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公开(公告)号：US10032697B2
公开(公告)日：2018-07-24
申请号：US15203006
申请日：2016-07-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Han Kim , Young Gwan Ko , Kang Heon Hur , Kyung Moon Jung , Sung Han Kim
IPC: H01L23/48 , H01L23/538 , H01L23/31 , H01L23/498 , H01L23/522 , H01L23/528 , H01L23/00
Abstract: An electronic component package may include: a redistribution layer including a first insulating layer, a first conductive pattern disposed on the first insulating layer, and a first via connected to the first conductive pattern while penetrating through the first insulating layer; an electronic component disposed on the redistribution layer; and an encapsulant encapsulating the electronic component. The first via has a horizontal cross-sectional shape in which a distance between first and second edge points of the first via in a first direction passing through the center of the first via and the first and second edge points thereof is shorter than that between third and fourth edge points of the first via in a second direction perpendicular to the first direction and passing through the center of the first via and the third and fourth points thereof.
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公开(公告)号：US09659708B2
公开(公告)日：2017-05-23
申请号：US13953580
申请日：2013-07-29
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Sung Kwon Wi , Young Seuck Yoo , Jeong Bok Kwak , Yong Suk Kim , Sang Moon Lee , Kang Heon Hur
CPC classification number: H01F41/04 , H01F17/0013 , H01F27/292 , H01F41/041 , Y10T29/4902
Abstract: A method for manufacturing an inductor including preparing an insulating layer; forming a polymer layer including a coil pattern on the insulating layer; forming a stacked structure by heat treating the insulating layer and the polymer layer; and forming an external electrode to electrically connect the coil pattern for the stacked structure.
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公开(公告)号：US09609183B2
公开(公告)日：2017-03-28
申请号：US14463438
申请日：2014-08-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kang Ryong Choi , Hyung Jin Jeon , Jeong Gu Yeo , Kang Heon Hur , Sung Yong An , Jung Wook Seo
IPC: H04N5/225
CPC classification number: H04N5/2252 , H04N5/2253 , H04N5/2254 , H04N5/2257
Abstract: There is provided a camera module including: a lens housing in which a lens is disposed; a glass cover formed of a transparent material and covering the lens housing; and a coil conductive part formed between an outer surface of the lens and an inner surface of the glass cover.
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公开(公告)号：US20150346584A1
公开(公告)日：2015-12-03
申请号：US14463413
申请日：2014-08-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Boum Seock Kim , Hui Sun Park , Kang Heon Hur , Jung Wook Seo
CPC classification number: H04N5/2254 , G03B3/10 , G03B2205/0061 , H04N5/2257 , H04N5/23212
Abstract: An actuator may include a piezoelectric member extended to be elongated in an optical axis direction; and a magnetic body disposed on the piezoelectric member so as to decrease contact wear between the piezoelectric member and a lens barrel. According to exemplary embodiments of the present disclosure, driving reliability of the piezoelectric member maybe improved by decreasing contact wear due to the contact between the lens barrel and the piezoelectric member.
Abstract translation: 致动器可以包括延伸成沿光轴方向伸长的压电元件; 以及设置在压电元件上以减小压电元件与透镜镜筒之间的接触磨损的磁体。 根据本公开的示例性实施例，压电元件的驱动可靠性可以通过降低由于镜筒与压电元件之间的接触而导致的接触磨损而提高。
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公开(公告)号：US20130316291A1
公开(公告)日：2013-11-28
申请号：US13953580
申请日：2013-07-29
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Sung Kwon Wi , Young Seuck Yoo , Jeong Bok Kwak , Yong Suk Kim , Sang Moon Lee , Kang Heon Hur
IPC: H01F41/04
CPC classification number: H01F41/04 , H01F17/0013 , H01F27/292 , H01F41/041 , Y10T29/4902
Abstract: The present invention relates to a stacked chip inductor. According to one aspect of the present invention, provided is an inductor including: a stacked structure; and an external electrode structure formed outside of the stacked structure, wherein the stacked structure: an insulating layer; and a polymer layer is stacked on the insulating layer.
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Patent Agency Ranking
公开(公告)号：US20130133925A1
公开(公告)日：2013-05-30
申请号：US13656854
申请日：2012-10-22
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Woon Chun Kim , Kang Heon Hur
CPC classification number: H01B13/34 , B82Y30/00 , B82Y40/00 , H01B1/04 , H01B1/24 , H01L31/022466 , H01L31/1884 , H01M4/1393 , H01M4/96 , Y02E10/50
Abstract: Disclosed herein are a method for manufacturing a graphene transparent electrode and a graphene transparent electrode manufactured by the method. The method includes: providing a graphene oxide solution: forming a metal thin film on a glass substrate; coating the graphene oxide solution on the metal thin film, followed by drying; primarily reducing the thus obtained graphene oxide by using a reducing agent, to obtain reduced graphene oxide; secondarily reducing the reduced graphene oxide by heat treatment under the inert atmosphere, to form a reduced layer; compressing a transparent film on the reduced layer; and etching the metal film by an etching solution. The method enables a graphene transparent electrode having economical feasibility and excellent electric conductivity to be manufactured.
