Process for manufacturing a TFT device with source and drain regions having gradual dopant profile
    2.
    发明授权
    Process for manufacturing a TFT device with source and drain regions having gradual dopant profile 有权
    用于制造具有逐渐掺杂剂分布的源区和漏区的TFT器件的工艺

    公开(公告)号:US07674694B2

    公开(公告)日:2010-03-09

    申请号:US12031456

    申请日:2008-02-14

    IPC分类号: H01L21/20 H01L21/36

    CPC分类号: H01L29/78621 H01L29/66757

    摘要: A process for realizing TFT devices on a substrate comprises the steps of: forming on the substrate, in cascade, an amorphous silicon layer and a heavily doped amorphous silicon layer, forming a photolithographic mask on the heavily doped amorphous silicon layer provided with an opening, removing the heavily doped amorphous silicon layer through the opening for realizing opposite portions of the heavily doped amorphous silicon layer whose cross dimensions decrease as long as they depart from the amorphous silicon layer, removing the photolithographic mask, carrying out a diffusion and activation step of the dopant contained in the portions of the heavily doped amorphous silicon layer inside the amorphous silicon layer, for realizing source/drain regions of said TFT device.

    摘要翻译: 用于在衬底上实现TFT器件的工艺包括以下步骤:级联地形成非晶硅层和重掺杂非晶硅层,在设置有开口的重掺杂非晶硅层上形成光刻掩模, 通过开口去除重掺杂的非晶硅层,用于实现重掺杂非晶硅层的相对部分,其横截面尺寸随着离开非晶硅层而减小,除去光刻掩模,进行扩散和激活步骤 包含在非晶硅层内部的重掺杂非晶硅层的部分中的掺杂物,用于实现所述TFT器件的源极/漏极区域。

    PROCESS FOR MANUFACTURING A TFT DEVICE WITH SOURCE AND DRAIN REGIONS HAVING GRADUAL DOPANT PROFILE
    3.
    发明申请
    PROCESS FOR MANUFACTURING A TFT DEVICE WITH SOURCE AND DRAIN REGIONS HAVING GRADUAL DOPANT PROFILE 有权
    用于生产具有粗糙型配置文件的源和漏区的TFT设备的过程

    公开(公告)号:US20080213961A1

    公开(公告)日:2008-09-04

    申请号:US12031456

    申请日:2008-02-14

    IPC分类号: H01L21/336 H01L21/20

    CPC分类号: H01L29/78621 H01L29/66757

    摘要: Process for realizing TFT devices on a substrate which comprises the steps of: forming on the substrate, in cascade, an amorphous silicon layer and a heavily doped amorphous silicon layer, forming a photolithographic mask on the heavily doped amorphous silicon layer provided with an opening, removing the heavily doped amorphous silicon layer through the opening for realizing opposite portions of the heavily doped amorphous silicon layer whose cross dimensions decrease as long as they depart from the amorphous silicon layer, removing the photolithographic mask, carrying out a diffusion and activation step of the dopant contained in the portions of the heavily doped amorphous silicon layer inside the amorphous silicon layer, for realizing source/drain regions of said TFT device.

    摘要翻译: 一种用于在衬底上实现TFT器件的方法,包括以下步骤:级联地形成非晶硅层和重掺杂非晶硅层,在设置有开口的重掺杂非晶硅层上形成光刻掩模, 通过开口去除重掺杂的非晶硅层,用于实现重掺杂非晶硅层的相对部分,其横截面尺寸随着离开非晶硅层而减小,除去光刻掩模,进行扩散和激活步骤 包含在非晶硅层内部的重掺杂非晶硅层的部分中的掺杂物,用于实现所述TFT器件的源极/漏极区域。

    Process for integrating on an inert substrate a device comprising at least a passive element and an active element and corresponding integrated device
    4.
    发明授权
    Process for integrating on an inert substrate a device comprising at least a passive element and an active element and corresponding integrated device 有权
    用于在惰性基板上集成至少包括无源元件和有源元件的器件以及相应的集成器件的工艺

    公开(公告)号:US08575720B2

    公开(公告)日:2013-11-05

    申请号:US11803716

    申请日:2007-05-14

    IPC分类号: H01L27/08

    CPC分类号: H01L21/84 H01L27/12

    摘要: A process is described for integrating, on an inert substrate, a device having at least one passive component and one active component. The process comprises: deposition of a protection dielectric layer on the inert substrate; formation of a polysilicon island on the protection dielectric layer; integration of the active component on the polysilicon island; deposition of the covering dielectric layer on the protection dielectric layer and on the active component; integration of the passive component on the covering dielectric layer; formation of first contact structures in openings realised in the covering dielectric layer in correspondence with active regions of the active component; and formation of second contact structures in correspondence with the passive component. An integrated device obtained through this process is also described.

