公开(公告)号：US20220377875A1

公开(公告)日：2022-11-24

申请号：US17882418

申请日：2022-08-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chung-Hyo JUNG ,  Kang-Sik KIM ,  Young-San KIM ,  Won-Min KIM ,  Chi-Hyun CHO

IPC: H05K1/02 ,  H05K7/20 ,  H05K9/00 ,  H05K1/18

Abstract: According to various embodiments of the present invention, an electronic device can comprise: a circuit board; an electronic component arranged on one surface of the circuit board; a thermal conductive member arranged so as to correspond to the upper surface of the electronic component; and a thermal interface member arranged between the electronic component and the thermal conductive member and comprising a carbon fiber. The electronic device can be variously implemented according to embodiments.

公开(公告)号：US20200073460A1

公开(公告)日：2020-03-05

申请号：US16466089

申请日：2017-12-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong-Min LEE ,  Kwang-Eun GO ,  Kang-Sik KIM ,  Dong-Sub KIM ,  Young-San KIM ,  Won-Min KIM ,  Young-Hyun BAN ,  Min-Woo SONG ,  Chung-Hyo JUNG

IPC: G06F1/3206 ,  G06F1/08 ,  G06F1/324 ,  G06F1/20 ,  G06F1/3234

Abstract: Various embodiments of the present invention relate to an electronic device and a method for controlling heat generated on the surface of the electronic device. The electronic device may comprise a display and a processor, wherein the processor: displays, on the display, graphic elements at the request of a first application; during a first period of time, acquires first information corresponding to the graphic performance of the displayed graphic elements, and identifies a clock control level for controlling operation performance according to execution of the first application; and during a second period of time following the first period of time, identifies a clock value corresponding to the identified clock control level on the basis of the acquired first information, and controls the operation performance according to execution of the first application by using the identified clock value.

公开(公告)号：US20200352057A1

公开(公告)日：2020-11-05

申请号：US16763074

申请日：2018-08-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chung-Hyo JUNG ,  Kang-Sik KIM ,  Young-San KIM ,  Won-Min KIM ,  Chi-Hyun CHO

IPC: H05K7/20 ,  H01L23/552 ,  H05K9/00

Abstract: According to various embodiments of the present invention, an electronic device can comprise: a circuit board; an electronic component arranged on one surface of the circuit board; a thermal conductive member arranged so as to correspond to the upper surface of the electronic component; and a thermal interface member arranged between the electronic component and the thermal conductive member and comprising a carbon fiber. The electronic device can be variously implemented according to embodiments.

公开(公告)号：US20180248406A1

公开(公告)日：2018-08-30

申请号：US15757153

申请日：2016-08-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changseok BAE ,  Seungyeon KIM ,  Jongcheon WEE ,  Hwanseok CHOI ,  Jung-Su PARK ,  Kyunghwan LEE ,  Junhui LEE ,  Woojin JUNG ,  Chung-Hyo JUNG ,  Byoung-Uk YOON

IPC: H02J50/12 ,  H02J7/02 ,  G04G19/00 ,  H02J50/90 ,  H02J7/00

CPC classification number: H02J50/12 ,  G04G19/00 ,  H02J7/00 ,  H02J7/0044 ,  H02J7/02 ,  H02J7/025 ,  H02J50/90

Abstract: According to various embodiments, an electronic device configured to enable an external electronic device to be detachably mounted may include a housing, a power interface included in the housing and configured to be able to receive power from an external power source, a conductive pattern electrically coupled to the power interface and configured to be able to transmit power in a wirelessly fashion, and a plurality of members disposed around the conductive pattern and attracted by a magnet. Other various embodiments are also possible.