公开(公告)号：US20220199616A1

公开(公告)日：2022-06-23

申请号：US17394991

申请日：2021-08-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Inwon PARK ,  Bosoon KIM ,  Jongsoon PARK

IPC: H01L27/088 ,  H01L21/762 ,  H01L27/02

Abstract: A semiconductor device includes a substrate including a boundary region between first and second regions, first active patterns on the first region, second active patterns on the second region, and an isolation insulating pattern on the boundary region between the first and second active patterns. A width of at least some of the first active patterns have different widths. Widths of the second active patterns may be equal to each other. A bottom surface of the isolation insulating pattern includes a first bottom surface adjacent to a corresponding first active pattern, a second bottom surface adjacent to a corresponding second active pattern, and a third bottom surface between the first bottom surface and the second bottom surface. The third bottom surface is located at a different height from those of the first and second bottom surfaces with respect to a bottom surface of the substrate.

公开(公告)号：US20190333823A1

公开(公告)日：2019-10-31

申请号：US16503728

申请日：2019-07-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wonhyuk LEE ,  JEONGYUN LEE ,  Yongseok LEE ,  Bosoon KIM ,  SANGDUK PARK ,  Seungchul OH ,  YOUNGMOOK OH

IPC: H01L21/8234 ,  H01L29/08 ,  H01L27/088 ,  H01L21/762

Abstract: A semiconductor device includes a device isolation layer provided on a substrate, the device isolation layer defining first and second sub-active patterns, first and second gate electrodes crossing the first and second sub-active patterns, respectively, and an isolation structure provided on the device isolation layer between the first and second sub-active patterns. The first and second sub-active patterns extend in a first direction and are spaced apart from each other in the first direction. The device isolation layer includes a diffusion break region disposed between the first and second sub-active patterns. The isolation structure covers a top surface of the diffusion break region.

公开(公告)号：US20230307451A1

公开(公告)日：2023-09-28

申请号：US18326522

申请日：2023-05-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Inwon PARK ,  Bosoon KIM ,  Jongsoon PARK

IPC: H01L21/762 ,  H01L29/786 ,  H01L29/775 ,  H01L27/088 ,  H01L27/02 ,  H01L29/06 ,  H01L29/423

CPC classification number: H01L27/088 ,  H01L21/76224 ,  H01L27/0207 ,  H01L27/0886 ,  H01L29/0673 ,  H01L29/42392 ,  H01L29/775 ,  H01L29/78696

Abstract: A semiconductor device includes a substrate including a boundary region between first and second regions, first active patterns on the first region, second active patterns on the second region, and an isolation insulating pattern on the boundary region between the first and second active patterns. A width of at least some of the first active patterns have different widths. Widths of the second active patterns may be equal to each other. A bottom surface of the isolation insulating pattern includes a first bottom surface adjacent to a corresponding first active pattern, a second bottom surface adjacent to a corresponding second active pattern, and a third bottom surface between the first bottom surface and the second bottom surface. The third bottom surface is located at a different height from those of the first and second bottom surfaces with respect to a bottom surface of the substrate.

公开(公告)号：US20220122891A1

公开(公告)日：2022-04-21

申请号：US17562802

申请日：2021-12-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wonhyuk LEE ,  JEONGYUN LEE ,  Yongseok LEE ,  Bosoon KIM ,  SANGDUK PARK ,  Seungchul OH ,  YOUNGMOOK OH

IPC: H01L21/8234 ,  H01L21/762 ,  H01L27/088 ,  H01L29/08

Abstract: A semiconductor device includes a device isolation layer provided on a substrate, the device isolation layer defining first and second sub-active patterns, first and second gate electrodes crossing the first and second sub-active patterns, respectively, and an isolation structure provided on the device isolation layer between the first and second sub-active patterns. The first and second sub-active patterns extend in a first direction and are spaced apart from each other in the first direction. The device isolation layer includes a diffusion break region disposed between the first and second sub-active patterns. The isolation structure covers a top surface of the diffusion break region.

公开(公告)号：US20170200651A1

公开(公告)日：2017-07-13

申请号：US15405420

申请日：2017-01-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wonhyuk LEE ,  JEONGYUN LEE ,  Yongseok LEE ,  Bosoon KIM ,  SANGDUK PARK ,  Seungchul OH ,  YOUNGMOOK OH

IPC: H01L21/8234 ,  H01L21/762 ,  H01L29/08 ,  H01L27/088

CPC classification number: H01L21/823481 ,  H01L21/76224 ,  H01L21/823418 ,  H01L21/823431 ,  H01L21/823456 ,  H01L21/823814 ,  H01L27/088 ,  H01L27/0886 ,  H01L29/0847

Abstract: A semiconductor device includes a device isolation layer provided on a substrate, the device isolation layer defining first and second sub-active patterns, first and second gate electrodes crossing the first and second sub-active patterns, respectively, and an isolation structure provided on the device isolation layer between the first and second sub-active patterns. The first and second sub-active patterns extend in a first direction and are spaced apart from each other in the first direction. The device isolation layer includes a diffusion break region disposed between the first and second sub-active patterns. The isolation structure covers a top surface of the diffusion break region.