    摘要翻译: 描述了一种在惰性基板上集成具有至少一个无源部件和一个有源部件的装置的方法。 该方法包括:将保护电介质层沉积在惰性衬底上; 在保护电介质层上形成多晶硅岛; 有源元件在多晶硅岛上的集成; 覆盖电介质层沉积在保护电介质层和有源元件上; 将被动元件集成在覆盖介电层上; 在与所述有源部件的有源区域对应的覆盖介电层中实现的开口中形成第一接触结构; 以及与被动部件对应地形成第二接触结构。 还描述了通过该方法获得的集成装置。

    Thin-film transistor (TFT) device
    5.
    发明授权
    Thin-film transistor (TFT) device 有权
    薄膜晶体管(TFT)器件

    公开(公告)号:US07952104B2

    公开(公告)日:2011-05-31

    申请号:US12564719

    申请日:2009-09-22

    IPC分类号: H01L29/04 H01L31/036

    摘要: A process for manufacturing a thin-film transistor device includes forming a dielectric insulation layer on a substrate, forming an amorphous silicon layer on the dielectric insulation layer, crystallizing the amorphous silicon layer, so as to obtain polycrystalline silicon, forming gate structures on the polycrystalline silicon, and forming first doped regions within the polycrystalline silicon laterally with respect to the gate structures. The crystallizing step includes forming first capping dielectric regions on the amorphous silicon layer, and then irradiating the amorphous silicon layer using a laser so as to form active areas of polycrystalline silicon separated by separation portions of amorphous silicon underlying the first capping dielectric regions.

    摘要翻译: 一种薄膜晶体管器件的制造方法,其特征在于,在基板上形成介电绝缘层,在所述绝缘层上形成非晶硅层,使所述非晶硅层结晶化,得到多晶硅,在所述多晶硅上形成栅极结构 硅,并且相对于栅极结构横向地在多晶硅内形成第一掺杂区域。 所述结晶步骤包括在所述非晶硅层上形成第一覆盖电介质区域,然后使用激光照射所述非晶硅层,以便形成由所述第一覆盖电介质区域下方的非晶硅的分离部分分离的多晶硅的有源区域。

    Process for manufacturing a thin-film transistor (TFT) device and TFT device manufactured by the process
    6.
    发明申请
    Process for manufacturing a thin-film transistor (TFT) device and TFT device manufactured by the process 有权
    用于制造薄膜晶体管(TFT)器件和通过该工艺制造的TFT器件的工艺

    公开(公告)号:US20070034872A1

    公开(公告)日:2007-02-15

    申请号:US11478332

    申请日:2006-06-28

    IPC分类号: H01L29/04

    摘要: A process for manufacturing a thin-film transistor device includes forming a dielectric insulation layer on a substrate, forming an amorphous silicon layer on the dielectric insulation layer, crystallizing the amorphous silicon layer, so as to obtain polycrystalline silicon, forming gate structures on the polycrystalline silicon, and forming first doped regions within the polycrystalline silicon laterally with respect to the gate structures. The crystallizing step includes forming first capping dielectric regions on the amorphous silicon layer, and then irradiating the amorphous silicon layer using a laser so as to form active areas of polycrystalline silicon separated by separation portions of amorphous silicon underlying the first capping dielectric regions.

    摘要翻译: 一种薄膜晶体管器件的制造方法,其特征在于,在基板上形成介电绝缘层,在所述绝缘层上形成非晶硅层,使所述非晶硅层结晶化,得到多晶硅,在所述多晶硅上形成栅极结构 硅,并且相对于栅极结构横向地在多晶硅内形成第一掺杂区域。 所述结晶步骤包括在所述非晶硅层上形成第一覆盖电介质区域,然后使用激光照射所述非晶硅层,以便形成由所述第一覆盖电介质区域下方的非晶硅的分离部分分离的多晶硅的有源区域。

    Process for manufacturing a thin-film transistor (TFT) device and TFT device manufactured by the process
    8.
    发明授权
    Process for manufacturing a thin-film transistor (TFT) device and TFT device manufactured by the process 有权
    用于制造薄膜晶体管(TFT)器件和通过该工艺制造的TFT器件的工艺

    公开(公告)号:US07611933B2

    公开(公告)日:2009-11-03

    申请号:US11478332

    申请日:2006-06-28

    IPC分类号: H01L21/00 H01L21/84

    摘要: A process for manufacturing a thin-film transistor device includes forming a dielectric insulation layer on a substrate, forming an amorphous silicon layer on the dielectric insulation layer, crystallizing the amorphous silicon layer, so as to obtain polycrystalline silicon, forming gate structures on the polycrystalline silicon, and forming first doped regions within the polycrystalline silicon laterally with respect to the gate structures. The crystallizing step includes forming first capping dielectric regions on the amorphous silicon layer, and then irradiating the amorphous silicon layer using a laser so as to form active areas of polycrystalline silicon separated by separation portions of amorphous silicon underlying the first capping dielectric regions.