Abstract translation: 本文公开了通过该方法制造石墨烯透明电极和石墨烯透明电极的方法。 该方法包括：提供石墨烯氧化物溶液：在玻璃基板上形成金属薄膜; 将氧化石墨烯溶液涂覆在金属薄膜上，然后干燥; 通过使用还原剂主要还原由此获得的氧化石墨烯，以获得还原的氧化石墨烯; 通过在惰性气氛下热处理二次还原还原的石墨烯，形成还原层; 压缩还原层上的透明膜; 并通过蚀刻溶液蚀刻金属膜。 该方法能够制造具有经济可行性和优异的导电性的石墨烯透明电极。
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公开(公告)号：US10707012B2
公开(公告)日：2020-07-07
申请号：US14961414
申请日：2015-12-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jong Suk Jeong , Kang Heon Hur , Seong Jae Lee , Jung Wook Seo , Hiroyuki Matsumoto , Chul Min Sim , Jong Sik Yoon
Abstract: A chip electronic component includes a magnetic body including magnetic metal powder particles, an internal coil unit embedded in the magnetic body, and a cover unit disposed on at least one of upper and lower surfaces of the magnetic body and including a magnetic metal plate. The magnetic metal plate is cracked and includes a plurality of metal fragments.
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公开(公告)号：US10256200B2
公开(公告)日：2019-04-09
申请号：US15877021
申请日：2018-01-22
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dae Hyun Park , Han Kim , Kang Heon Hur , Young Gwan Ko , Jung Ho Shim
Abstract: An electronic component package and a method of manufacturing the same are provided. The electronic component package includes a frame having a through-hole, an electronic component disposed in the through-hole of the frame, and a redistribution part disposed at one side of the frame and the electronic component. One or more first wiring layers of the frame are electrically connected to the electronic component through the redistribution part.
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公开(公告)号：US09991744B2
公开(公告)日：2018-06-05
申请号：US15196426
申请日：2016-06-29
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Jong Lee , Han Kim , Tae Ho Yun , Kang Heon Hur , Su Bong Jang
CPC classification number: H02J50/10 , H01F27/006 , H01F38/14 , H01F2038/143 , H02J7/025 , H02J50/80 , H02J50/90 , H04B5/0037
Abstract: A wireless power receiving device includes a first coil partially disposed in an outer region and configured to transmit and/or receive data; and a second coil disposed inwardly of an inner boundary line of the outer region and configured to receive wirelessly transmitted power, wherein a center defined by an inner boundary line and a center defined by an outer boundary line of the second coil are different from each other.
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公开(公告)号：US09984979B2
公开(公告)日：2018-05-29
申请号：US15297831
申请日：2016-10-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dae Hyun Park , Han Kim , Kang Heon Hur , Young Gwan Ko , Jung Ho Shim
IPC: H05K7/00 , H01L23/538 , H01L25/10 , H01L21/48 , H01L25/00 , H01L21/683 , H01L23/48 , H01L23/00 , H05K1/02 , H05K1/18 , H01L21/56
CPC classification number: H01L23/5389 , H01L21/4853 , H01L21/4857 , H01L21/486 , H01L21/568 , H01L21/6836 , H01L23/3128 , H01L23/48 , H01L23/5383 , H01L23/5384 , H01L23/5386 , H01L24/00 , H01L24/19 , H01L24/20 , H01L24/48 , H01L25/105 , H01L25/50 , H01L2221/68372 , H01L2221/68386 , H01L2224/0401 , H01L2224/04105 , H01L2224/05569 , H01L2224/05572 , H01L2224/12105 , H01L2224/16238 , H01L2224/24137 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/15311 , H01L2924/181 , H01L2924/18162 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/3511 , H05K1/0271 , H05K1/185 , H05K2201/10674 , H01L2924/00014 , H01L2924/00012
Abstract: The present disclosure relates to a fan-out semiconductor package and a method of manufacturing the same. The fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole; an encapsulant encapsulating at least portions of the first connection member and the semiconductor chip; and a second connection member disposed on the first connection member and the semiconductor chip. The first connection member includes a first insulating layer, a first redistribution layer and a second redistribution layer disposed on one surface and the other surface of the first insulating layer opposing the one surface thereof, respectively, a second insulating layer disposed on the first insulating layer and covering the first redistribution layer, and a third redistribution layer disposed on the second insulating layer. A fan-out semiconductor package may include one or more connection units instead of the first connection member.
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