公开(公告)号：US20250016974A1

公开(公告)日：2025-01-09

申请号：US18407789

申请日：2024-01-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jihoon Chang ,  Changsik Kim ,  Jaejoon Song

IPC: H10B12/00 ,  H01L29/78

Abstract: A semiconductor device includes a substrate, a first transistor and a second transistor on the substrate, a bit line electrically connected to the first transistor, a channel layer on the bit line, a gate insulating layer on the channel layer, a word line on the gate insulating layer, a landing pad electrically connected to the channel layer, a connection pad electrically connected to the word line and the second transistor, and a division structure separating the landing pad from the connection pad. The division structure includes an intervening portion between the landing pad and the connection pad.

公开(公告)号：US20240072175A1

公开(公告)日：2024-02-29

申请号：US18300579

申请日：2023-04-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junhwa Song ,  Changsik Kim ,  Jaewon Na ,  Deokhwan Choi

IPC: H01L29/786 ,  H10B12/00

CPC classification number: H01L29/7869 ,  H01L29/78642 ,  H10B12/315

Abstract: A semiconductor device includes an upper conductive line on a substrate, a channel structure adjacent the upper conductive line, a gate dielectric film between the channel structure and the upper conductive line, and a conductive contact pattern electrically connected to the channel structure. The channel structure includes a main channel portion including an oxide semiconductor layer having a first composition, and a channel contact portion between the main channel portion and the conductive contact pattern. The channel contact portion is in contact with the conductive contact pattern and includes a material having a second composition that is different from the first composition.

公开(公告)号：US09825749B2

公开(公告)日：2017-11-21

申请号：US14665778

申请日：2015-03-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changsik Kim ,  Suckho Seo ,  Jiryang Chung ,  Inhyup Hwang

IPC: H04L5/00 ,  H04W48/02 ,  H04W84/12 ,  H04W84/18 ,  H04W48/14

CPC classification number: H04L5/0092 ,  H04W48/02 ,  H04W48/14 ,  H04W84/12 ,  H04W84/18

Abstract: A method for collecting an Access Point (AP) is provided. The method includes detecting, by a first device, tagging of a second device; when the tagging of the second device is detected, transmitting, by the first device, to the AP, a request message for requesting access to the second device; and when the access to the second device is allowed, transmitting, to the second device, AP information required for an AP connection.