of semiconductor material, which has a central axis and a peripheral area and comprises a plurality of beams, transverse to the central axis and having a first end, coupled to the peripheral area of the body, and a second end, facing the central axis; a membrane, transverse to the central axis and arranged underneath the plurality of beams; and a pillar, parallel to the central axis and rigid with the second end of the beams and to the membrane. The MEMS transducer further comprises a plurality of piezoelectric sensing elements arranged on the plurality of beams.
-
8.
公开(公告)号:US20240259734A1
公开(公告)日:2024-08-01
申请号:US18416751
申请日:2024-01-18
Applicant: STMICROELECTRONICS S.r.l.
Inventor: Federico VERCESI , Fabrizio CERINI , Silvia ADORNO
CPC classification number: H04R19/04 , H04R7/04 , H04R7/18 , H04R19/005 , H04R31/003 , H04R31/006 , H04R2201/003
Abstract: Capacitive, MEMS-type acoustic transducer, having a sound collection part and a transduction part. A substrate region surrounds a first chamber arranged in the sound collection part and open towards the outside; a fixed structure is coupled to the substrate region; a cap region is coupled to the fixed structure. A sensitive membrane is arranged in the sound collection part, is coupled to the fixed structure and faces the first chamber. A transduction chamber is arranged in the transduction part, hermetically closed with respect to the outside and accommodates a detection membrane. An articulated structure extends between the sensitive membrane and the detection membrane, through the walls of the transduction chamber. A fixed electrode faces and is capacitively coupled to the detection membrane. Conducive electrical connection regions extend above the substrate region, into the transduction chamber.
-
公开(公告)号:US20230328456A1
公开(公告)日:2023-10-12
申请号:US18295673
申请日:2023-04-04
Applicant: STMICROELECTRONICS S.r.l.
Inventor: Fabrizio CERINI , Silvia ADORNO , Marco SALINA
CPC classification number: H04R17/005 , H10N30/20 , H04R2400/11 , H04R7/18 , H04R2201/003 , H04R7/06
Abstract: A microelectromechanical electroacoustic transducer includes a supporting frame of semiconductor material, a membrane of semiconductor material, connected to the supporting frame along a perimeter and having central symmetry, and a piezoelectric actuator on a peripheral portion of the membrane. The membrane has through slits of elongated shape arranged around a center of the membrane.
-
10.
公开(公告)号:US20230168488A1
公开(公告)日:2023-06-01
申请号:US18058152
申请日:2022-11-22
Applicant: STMICROELECTRONICS S.r.l.
Inventor: Federico VERCESI , Fabrizio CERINI , Luca GUERINONI , Nicolo' BONI
IPC: G02B26/04
CPC classification number: G02B26/04
Abstract: A MEMS shutter including: a substrate of semiconductor material traversed by a main aperture, and a first semiconductor layer and a second semiconductor layer, which form a supporting structure fixed to the substrate; a plurality of deformable structures; a plurality of actuators; and a plurality of shielding structures, each of which is formed by a corresponding portion of at least one between the first semiconductor layer and the second semiconductor layer, the shielding structures being arranged angularly around the underlying main aperture so as to provide shielding of the main aperture, each shielding structure being further coupled to the supporting structure via a corresponding deformable structure. Each actuator may be controlled so as to cause a rotation of a corresponding shielding structure between a respective first position and a respective second position, thus varying shielding of the main aperture. The first and second positions of the shielding structures are such that, in at least one operating condition of the MEMS shutter, pairs of adjacent shielding structures at least partially overlap one another.
-
-
-
-
-
-
-
-
-