摘要:
The present invention relates to an electrostatic discharge protection device. The electrostatic discharge protection device in accordance with an embodiment of the present invention includes a substrate, an electrostatic discharge absorbing layer having a plating film formed on the substrate, electrodes disposed on the substrate to be spaced apart from each other by a predetermined interval with the electrostatic discharge absorbing layer interposed therebetween, and an insulating layer for covering the substrate and the electrodes.
摘要:
Disclosed herein is a thin film type common mode filter including: a base substrate made of an insulating material; a first insulating layer formed on the base substrate; a coil-shaped internal electrode formed on the first insulating layer; a second insulating layer formed on the internal electrode; an external electrode terminal having a vertical section connected to a side surface of the internal electrode and a horizontal section extended from an upper end of the vertical section toward a horizontal direction to thereby form a parallel surface spaced apart from the internal electrode by a predetermined distance; and a ferrite resin layer formed between the horizontal section of the external electrode terminal and the internal electrode.
摘要:
An electronic component and a circuit board having the same mounted thereon. The electronic component includes: a base part; a coil part provided on the base part and including a coil formed by disposing conductive patterns in a spiral shape and an external terminal connected to an end portion of the coil; and a cover part including an external electrode having a first surface contacting an upper surface of the external terminal and a second surface opposing the first surface and a magnetic material part provided on the coil part, made of a magnetic material, and exposing the second surface, wherein a surface area of the first surface is larger than a surface area of the second surface.
摘要:
Disclosed herein is a common mode filter including: at least four coil layers, each layer having a primary coil and a secondary coil; and discontinuous parts made of an insulating material each extending between starting points of each of the primary coil and the secondary coil positioned on the lowest layer among the coil layers to ending points of each of the primary coil and the secondary coil positioned on the highest layer among the coil layers. The primary coils are connected in series from the lowest layer to the highest layer, and the secondary coils are connected in series from the lowest layer to the highest layer. The common mode filter is able to be miniaturized and has improved impedance characteristics.
摘要:
Disclosed herein is a common mode filter including: a coil part including a conductor coil provided in an insulating part; a plurality of external electrodes provided on the insulating part while being electrically connected to the conductor coil; and a magnetic material part provided in a region between the plurality of external electrodes on the insulating part. By this configuration, impedance characteristics of the common mode filter may be improved.
摘要:
Disclosed herein is a common mode filter. The common mode filter includes a main body that includes a coil electrode, first and second external electrodes connected with both ends of the coil electrode, respectively, and a ground electrode, and an electro static discharge (ESD) protection layer that includes a switching member formed therein, and is provided on any one surface of the main body. Here, one end of the coil electrode is connected with the second external electrode, the other end thereof is connected with the first external electrode through the switching member, and the switching member is disconnected from the coil electrode in accordance with a switching operation when a surge current is applied and connected with the ground electrode. Therefore, it is possible to protect the common mode filter from a surge current by ESD.
摘要:
A common mode filter in which at least one surface of all of external electrodes and ground electrodes are exposed to a first surface, at least one side of each of two of the external electrodes and at least one side of one of the ground electrodes contact a first side of the first surface, and at least one side of each of the external electrodes and the ground electrodes of which sides do not contact the first side contact a second side of the first surface, thereby making it possible to improve sticking strength and decrease a short-circuit phenomenon occurrence rate.
摘要:
Disclosed herein is a common mode filter, including: a magnetic substrate; and a body part formed on the magnetic substrate, wherein the body part is configured of an insulating layer surrounding a coil electrode, an outer electrode terminal connected with an end of the coil electrode, and a magnetic resin composite, the insulating layer is formed on the magnetic substrate, having a margin part M disposed at an edge of the magnetic substrate, and the magnetic resin composite is filled in an empty space of the body part including the margin part M, thereby promoting a consecutive flow of magnetic flux that is generated from the coil electrode.
摘要:
An electronic component and a circuit board having the same mounted thereon. The electronic component includes: a base part; a coil part provided on the base part and including a coil formed by disposing conductive patterns in a spiral shape and an external terminal connected to an end portion of the coil; and a cover part including an external electrode having a first surface contacting an upper surface of the external terminal and a second surface opposing the first surface and a magnetic material part provided on the coil part, made of a magnetic material, and exposing the second surface, wherein a surface area of the first surface is larger than a surface area of the second surface.
摘要:
Disclosed herein is a thin film type chip device, including: a plurality of unit circuit structures laminated on a substrate; and an adhesive layer adhering the unit circuit structures to each other.