公开(公告)号：US20240375293A1

公开(公告)日：2024-11-14

申请号：US18437837

申请日：2024-02-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungjoon Park ,  Jongseong Ko ,  Daeyong Kim ,  Donghyun Kim ,  Jisu Kim ,  Pyungkang Kim ,  Kihong Park ,  Jungjun Park ,  Jooyoung Park ,  Junhyeok Park ,  Hoseok Song ,  Chiho Ahn ,  Kongwoo Lee ,  Hyunyoung Lee ,  Chuyoung Choung ,  Jeongmin Hwang

IPC: B25J15/00 ,  B25J13/08

Abstract: An in-chamber maintenance apparatus may include a stage module including a stage body in a chamber having a hollow interior, an XY stage mounted on an upper surface of the stage body and movable in an X-axis and a Y-axis direction perpendicular to each other, and a first driving portion configured to drive the XY stage, and a gripper module including a gripper body coupled to an upper surface of the XY stage, a gripping portion supported by the gripper body and configured to move up and down and rotate with respect to a Z-axis perpendicular to the X-axis and the Y-axis to be inserted into the hollow interior, and a second driving portion configured to drive the gripping portion.

公开(公告)号：US20240379345A1

公开(公告)日：2024-11-14

申请号：US18394524

申请日：2023-12-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongmin Hwang ,  Jongseong Ko ,  Daeyong Kim ,  Donghyun Kim ,  Jisu Kim ,  Pyungkang Kim ,  Kihong Park ,  Jungjoon Park ,  Jungjun Park ,  Jooyoung Park ,  Junhyeok Park ,  Hoseok Song ,  Chiho Ahn ,  Kongwoo Lee ,  Hyunyoung Lee ,  Chuyoung Choung

IPC: H01L21/02 ,  G06T7/00

Abstract: An apparatus for cleaning a semiconductor fabrication chamber may include a cleaning module, an inspection module and a drive module. The cleaning module may clean an inner area of the semiconductor fabrication chamber in a non-contact manner. The inspection module may be configured to inspect a cleaning of the semiconductor fabrication chamber by the cleaning module. The drive module may be configured to move the cleaning module and the inspection module in the semiconductor fabrication chamber. Thus, the non-contact type cleaning module may effectively remove the contaminant on an inner wall of the semiconductor fabrication chamber having a complicated shape and/or a part on the inner wall of the semiconductor fabrication chamber having a complicated shape.

公开(公告)号：US20240379384A1

公开(公告)日：2024-11-14

申请号：US18608633

申请日：2024-03-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongseong Ko ,  Daeyong Kim ,  Donghyun Kim ,  Pyungkang Kim ,  Kihong Park ,  Jungjoon Park ,  Jungjun Park ,  Jooyoung Park ,  Hoseok Song ,  Kongwoo Lee ,  Hyunyoung Lee ,  Chuyoung Choung ,  Jeongmin Hwang ,  Jisu Kim ,  Junhyeok Park ,  Chiho Ahn

IPC: H01L21/67

Abstract: The present disclosure relates to wire grippers, wire processing apparatuses, and wire processing methods. An example wire gripper comprises a gripper body, a wire supply in the gripper body and supplying a wire, a wire cutting section including a cutter that cuts the wire supplied from the wire supply, a pressure roller below the wire supply and providing a guide groove to guide the wire supplied from the wire supply, a twister on a side of the pressure roller, and a reloader that drives an end of the wire to move from the wire supply to the twister. The twister holds and twists the end of the wire guided by the pressure roller.