Capacitor component
    1.
    发明授权

    公开(公告)号:US10903003B2

    公开(公告)日:2021-01-26

    申请号:US16104570

    申请日:2018-08-17

    Abstract: A capacitor component includes: a semiconductor substrate including first and second portions, a trench penetrating through the substrate from one surface of the substrate to the other surface of the substrate to separate the first and second portions of the substrate from each other, a dielectric layer disposed in the trench and on the one surface of the substrate; a first pad electrode and a second pad electrode spaced apart from each other, and penetrating through the dielectric layer to be in contact with the first and second portions of the substrate, respectively, and a passivation layer disposed on the dielectric layer, covering portions of the first pad electrode and the second pad electrode, and exposing at least a portion of each of the first pad electrode and the second pad electrode.

    MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20210233715A1

    公开(公告)日:2021-07-29

    申请号:US17230427

    申请日:2021-04-14

    Abstract: A multilayer ceramic capacitor includes a body having a dielectric layer and internal electrodes disposed to be alternately exposed to the third and fourth surfaces with the dielectric layer interposed therebetween. External electrodes include connection parts respectively formed on opposing surfaces of the body, band parts formed to extend from the connection parts to portions of side surfaces of the body, and corner parts in which the connection parts and the band parts are contiguous. A thickness of each of the external electrodes may be 50 nm to 2 μm. The external electrodes may be formed using a barrel-type sputtering method. A ratio t2/t1 may satisfy 0.7 to 1.2, where t1 is a thickness of each connection part and t2 is a thickness of each band part. A ratio t3/t1 may satisfy 0.7 to 1.0, where t3 is a thickness of each corner part.

    Method of manufacturing a multilayer ceramic capacitor

    公开(公告)号:US11621127B2

    公开(公告)日:2023-04-04

    申请号:US17230427

    申请日:2021-04-14

    Abstract: A multilayer ceramic capacitor includes a body having a dielectric layer and internal electrodes disposed to be alternately exposed to the third and fourth surfaces with the dielectric layer interposed therebetween. External electrodes include connection parts respectively formed on opposing surfaces of the body, band parts formed to extend from the connection parts to portions of side surfaces of the body, and corner parts in which the connection parts and the band parts are contiguous. A thickness of each of the external electrodes may be 50 nm to 2 μm. The external electrodes may be formed using a barrel-type sputtering method. A ratio t2/t1 may satisfy 0.7 to 1.2, where t1 is a thickness of each connection part and t2 is a thickness of each band part. A ratio t3/t1 may satisfy 0.7 to 1.0, where t3 is a thickness of each corner part.

    Multilayer ceramic capacitor
    6.
    发明授权

    公开(公告)号:US11011313B2

    公开(公告)日:2021-05-18

    申请号:US15975198

    申请日:2018-05-09

    Abstract: A multilayer ceramic capacitor includes a body having a dielectric layer and internal electrodes disposed to be alternately exposed to the third and fourth surfaces with the dielectric layer interposed therebetween. External electrodes include connection parts respectively formed on opposing surfaces of the body, band parts formed to extend from the connection parts to portions of side surfaces of the body, and corner parts in which the connection parts and the band parts are contiguous. A thickness of each of the external electrodes may be 50 nm to 2 μm. The external electrodes may be formed using a barrel-type sputtering method. A ratio t2/t1 may satisfy 0.7 to 1.2, where t1 is a thickness of each connection part and t2 is a thickness of each band part. A ratio t3/t1 may satisfy 0.7 to 1.0, where t3 is a thickness of each corner part.

    Thin-film ceramic capacitor
    8.
    发明授权

    公开(公告)号:US10199167B2

    公开(公告)日:2019-02-05

    申请号:US15642025

    申请日:2017-07-05

    Abstract: A thin-film ceramic capacitor includes a body, a plurality of dielectric layers and first and second electrode layers alternately disposed on a substrate in the body, first and second electrode pads disposed on an external surface of the body, and a plurality of vias disposed in the body, the plurality of dielectric layers and first and second electrode layers having inclined etched surfaces exposed to the plurality of vias, a first via, of the plurality of vias, being connected to the inclined surface of the first electrode layer, and a second via, of the plurality of vias, being connected to the inclined surface of the second electrode layer.

    Multilayer ceramic capacitor
    10.
    发明授权

    公开(公告)号:US11721489B2

    公开(公告)日:2023-08-08

    申请号:US17230430

    申请日:2021-04-14

    Abstract: A multilayer ceramic capacitor includes a body having a dielectric layer and internal electrodes disposed to be alternately exposed to the third and fourth surfaces with the dielectric layer interposed therebetween. External electrodes include connection parts respectively formed on opposing surfaces of the body, band parts formed to extend from the connection parts to portions of side surfaces of the body, and corner parts in which the connection parts and the band parts are contiguous. A thickness of each of the external electrodes may be 50 nm to 2 μm. The external electrodes may be formed using a barrel-type sputtering method. A ratio t2/t1 may satisfy 0.7 to 1.2, where t1 is a thickness of each connection part and t2 is a thickness of each band part. A ratio t3/t1 may satisfy 0.7 to 1.0, where t3 is a thickness of each corner part.

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