公开(公告)号：US10276373B2

公开(公告)日：2019-04-30

申请号：US15490976

申请日：2017-04-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong Chul Jeong ,  Tae Kyu Lee ,  Sung Sik Park ,  Joon Soo Park ,  Kwang Sub Yoon ,  Boo Hyun Ham

IPC: H01L21/027 ,  G03F7/09 ,  G03F7/075 ,  G03F7/42 ,  H01L21/311 ,  H01L21/266 ,  H01L21/768 ,  H01L21/8234

Abstract: A method for manufacturing a semiconductor device includes forming an etch target layer on a semiconductor substrate, forming a first photoresist pattern disposed on the etch target layer, irradiating ultraviolet (UV) light in an oxygen-containing atmosphere to remove the first photoresist pattern from the etch target layer, and forming a second photoresist pattern on the etch target layer.

公开(公告)号：US10553429B2

公开(公告)日：2020-02-04

申请号：US15355360

申请日：2016-11-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Boo Hyun Ham ,  Hyun Jae Kang ,  Sung Sik Park ,  Yong Kug Bae ,  Kwang Sub Yoon ,  Bum Joon Youn ,  Hyun Chang Lee

IPC: H01L21/312 ,  H01L21/033 ,  H01L23/544

Abstract: A method of forming a pattern of a semiconductor device includes forming a mask and a sacrificial layer on a substrate, etching the sacrificial layer in a first area of the substrate to form first units, each having a first width and a first distance from an adjacent unit, etching the sacrificial layer in a second area of the substrate to form second units, each having a second width equal to the first distance and being spaced apart from an adjacent unit by a second distance equal to the first width, forming a spacer conformally covering the first and second units, the spacer having a first thickness and being merged between the second units, removing a portion of the spacer on upper surfaces of the first and second units, and etching the mask in a region from which first and second units have been removed.