公开(公告)号：US20150351224A1

公开(公告)日：2015-12-03

申请号：US14728144

申请日：2015-06-02

Applicant: SUMITOMO BAKELITE CO., LTD.

Inventor： Yoshihide Nii ,  Toshio Komiyatani ,  Yukiharu Yuzuriha

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/05 ,  H05K2201/09745 ,  H05K2201/10166

Abstract: A metal-based mounting board according to the present invention includes: a metal-based circuit board including a metal substrate having a first surface and a second surface opposite to the first surface, an insulating film provided on the first surface of the metal substrate and a metal film provided on the insulating film; and an electronic component provided on the metal film of the metal-based circuit board, wherein in the case where within the metal substrate, a region which overlaps with a collection of a plurality of lines each having an angle of 45° or less with respect to a normal line of the metal-based mounting board, the lines each passing through a surface of the electronic component facing the metal film, is defined as a first region, and a region other than the first region is defined as a second region, a groove is provided within the second region, but is not provided within the first region.

Abstract translation: 根据本发明的金属基安装板包括：金属基电路板，包括具有第一表面和与第一表面相对的第二表面的金属基板，设置在金属基板的第一表面上的绝缘膜和 设置在绝缘膜上的金属膜; 以及设置在所述金属基电路板的金属膜上的电子部件，其中，在所述金属基板内的情况下，与所述多个线的集合重叠的区域各自具有45°以下的角度， 在金属基安装基板的法线上，将各电子元件的面向金属膜的表面的线定义为第一区域，将第一区域以外的区域定义为第二区域， 在第二区域内设置槽，但不设置在第一区域内。

公开(公告)号：US20150351225A1

公开(公告)日：2015-12-03

申请号：US14728150

申请日：2015-06-02

Applicant: SUMITOMO BAKELITE CO., LTD.

Inventor： Yoshihide Nii ,  Toshio Komiyatani ,  Yukiharu Yuzuriha

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/40 ,  H05K1/11

CPC classification number: H05K1/184 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/021 ,  H05K1/056 ,  H05K3/3447 ,  H01L2924/00

Abstract: A metal-based mounting board according to the present invention includes: a metal-based circuit board including a metal substrate through which a through-hole is provided along a thickness direction thereof, an insulating film provided on the metal substrate and a metal film provided on the insulating film, wherein the through-hole opens on a surface of the metal film on the opposite side of the metal substrate via the insulating film and the metal film; an electronic component connected to the metal film, the electronic component including an electronic component main body and a conductive leg portion electrically connected to the electronic component main body and inserted into the through-hole; and an insulating portion provided at least between the leg portion locating inside the through-hole and the metal substrate, and having a function of preventing them from making contact with each other.

Abstract translation: 根据本发明的金属基安装板包括：金属基电路板，包括金属基板，通过该金属基板沿其厚度方向设置通孔，设置在金属基板上的绝缘膜和设置在金属基板上的金属膜 在所述绝缘膜上，所述通孔经由所述绝缘膜和所述金属膜在所述金属基板的相反侧的所述金属膜的表面上开口; 连接到所述金属膜的电子部件，所述电子部件包括电子部件主体和电连接到所述电子部件主体并插入所述通孔的导电性支腿部; 以及至少设置在位于所述通孔内的所述脚部与所述金属基板之间的绝缘部，并且具有防止它们彼此接触的功能。

公开(公告)号：US20150351223A1

公开(公告)日：2015-12-03

申请号：US14728125

申请日：2015-06-02

Applicant: SUMITOMO BAKELITE CO., LTD.

Inventor： Yoshihide Nii ,  Toshio Komiyatani ,  Yukiharu Yuzuriha

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/05 ,  H05K2201/09745 ,  H05K2201/10166

Abstract: The metal-based mounting board includes: a metal-based circuit board including a metal substrate having a first surface and a second surface, an insulating film provided on the first surface and a metal film provided on the insulating film; and an electronic component provided on the metal film of the metal-based circuit board. Within the metal substrate, a region which overlaps with a collection of a plurality of lines each having an angle of 45° or less with respect to a normal line of the metal-based mounting board, the lines each passing through a surface of the electronic component facing the metal film, is defined as a first region. A region other than the first region is defined as a second region. At least one groove is provided within the first region so as to surround the electronic component in a planar view of the metal-based mounting board.

Abstract translation: 金属基安装板包括：金属基电路板，包括具有第一表面和第二表面的金属基板，设置在第一表面上的绝缘膜和设置在绝缘膜上的金属膜; 以及设置在金属基电路板的金属膜上的电子部件。 在金属基板内，与金属基安装基板的法线相比，重叠于多个相互成45度以下的角度的集合的区域，各条线通过电子表面 面向金属膜的部件被定义为第一区域。 除了第一区域之外的区域被定义为第二区域。 在第一区域内设置至少一个凹槽，以便在金属基安装板的平面视图中围绕电子部件。