公开(公告)号：US20160099218A1

公开(公告)日：2016-04-07

申请号：US14815937

申请日：2015-07-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Baik-woo LEE ,  Dong-hun LEE ,  Jae-gwon JANG ,  Chul-yong JANG

IPC: H01L23/552 ,  H01L21/78 ,  B29C70/78 ,  H01L21/56

CPC classification number: H01L23/552 ,  B29C70/78 ,  B29K2063/00 ,  B29L2009/005 ,  B29L2031/3481 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/18 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/85

Abstract: Provided is a method of manufacturing a semiconductor package. The method includes mounting a semiconductor device on a substrate; disposing a mold on the substrate, wherein the mold is formed to cover the semiconductor device such that at least one inner side surface of the mold has a slope; providing a molding material into the mold to encapsulate the semiconductor device; removing the mold from the substrate; and forming an electromagnetic shielding (EMS) layer to cover a top surface and side surfaces of the molding material.

Abstract translation: 提供一种半导体封装的制造方法。 该方法包括将半导体器件安装在衬底上; 在基板上设置模具，其中模具形成为覆盖半导体器件，使得模具的至少一个内侧表面具有斜面; 将模塑材料提供到模具中以封装半导体器件; 从基板上取出模具; 以及形成电磁屏蔽（EMS）层以覆盖模制材料的顶表面和侧表面。