公开(公告)号：US20230084640A1

公开(公告)日：2023-03-16

申请号：US17684732

申请日：2022-03-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Nam Jung LEE ,  Tae Yoon KIM

IPC: H03H9/10 ,  H03H9/17 ,  H03H3/02

Abstract: An acoustic resonator package includes a substrate, a cap including a protrusion portion protruding toward the substrate, an acoustic resonator disposed between the substrate and the cap and including a first electrode, a piezoelectric layer, and a second electrode, a metal layer connected to one of the first electrode and the second electrode, and a conductive pad at least partially disposed between the protrusion portion and the metal layer and extending in a first direction different from a second direction in which the acoustic resonator faces the conductive pad.

公开(公告)号：US20190386641A1

公开(公告)日：2019-12-19

申请号：US16190573

申请日：2018-11-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Kyung LEE ,  Tae Yoon KIM ,  Jong Woon KIM ,  Moon Chul LEE ,  Yong Jin KANG ,  Nam Jung LEE

IPC: H03H9/17 ,  H03H9/58 ,  H03H9/13 ,  H03H3/02

Abstract: An acoustic resonator includes a substrate, and a resonant portion comprising a center portion in which a first electrode, a piezoelectric layer and a second electrode are sequentially laminated on the substrate, and an extending portion disposed along a periphery of the center portion, wherein the resonant portion is configured to have an asymmetrical polygonal plane, an insertion layer is disposed below the piezoelectric layer in the extending portion, and the piezoelectric layer is configured to have a top surface which is raised to conform to a shape of the insertion layer, and the insertion layer is configured to have an asymmetrical polygonal shape corresponding to a shape of the extending portion.

公开(公告)号：US20180068915A1

公开(公告)日：2018-03-08

申请号：US15807805

申请日：2017-11-09

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Pil Joong KANG ,  Kwang Su KIM ,  Ji Hye NAM ,  Jeong Il LEE ,  Jong Hyeong SONG ,  Yun Sung KANG ,  Seung Joo SHIN ,  Nam Jung LEE

IPC: H01L23/10 ,  H03H3/02 ,  H03H9/13 ,  H03H9/02 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L23/10 ,  H01L21/4817 ,  H01L23/055 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49827 ,  H03H3/02 ,  H03H9/02007 ,  H03H9/1014 ,  H03H9/13 ,  H03H2003/021

Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.

公开(公告)号：US20200336131A1

公开(公告)日：2020-10-22

申请号：US16525758

申请日：2019-07-30

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Yoon Sok PARK ,  Dong Hoe KIM ,  Tah Joon PARK ,  Won Kyu JEUNG ,  Nam Jung LEE

IPC: H03H9/54 ,  H03H9/15 ,  H03H9/02

Abstract: An acoustic resonator includes: an upper electrode including a first active region disposed on an upper portion of a piezoelectric layer, and a first extended region extended from the first active region; a lower electrode including a second active region disposed on a lower portion of the piezoelectric layer, and a second extended region extended from the second active region; a first metal layer including a first resistance reduction region disposed on the first extended region; and a second metal layer including a second resistance reduction region disposed on the second extended region. The first metal layer includes a first conductive link region extended from the first resistance reduction region. The second metal layer includes a second conductive link region extended from the second resistance reduction region. The first and second conductive link regions correspond to respective portions of a side boundary of the first and second active regions.

公开(公告)号：US20200169246A1

公开(公告)日：2020-05-28

申请号：US16435621

申请日：2019-06-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Yoon KIM ,  Tae Kyung LEE ,  Sang Kee YOON ,  Sung Jun LEE ,  Chang Hyun LIM ,  Nam Jung LEE ,  Tae Hun LEE ,  Moon Chul LEE

IPC: H03H9/17 ,  H03H9/13 ,  H03H9/02

Abstract: An acoustic resonator includes a substrate, an insulation layer disposed on the substrate, a resonating portion disposed on the insulation layer and having a first electrode, a piezoelectric layer, and a second electrode, stacked thereon, a cavity disposed between the insulation layer and the resonating portion, a protruded portion having a plurality of protrusions disposed on a lower surface of the cavity, and a hydrophobic layer disposed on an upper surface of the cavity and a surface of the protruded portion.

公开(公告)号：US20200091888A1

公开(公告)日：2020-03-19

申请号：US16356164

申请日：2019-03-18

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae Hun LEE ,  Tae Yoon KIM ,  Moon Chul LEE ,  Chang Hyun LIM ,  Nam Jung LEE ,  Il Han LEE

IPC: H03H9/02 ,  H03H9/17 ,  H03H3/02

Abstract: A bulk-acoustic wave resonator includes a substrate, a first layer, a second layer, a membrane layer, and a resonance portion. The substrate includes a substrate protection layer. The first layer is disposed on the substrate protection layer. The second layer is disposed outside of the first layer. The membrane layer forms a cavity with the substrate protection layer and the first layer. The resonance portion is disposed on the membrane layer. Either one or both of the substrate protection layer and the membrane layer includes a protrusion disposed in the cavity.

公开(公告)号：US20170271222A1

公开(公告)日：2017-09-21

申请号：US15275603

申请日：2016-09-26

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Pil Joong KANG ,  Kwang Su KIM ,  Ji Hye NAM ,  Jeong Il LEE ,  Jong Hyeong SONG ,  Yun Sung KANG ,  Seung Joo SHIN ,  Nam Jung LEE

IPC: H01L23/10 ,  H03H9/13 ,  H03H9/02 ,  H03H3/02 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L23/10 ,  H01L21/4817 ,  H01L23/055 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49827 ,  H03H3/02 ,  H03H9/02007 ,  H03H9/1014 ,  H03H9/13 ,  H03H2003/021

Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.