公开(公告)号：US20140159059A1

公开(公告)日：2014-06-12

申请号：US13869697

申请日：2013-04-24

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Yu-Gwang JEONG ,  Ji-Young PARK ,  Shin-Il CHOI ,  Sang-Gab KIM

IPC: H01L33/02

CPC classification number: H01L27/124 ,  G02F1/133707 ,  H01L27/1248 ,  H01L27/1288

Abstract: A method of manufacturing a display substrate includes forming a gate insulation layer on the base substrate on which a gate metal pattern, forming a data metal pattern on the gate insulation layer, sequentially forming a insulation layer and an organic layer on the base substrate on which the data metal pattern is formed, partially exposing the organic layer, developing the organic layer to partially remove the organic layer on the data metal pattern and to expose at least a portion of the protecting layer on the gate metal pattern, forming a common electrode on the organic layer, forming a pixel electrode on the on the organic layer, and forming an insulation layer between the pixel electrode and the common electrode. An etching degree of a data metal may be controlled by controlling a thickness of a remained organic layer to reduce a damage of the data metal.

Abstract translation: 一种制造显示基板的方法包括在基底基板上形成栅极绝缘层，栅基金属图案在栅绝缘层上形成数据金属图案，在基底基板上依次形成绝缘层和有机层， 形成数据金属图案，部分地暴露有机层，显影有机层以部分地去除数据金属图案上的有机层，并暴露栅极金属图案上的保护层的至少一部分，形成公共电极 有机层，在有机层上形成像素电极，在像素电极和公共电极之间形成绝缘层。 可以通过控制剩余的有机层的厚度来减少数据金属的损伤来控制数据金属的蚀刻程度。

公开(公告)号：US20140367706A1

公开(公告)日：2014-12-18

申请号：US14105048

申请日：2013-12-12

Applicant: Samsung Display Co., Ltd.

Inventor： Ji-Young PARK ,  Dong Il KIM ,  Sang Gab KIM

IPC: H01L27/12

CPC classification number: H01L27/124 ,  G02F1/134363 ,  G02F1/136227 ,  H01L27/1248 ,  H01L27/1259

Abstract: A thin film transistor array panel includes a substrate; a gate line located over the substrate and including a gate pad portion; a data line located over the gate line and including a source electrode and a data pad portion; a drain electrode; a first passivation layer located over the data line and the drain electrode; an organic insulating layer located over the first passivation layer and having a contact hole; a first field generating electrode located over the organic insulating layer and having an opening; a second passivation layer located over the first field generating electrode; and a second field generating electrode located over the second passivation layer. The contact hole coincides with or is smaller than the opening, and the contact hole has a tapered structure.

Abstract translation: 薄膜晶体管阵列面板包括基板; 栅极线，位于衬底上并包括栅极焊盘部分; 位于栅极线上方并包括源电极和数据焊盘部分的数据线; 漏电极; 位于数据线和漏电极之上的第一钝化层; 位于所述第一钝化层上并具有接触孔的有机绝缘层; 位于所述有机绝缘层上方并具有开口的第一场产生电极; 位于第一场产生电极之上的第二钝化层; 以及位于所述第二钝化层上方的第二场产生电极。 接触孔与开口重合或小于开口，接触孔具有锥形结构。

公开(公告)号：US20150108489A1

公开(公告)日：2015-04-23

申请号：US14579542

申请日：2014-12-22

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Joo-Han KIM ,  Ki-Yong SONG ,  Dong-Ju YANG ,  Hee-Joon KIM ,  Yeo-Geon YOON ,  Sung-Hen CHO ,  Chang-Hoon KIM ,  Jae-Hong KIM ,  Yu-Gwang JEONG ,  Ki-Yeup LEE ,  Sang-Gab KIM ,  Yun-Jong YEO ,  Shin-Il CHOI ,  Ji-Young PARK

IPC: H01L23/00 ,  H01L27/12

CPC classification number: H01L24/05 ,  G02F1/136227 ,  H01L27/12 ,  H01L27/1214 ,  H01L27/124 ,  H01L2224/04042 ,  H01L2924/14 ,  H01L2924/1426 ,  H01L2924/00

Abstract: A contact portion of wiring and a method of manufacturing the same are disclosed. A contact portion of wiring according to an embodiment includes: a substrate; a conductive layer disposed on the substrate; an interlayer insulating layer disposed on the conductive layer and having a contact hole; a metal layer disposed on the conductive layer and filling the contact hole; and a transparent electrode disposed on the interlayer insulating layer and connected to the metal layer, wherein the interlayer insulating layer includes a lower insulating layer and an upper insulating layer disposed on the lower insulating layer, the lower insulating layer is undercut at the contact hole, and the metal layer fills in the portion where the lower insulating layer is undercut.

Abstract translation: 公开了布线的接触部分及其制造方法。 根据实施例的布线的接触部分包括：基板; 设置在所述基板上的导电层; 设置在所述导电层上并具有接触孔的层间绝缘层; 设置在所述导电层上并填充所述接触孔的金属层; 以及透明电极，设置在所述层间绝缘层上并连接到所述金属层，其中所述层间绝缘层包括下绝缘层和设置在所述下绝缘层上的上绝缘层，所述下绝缘层在所述接触孔处被底切， 并且金属层填充在下绝缘层被切下的部分。