公开(公告)号：US20230199976A1

公开(公告)日：2023-06-22

申请号：US17726896

申请日：2022-04-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Guh Hwan LIM ,  Chi Seong KIM ,  Won Seok LEE ,  Jin Oh PARK ,  Yu Mi KIM ,  Sang Yun LEE ,  Eun Sun KIM

IPC: H05K3/46 ,  H05K3/40 ,  H05K1/11

CPC classification number: H05K3/4697 ,  H05K3/4038 ,  H05K3/4644 ,  H05K1/115 ,  H05K2201/09036

Abstract: A printed circuit board includes a first insulating layer having a through cavity and containing an insulating material. A length between one side surface and the other side surface opposite to the one side surface of the through cavity is greater than a thickness of the first insulating layer, and the first insulating layer includes a recess located in each of an upper edge and a lower edge of the one side surface of the through cavity.

公开(公告)号：US20150061817A1

公开(公告)日：2015-03-05

申请号：US14289302

申请日：2014-05-28

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Young Min LEE ,  Geun Young PARK ,  Sang Yun LEE ,  Jae Sun WON ,  Suk Hyeon CHO ,  Tae Won HEO

IPC: H01F27/28

CPC classification number: H01F17/0013 ,  H01F17/0033 ,  H01F17/062

Abstract: A coil component may include: a base board having an accommodation portion disposed therein and having conductive patterns disposed within the accommodation portion; an annular core disposed in the accommodation portion; and a laminated board laminated on the base board and having conductive patterns disposed on one surface thereof. The conductive patterns of the laminated board are connected to the conductive patterns of the base board to form a coil.

Abstract translation: 线圈部件可以包括：基板，其具有设置在其中的容纳部分，并且具有布置在容纳部分内的导电图案; 设置在容纳部中的环状芯体; 以及叠层在基板上并且具有设置在其一个表面上的导电图案的层压板。 层压板的导电图案连接到基板的导电图案以形成线圈。