    摘要翻译: 一种薄膜晶体管器件的制造方法,其特征在于,在基板上形成介电绝缘层,在所述绝缘层上形成非晶硅层,使所述非晶硅层结晶化,得到多晶硅,在所述多晶硅上形成栅极结构 硅,并且相对于栅极结构横向地在多晶硅内形成第一掺杂区域。 所述结晶步骤包括在所述非晶硅层上形成第一覆盖电介质区域,然后使用激光照射所述非晶硅层,以便形成由所述第一覆盖电介质区域下方的非晶硅的分离部分分离的多晶硅的有源区域。

    Driving circuit for an OLED (organic light emission diode), in particular for a display of the AM-OLED type
    9.
    发明授权
    Driving circuit for an OLED (organic light emission diode), in particular for a display of the AM-OLED type 有权
    用于OLED(有机发光二极管)的驱动电路,特别是AM-OLED型显示器

    公开(公告)号:US08111217B2

    公开(公告)日:2012-02-07

    申请号:US12019577

    申请日:2008-01-24

    IPC分类号: G09G3/30

    摘要: A driving circuit of an OLED diode is inserted between a first and a second voltage reference and having at least one input terminal receiving an input voltage signal and an output terminal for the generation of a driving current of the OLED diode, the driving circuit having at least one driver transistor having a first conduction terminal connected to the first voltage reference, a second conduction terminal connected to the output terminal and a control terminal connected to at least one first capacitor and one second capacitor. The first capacitor is inserted between this control terminal and an inner circuit node and the second capacitor is inserted between the inner circuit node and the second voltage reference, the driving circuit 10 further including: a first switch inserted between the input terminal and the inner circuit node; a second switch inserted between the first conduction terminal and control terminal of the driver transistor, and a third switch inserted between the inner circuit node and the second voltage reference, in parallel to the second capacitor, as well as a fourth switch inserted between the first voltage reference and the first conduction terminal of the driver transistor.

    摘要翻译: OLED二极管的驱动电路插入在第一和第二参考电压之间并具有接收输入电压信号的至少一个输入端和用于产生OLED二极管的驱动电流的输出端,驱动电路具有 至少一个驱动晶体管具有连接到第一参考电压的第一导通端子,连接到输出端子的第二导通端子和连接到至少一个第一电容器和一个第二电容器的控制端子。 第一电容器插入在该控制端子和内部电路节点之间,并且第二电容器插入在内部电路节点和第二电压基准之间,驱动电路10还包括:插入在输入端子和内部电路之间的第一开关 节点; 插入驱动晶体管的第一导通端子和控制端子之间的第二开关和插入在内部电路节点和第二参考电压之间的第三开关并联于第二电容器,以及插入在第一和第二开关之间的第四开关 电压基准和驱动晶体管的第一导通端子。

    DRIVING CIRCUIT FOR AN OLED (ORGANIC LIGHT EMISSION DIODE), IN PARTICULAR FOR A DISPLAY OF THE AM-OLED TYPE
    10.
    发明申请
    DRIVING CIRCUIT FOR AN OLED (ORGANIC LIGHT EMISSION DIODE), IN PARTICULAR FOR A DISPLAY OF THE AM-OLED TYPE 有权
    用于OLED(有机发光二极管)的驱动电路,特别是AM-OLED类型的显示

    公开(公告)号:US20080211746A1

    公开(公告)日:2008-09-04

    申请号:US12019577

    申请日:2008-01-24

    IPC分类号: G09G3/30

    摘要: A driving circuit of an OLED diode is inserted between a first and a second voltage reference and having at least one input terminal receiving an input voltage signal and an output terminal for the generation of a driving current of the OLED diode, the driving circuit having at least one driver transistor having a first conduction terminal connected to the first voltage reference, a second conduction terminal connected to the output terminal and a control terminal connected to at least one first capacitor and one second capacitor. The first capacitor is inserted between this control terminal and an inner circuit node and the second capacitor is inserted between the inner circuit node and the second voltage reference, the driving circuit 10 further including: a first switch inserted between the input terminal and the inner circuit node; a second switch inserted between the first conduction terminal and control terminal of the driver transistor, and a third switch inserted between the inner circuit node and the second voltage reference, in parallel to the second capacitor, as well as a fourth switch inserted between the first voltage reference and the first conduction terminal of the driver transistor.

    摘要翻译: OLED二极管的驱动电路插入在第一和第二参考电压之间并具有接收输入电压信号的至少一个输入端和用于产生OLED二极管的驱动电流的输出端,驱动电路具有 至少一个驱动晶体管具有连接到第一参考电压的第一导通端子,连接到输出端子的第二导通端子和连接到至少一个第一电容器和一个第二电容器的控制端子。 第一电容器插入在该控制端子和内部电路节点之间,并且第二电容器插入在内部电路节点和第二电压基准之间,驱动电路10还包括:插入在输入端子和内部电路之间的第一开关 节点; 插入驱动晶体管的第一导通端子和控制端子之间的第二开关和插入在内部电路节点和第二参考电压之间的第三开关并联于第二电容器,以及插入在第一和第二开关之间的第四开关 电压基准和驱动晶体管的第一导通端子。