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公开(公告)号：US20170018412A1
公开(公告)日：2017-01-19
申请号：US15114360
申请日：2014-02-19
Applicant: Sakai Display Products Corporation
Inventor： Yuhya Ueki , Yasuhiro Wakamori
CPC classification number: H01J37/34 , C23C14/042 , C23C14/14 , C23C14/50 , H01J37/32715 , H01J37/32853 , H01J37/3447 , H01J37/3488
Abstract: There is provided a sputtering apparatus in which a holding body holding a substrate by facing a target in a processing chamber is covered by a deposition preventive plate including a substrate retainer for covering a peripheral edge part of the substrate, and a thin film made of metal is deposited on a surface of the substrate exposed to an inside of the deposition preventive plate. A stopper protrusion protrudes at a portion in which the holding body and the deposition preventive plate face each other from one part to the other part, and face the holding body or the deposition preventive plate at a smaller interval than the interval between the deposition preventive plate and the substrate retainer. When the deposition preventive plate and the holding body are thermally deformed to approach each other during film deposition processing, the stopper protrusion contacts with the deposition preventive plate or the holding body, and the deposition preventive plate and the holding body contact with each other, such that, peeling-off a metal film at a contact portion and mixing in a film deposition region of the substrate are prevented.
Abstract translation: 提供了一种溅射装置，其中通过面对处理室中的靶保持基板的保持体被包括用于覆盖基板的周缘部分的基板保持器的防沉积板和由金属制成的薄膜 沉积在暴露于防沉积板内部的基板的表面上。 在保持体和防止沉积板从一部分到另一部分彼此面对的部分处，止动突起突出，并且以比防沉积板之间的间隔小的间隔面对保持体或防沉积板 和基板保持器。 当成膜防止板和保持体在膜沉积处理期间被热变形以彼此接近时，止动突起与防沉积板或保持体接触，并且防沉积板和保持体彼此接触， 防止在接触部分剥离金属膜并在基板的成膜区域中混合。
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公开(公告)号：US10008372B2
公开(公告)日：2018-06-26
申请号：US15117603
申请日：2014-02-19
Applicant: Sakai Display Products Corporation
Inventor： Hirokazu Imahara , Yasuhiro Wakamori
CPC classification number: H01J37/3441 , C23C14/22 , C23C14/564 , C23C16/44 , C23C16/4404 , H01J37/34 , H01J37/3411
Abstract: A film deposition apparatus, comprising: a deposition preventive plate which is located in a processing chamber performing film deposition processing on a substrate so as to surround a processing region in the processing chamber for processing on the substrate, and which prevents a film deposition material from being attached to an inner wall of the processing chamber, wherein the deposition preventive plate is configured by arranging a plurality of component plates of which respective end portions are overlapped with each other at a gap, such that a thermal expansion generated due to the film deposition processing is absorbed by a relative movement of an overlapped part in two adjacent component plates of the plurality of component plates in a width direction of the overlapped part, and a concave part is provided at the overlapped part to make the gap provided in a side communicating with the processing region be larger than that provided in the other side, thin parts provided in the respective end portions of the two adjacent component plates are overlapped with each other, and a surface facing the processing region in the overlapped part and a surface facing the processing region in non-overlapped part are on the same plane, and a surface facing the inner wall in the overlapped part and a surface facing the inner wall in non-overlapped part are on the same plane.
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公开(公告)号：US10170288B2
公开(公告)日：2019-01-01
申请号：US15114360
申请日：2014-02-19
Applicant: Sakai Display Products Corporation
Inventor： Yuhya Ueki , Yasuhiro Wakamori
Abstract: There is provided a sputtering apparatus in which a holding body holding a substrate by facing a target in a processing chamber is covered by a deposition preventive plate including a substrate retainer for covering a peripheral edge part of the substrate, and a thin film made of metal is deposited on a surface of the substrate exposed to an inside of the deposition preventive plate. A stopper protrusion protrudes at a portion in which the holding body and the deposition preventive plate face each other from one part to the other part, and face the holding body or the deposition preventive plate at a smaller interval than the interval between the deposition preventive plate and the substrate retainer. When the deposition preventive plate and the holding body are thermally deformed to approach each other during film deposition processing, the stopper protrusion contacts with the deposition preventive plate or the holding body, and the deposition preventive plate and the holding body contact with each other, such that, peeling-off a metal film at a contact portion and mixing in a film deposition region of the substrate are prevented.
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公开(公告)号：US20160348237A1
公开(公告)日：2016-12-01
申请号：US15117603
申请日：2014-02-19
Applicant: Sakai Display Products Corporation
Inventor： Hirokazu Imahara , Yasuhiro Wakamori
CPC classification number: H01J37/3441 , C23C14/22 , C23C14/564 , C23C16/44 , C23C16/4404 , H01J37/34 , H01J37/3411
Abstract: A film deposition apparatus, comprising: a deposition preventive plate which is located in a processing chamber performing film deposition processing on a substrate so as to surround a processing region in the processing chamber for processing on the substrate, and which prevents a film deposition material from being attached to an inner wall of the processing chamber, wherein the deposition preventive plate is configured by arranging a plurality of component plates of which respective end portions are overlapped with each other at a gap, such that a thermal expansion generated due to the film deposition processing is absorbed by a relative movement of an overlapped part in two adjacent component plates of the plurality of component plates in a width direction of the overlapped part, and a concave part is provided at the overlapped part to make the gap provided in a side communicating with the processing region be larger than that provided in the other side, thin parts provided in the respective end portions of the two adjacent component plates are overlapped with each other, and a surface facing the processing region in the overlapped part and a surface facing the processing region in non-overlapped part are on the same plane, and a surface facing the inner wall in the overlapped part and a surface facing the inner wall in non-overlapped part are on the same plane.
Abstract translation: 一种成膜装置，包括：防沉积板，位于处理室中，在基板上进行成膜处理，以围绕处理室中的处理区域，以在基板上进行处理，并且防止膜沉积材料 附着在所述处理室的内壁上，其中所述防沉积板通过在间隙处布置相应的端部彼此重叠的多个部件板来构造，使得由于膜沉积产生的热膨胀 处理被重叠部分的宽度方向上的多个部件板的两个相邻部件板中的重叠部分的相对运动吸收，并且在重叠部分处设置有凹部，以使得设置在侧面连通 处理区域大于另一侧所设置的处理区域 两个相邻部件板的相应端部彼此重叠，并且与重叠部分中的处理区域相对的表面和与非重叠部分中的处理区域相对的表面在同一平面上，并且面向内部 重叠部分的壁和面向非重叠部分的内壁的表面在同一平面上。
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