公开(公告)号：US20220382624A1

公开(公告)日：2022-12-01

申请号：US17885216

申请日：2022-08-10

Applicant: Samsung Electronics Co., LTD.

Inventor： Byungchul KIM ,  Kiseok KIM ,  Mingyu KIM ,  Jaemin OH ,  Sanghyun LEE

IPC: G06F11/07 ,  G06F9/4401

Abstract: The present disclosure refers to apparatuses and methods for initializing electronic devices. An electronic device according to various embodiments includes a memory, and a processor operatively connected to the memory. The processor is configured to record, in the memory, software binaries received from an external device during a download mode. The processor is further configured to, when the download mode has ended, perform booting in a normal mode using a bootloader based on a determination indicating that a predetermined software binary is present among the software binaries recorded in the memory, and perform booting in a recovery mode using the bootloader based on the determination indicating that the predetermined software binary is absent from among the software binaries recorded in the memory.

公开(公告)号：US20240194553A1

公开(公告)日：2024-06-13

申请号：US18374123

申请日：2023-09-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinyoung KIM ,  Wonbin SHIN ,  Kiseok KIM ,  Jihye SHIM

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/29 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10 ,  H01L25/16 ,  H10B80/00

CPC classification number: H01L23/3135 ,  H01L23/296 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/162 ,  H10B80/00 ,  H01L24/16 ,  H01L2224/08113 ,  H01L2224/08145 ,  H01L2224/08225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/97 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/3511

Abstract: A semiconductor package includes a first chip including a first substrate, a first wiring layer on the first substrate, and a plurality of through-electrodes to be connected to the first wiring layer and protruding from a lower surface of the first substrate, a double gap-fill layer covering a side surface and a lower surface of the first chip and a protruding portion of the through-electrode and having a double layer structure, a second chip disposed on the first chip and the double gap-fill layer, including a second wiring layer and a second substrate on the second wiring layer, and bonded to the first chip by hybrid bonding, and a bump on a lower surface of the first chip and connected to the through-electrode.

公开(公告)号：US20250105133A1

公开(公告)日：2025-03-27

申请号：US18828196

申请日：2024-09-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinyoung KIM ,  Okseon YOON ,  Jiyoung YOON ,  Kiseok KIM ,  Jihye SHIM

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L25/03

Abstract: A semiconductor package includes a redistribution structure including a redistribution layer including copper (Cu) and an insulating layer surrounding the redistribution layer, a semiconductor chip mounted on the redistribution structure and including connection pads, internal connection terminals between the redistribution structure and the semiconductor chip electrically connecting the redistribution layer to the connection pads, external connection terminals attached under the redistribution structure and electrically connected to the redistribution layer, and an encapsulant configured to surround the semiconductor chip and the internal connection terminals on the redistribution structure. The insulating layer includes an insulating material of which K is 20 to 100 in a TC index according to equation below. K = U T ( α 1 - α 2 ) × Δ ⁢ T × E [ TC ⁢ INDEX ]

公开(公告)号：US20240337392A1

公开(公告)日：2024-10-10

申请号：US18744262

申请日：2024-06-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junggeon KIM ,  Hyunho KIM ,  Yongjae SONG ,  Kiseok KIM ,  Heedong NO ,  Duhan JUNG

IPC: F24F1/12 ,  F24F13/24

CPC classification number: F24F1/12 ,  F24F13/24 ,  F24F2013/242

Abstract: The present disclosure relates to a noise shielding device for implementing low noise in a heat pump outdoor unit of an air conditioning device (e.g. an air conditioner). The noise shielding device may comprise: a housing comprising a first surface exposed to the outside, open in the upward direction, and comprises a first sound insulating member comprising a sound insulating material in which a compressor is accommodated in an internal space thereof; and at least one first anti-vibration groove formed on the first surface of the first sound insulating member.

公开(公告)号：US20230112891A1

公开(公告)日：2023-04-13

申请号：US17852614

申请日：2022-06-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinyoung KIM ,  Kiseok KIM ,  Okseon YOON

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/538 ,  H01L25/10 ,  C09K11/06

Abstract: Disclosed are semiconductor packages and their fabrication methods. The semiconductor package includes a redistribution substrate that includes an organic dielectric layer and a metal pattern in the organic dielectric layer, and a semiconductor chip on the redistribution substrate. The organic dielectric layer has a maximum absorbance equal to or greater than about 0.04 at a first wavelength range, and a fluorescence intensity equal to or greater than about 4×103 at the first wavelength range. The first wavelength range is about 450 nm to about 650 nm.