公开(公告)号：US20230005980A1

公开(公告)日：2023-01-05

申请号：US17671794

申请日：2022-02-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Boseong KIM ,  Bumsuk KIM ,  Hyeyeon PARK ,  Jeongmin BAE ,  Yunki LEE

IPC: H01L27/146

Abstract: An image sensor includes: a substrate, having first and second surfaces opposing each other in a first direction, on which a plurality of unit pixels are arranged, the plurality of unit pixels including a normal pixel, an autofocusing pixel, and a compensation pixel in a direction, parallel to the first surface; a photodiode disposed in the substrate in each of the plurality of unit pixels; and a device isolation layer disposed between the plurality of unit pixels. The unit pixels include color filters, separated from each other by a grid, and microlenses disposed on the color filters. The compensation pixel is disposed on one side of the autofocusing pixel and includes a compensation microlens, smaller than a normal microlens included in the normal pixel, and a transparent color filter separated from adjacent color filters by a compensation grid smaller than a normal grid included in the normal pixel.

公开(公告)号：US20170111308A1

公开(公告)日：2017-04-20

申请号：US15297623

申请日：2016-10-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Boseong KIM ,  Sujeong YOON ,  Jinseok KANG ,  Jaeyoung LEE ,  Dongho JANG

IPC: H04L12/58 ,  H04W4/12

CPC classification number: H04L51/34 ,  G06Q10/107 ,  H04L51/30 ,  H04W4/12 ,  H04W88/02

Abstract: A message processing operation of an electronic device that includes a processor is provided. The message processing operation includes running an application for processing a message, providing a screen displaying a first unread message and a second unread message through the application, and processing message read confirmation of the first unread message at a first time and processing message read confirmation of the second unread message at a second time that is different from the first time.

公开(公告)号：US20240323566A1

公开(公告)日：2024-09-26

申请号：US18609154

申请日：2024-03-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunseok SONG ,  Boseong KIM

IPC: H04N25/77

CPC classification number: H04N25/77

Abstract: An image sensor includes a substrate having a first surface and a second surface opposite to each other in a first direction, and a pixel array including a plurality of pixels arranged in a second direction perpendicular to the first direction and a third direction perpendicular to the second direction. The pixel array includes a first pixel and a second pixel adjacent to the first pixel. Each of the first pixel and the second pixel is inside the substrate and includes a pair of photodiodes. The first pixel includes a first pixel interior separation layer between the pair of photodiodes and extending in the first direction. The second pixel includes a second pixel interior separation layer between the pair of photodiodes and extending in the first direction.

公开(公告)号：US20180026022A1

公开(公告)日：2018-01-25

申请号：US15652559

申请日：2017-07-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwang-Ryul LEE ,  Boseong KIM ,  TAEDUK NAM ,  WANGJU LEE

IPC: H01L25/18 ,  H01L25/065 ,  H01L21/56 ,  H01L23/552 ,  H01L23/00 ,  H01L25/10 ,  H01L23/538 ,  H01L23/31

CPC classification number: H01L25/18 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/552 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/1443 ,  H01L2924/19105 ,  H01L2924/00

Abstract: A solid state drive package is provided. The solid state drive package may include an integrated circuit substrate including: a lower redistribution layer; a first chip and a second chip provided on the lower redistribution layer; and a connection substrate provided on the lower redistribution layer, the connection substrate provided on an outer periphery of the first chip and the second chip; and a plurality of third chips provided on the integrated circuit substrate. The plurality of third chips are electrically connected to the first chip and the second chip via the connection substrate and the lower redistribution layer.