Abstract:
Provided is a method of manufacturing a display apparatus, the method including forming an amorphous silicon layer on a substrate; changing amorphous silicon in the amorphous silicon layer into crystalline silicon by irradiating the amorphous silicon with a laser beam emitted through a phase shift mask; and forming a display device, the phase shift mask including a base substrate; a barrier layer on the base substrate and including a plurality of transmissive portions which are spaced apart from each other in a first direction; and phase shift portions which alternately fill the plurality of transmissive portions in the first direction.
Abstract:
Provided is a semiconductor device including a buffer layer that is on a substrate and includes an inclined surface; a crystalline silicon layer that is on the buffer layer; a gate electrode that is on the crystalline silicon layer while being insulated from the crystalline silicon layer; and a source electrode and a drain electrode that are each electrically connected to the crystalline silicon layer, the angle between the substrate and the inclined surface being in a range of about 17.5 degrees to less than about 70 degrees.
Abstract:
An organic light emitting diode display device includes a substrate, a buffer layer, a first circuit structure, a sub-pixel structure, and a first signal wire. The substrate includes a display region including a plurality of sub-pixel regions and a peripheral region surrounding the display region. The buffer layer is disposed in the display region and peripheral region on the substrate. The first circuit structure is disposed in the peripheral region on the buffer layer. The sub-pixel structure is disposed in each of the sub-pixel regions on the first circuit structure. The first signal wire is disposed in the peripheral region between the substrate and the buffer layer, and overlaps the first circuit structure when viewed from a plan view in a thickness direction of the substrate.
Abstract:
A display apparatus has a display area and a non-display area around the display area, the display apparatus includes, in the non-display area, a first power line, a driving circuit on a layer over the first power line, and a second power line electrically connected to the first power line and on a same layer on which one electrode of the driving circuit is arranged.
Abstract:
A display device may include a substrate, an organic light emitting element on the substrate, a pixel circuit between the substrate and the organic light emitting element, electrically connected to the organic light emitting element, and including a first transistor and a second transistor, a first metal layer between the substrate and the pixel circuit, overlapping the first transistor, and configured to receive a first voltage, and a second metal layer between the substrate and the pixel circuit, overlapping the second transistor, and configured to receive a second voltage different from the first voltage.
Abstract:
An organic light emitting diode display device includes a substrate, a buffer layer, a first circuit structure, a sub-pixel structure, and a first signal wire. The substrate includes a display region including a plurality of sub-pixel regions and a peripheral region surrounding the display region. The buffer layer is disposed in the display region and peripheral region on the substrate. The first circuit structure is disposed in the peripheral region on the buffer layer. The sub-pixel structure is disposed in each of the sub-pixel regions on the first circuit structure. The first signal wire is disposed in the peripheral region between the substrate and the buffer layer, and overlaps the first circuit structure when viewed from a plan view in a thickness direction of the substrate.
Abstract:
A display substrate includes a first conductive layer on a base substrate, a first insulation layer on the first conductive layer, a second conductive layer on the first insulation layer, a second insulation layer on the second conductive layer, and a third conductive layer on the second insulation layer. The third conductive layer is connected to the first conductive layer and the second conductive layer through a contact hole passing through the first insulation layer, the second conductive layer, and the second insulation layer. A sidewall of the contact hole has a stepped shape.
Abstract:
A thin film transistor includes a polysilicon layer on a substrate, which includes a first area between second and third areas. A polysilicon layer is formed on the substrate, and a source electrode and a drain electrode are formed on the polysilicon layer in the first and third areas. Each of the source electrode and the drain electrode includes a metal silicide layer adjacent the polysilicon layer.
Abstract:
A thin film transistor (TFT) substrate, a flat display apparatus including the TFT substrate, a method of manufacturing the TFT substrate, and a method of manufacturing the flat display apparatus, the thin film transistor (TFT) substrate including a substrate; a first gate electrode on the substrate, the first gate electrode including a first branch electrode and a second branch electrode that are spaced apart from one another; a polysilicon layer on the first gate electrode and insulated from the first gate electrode; and a second gate electrode on the polysilicon layer, the second gate electrode being insulated from the polysilicon layer and overlying the first and second branch electrodes.
Abstract:
A thin film transistor includes a polysilicon layer on a substrate, which includes a first area between second and third areas. A polysilicon layer is formed on the substrate, and a source electrode and a drain electrode are formed on the polysilicon layer in the first and third areas. Each of the source electrode and the drain electrode includes a metal silicide layer adjacent the polysilicon layer.