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公开(公告)号：US11980073B2
公开(公告)日：2024-05-07
申请号：US17520893
申请日：2021-11-08
发明人： Jin-Suk Lee , Seong Ryong Lee
IPC分类号： H10K59/131 , H01L27/12 , H10K59/12 , H10K77/10 , H10K102/00
CPC分类号： H10K59/131 , H01L27/1218 , H01L27/1244 , H01L27/124 , H01L27/1288 , H10K59/1201 , H10K77/111 , H10K2102/311
摘要： A display device includes a substrate including a first area, a second area, and a bending area. A plurality of first wires are positioned in the first area. A plurality of second wires are positioned in the second area. An insulating layer is positioned in the bending area. A plurality of connecting wires are disposed on the insulating layer. Each of the connecting wires is connected with at least one of the first wires and at least one of the second wires. Each of the connecting wires includes a first portion and a second portion alternatingly arranged along an extending direction of the connecting wires. A width of the first portion is wider than a width of the second portion in a direction perpendicular to the extending direction each of the connecting wires.
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公开(公告)号：US11171197B2
公开(公告)日：2021-11-09
申请号：US16701237
申请日：2019-12-03
发明人： Jin-Suk Lee , Seong Ryong Lee
摘要： A display device includes a substrate including a first area, a second area, and a bending area. A plurality of first wires are positioned in the first area. A plurality of second wires are positioned in the second area. An insulating layer is positioned in the bending area. A plurality of connecting wires are disposed on the insulating layer. Each of the connecting wires is connected with at least one of the first wires and at least one of the second wires. Each of the connecting wires includes a first portion and a second portion alternatingly arranged along an extending direction of the connecting wires. A width of the first portion is wider than a width of the second portion in a direction perpendicular to the extending direction each of the connecting wires.
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公开(公告)号：US11825673B2
公开(公告)日：2023-11-21
申请号：US17146845
申请日：2021-01-12
发明人： Jin-Suk Seo , Eung Taek Kim , Tae Sik Kim , Hee Yeon Kim , Jong Hyun Yun , Na Lae Lee , Jin-Suk Lee , Joo Hyeon Jo
CPC分类号： H10K50/13 , H10K85/621
摘要： A display device includes: a substrate; a transistor positioned on the substrate; and a light-emitting device electrically connected to the transistor, wherein the substrate includes a first layer, a second layer positioned between the first layer and the transistor, and a third layer positioned between the second layer and the transistor, the first layer and the third layer include organic materials, and the organic material included by the first layer and the organic material included by the third layer have different half-lives for a corona discharge.
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公开(公告)号：US09332641B2
公开(公告)日：2016-05-03
申请号：US14024021
申请日：2013-09-11
发明人： Jin-Suk Lee
CPC分类号： H05K1/117 , H01R12/52 , H05K1/0248 , H05K1/118 , H05K3/323 , H05K3/361 , H05K2201/09709 , H05K2201/09909
摘要： A connection structure of a circuit board is disclosed. In one aspect, the connection structure includes a first circuit board, a second circuit board and an adhesive member. A first connection pad and a second connection pad are disposed on the first circuit board. The second circuit board has a first surface facing the first circuit board. A plurality of third connection pads and fourth connection pads are disposed on the first surface of the second circuit board in a staggered pattern. The adhesive member is disposed between the first and second circuit boards. At least one of the third and fourth connection pads is electrically connected to a wire which is disposed on a second surface of the second circuit board opposite to the first surface of the second circuit board.
摘要翻译： 公开了一种电路板的连接结构。 一方面，连接结构包括第一电路板，第二电路板和粘合构件。 第一连接焊盘和第二连接焊盘设置在第一电路板上。 第二电路板具有面向第一电路板的第一表面。 多个第三连接焊盘和第四连接焊盘以交错图案设置在第二电路板的第一表面上。 粘合部件设置在第一和第二电路板之间。 第三和第四连接焊盘中的至少一个电连接到布置在与第二电路板的第一表面相对的第二电路板的第二表面上的导线。
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公开(公告)号：US20140127916A1
公开(公告)日：2014-05-08
申请号：US14024021
申请日：2013-09-11
发明人： Jin-Suk Lee
IPC分类号： H01R12/52
CPC分类号： H05K1/117 , H01R12/52 , H05K1/0248 , H05K1/118 , H05K3/323 , H05K3/361 , H05K2201/09709 , H05K2201/09909
摘要： A connection structure of a circuit board is disclosed. In one aspect, the connection structure includes a first circuit board, a second circuit board and an adhesive member. A first connection pad and a second connection pad are disposed on the first circuit board. The second circuit board has a first surface facing the first circuit board. A plurality of third connection pads and fourth connection pads are disposed on the first surface of the second circuit board in a staggered pattern. The adhesive member is disposed between the first and second circuit boards. At least one of the third and fourth connection pads is electrically connected to a wire which is disposed on a second surface of the second circuit board opposite to the first surface of the second circuit board.
摘要翻译： 公开了一种电路板的连接结构。 一方面，连接结构包括第一电路板，第二电路板和粘合构件。 第一连接焊盘和第二连接焊盘设置在第一电路板上。 第二电路板具有面向第一电路板的第一表面。 多个第三连接焊盘和第四连接焊盘以交错图案设置在第二电路板的第一表面上。 粘合部件设置在第一和第二电路板之间。 第三和第四连接焊盘中的至少一个电连接到布置在与第二电路板的第一表面相对的第二电路板的第二表面上的导线。
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