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公开(公告)号:US20170084719A1
公开(公告)日:2017-03-23
申请号:US15229930
申请日:2016-08-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hoyoung KIM , SANG WON BAE , Jae-Jik BAEK , Wonsang CHOI
IPC: H01L29/66 , C09K13/00 , H01L21/3213 , H01L21/28 , H01L21/3205
CPC classification number: H01L29/66545 , C09K13/00 , H01L21/28017 , H01L21/28255 , H01L21/32055 , H01L21/32134 , H01L29/66553 , H01L29/66795 , H01L29/7848
Abstract: The present disclosure relates to an etchant, a method of making an etchant, an etching method and a method of fabricating a semiconductor device using the same. The etching method includes supplying an etchant on an etch-target layer to etch the etch-target layer in a wet etch manner. The etchant contains a basic compound and a sugar alcohol, and the basic compound contains ammonium hydroxide or tetraalkyl ammonium hydroxide. In the etchant, the sugar alcohol has 0.1 to 10 parts by weight for every 100 parts by weight of the basic compound.
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公开(公告)号:US20240336839A1
公开(公告)日:2024-10-10
申请号:US18508941
申请日:2023-11-14
Applicant: Samsung Electronics Co,. Ltd.
Inventor: GAYOUNG SONG , JUNG-MIN OH , TAE SOO KWON , JUN-EUN LEE , SANG WON BAE , Minjae SUNG , YOUN SUG YOO , WOOK CHANG
IPC: C09K13/06 , H01L21/3213 , H01L21/768
CPC classification number: C09K13/06 , H01L21/32134 , H01L21/76841
Abstract: A titanium nitride etchant composition and a method of forming a semiconductor device using the same are provided. The titanium nitride etchant composition includes hydrogen peroxide, phosphoric acid, and an amine compound, wherein the amine compound includes two or more nitrogen atoms.
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公开(公告)号:US20190136132A1
公开(公告)日:2019-05-09
申请号:US15973486
申请日:2018-05-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: HOON HAN , SANG WON BAE , YOUNG TAEK HON , JAEWAN PARK , JINUK LEE , JUNGHUN LIM
IPC: C09K13/06 , H01L21/311
Abstract: A composition for etching may include phosphoric acid, an ammonium-based compound, at least one of hydrochloric acid or a polyphosphate-based compound, and a silicon-containing compound.
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