公开(公告)号：US20170155746A1

公开(公告)日：2017-06-01

申请号：US15287900

申请日：2016-10-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hae-Jung YANG ,  Seung-Joo LEE ,  Kwang-Eun GO ,  Kang-Sik KIM ,  Jae-Hoon WOO ,  Jong-Min LEE

IPC: H04M1/02 ,  H05K9/00 ,  H05K7/20

CPC classification number: H04M1/026 ,  G06F1/1637 ,  G06F1/203 ,  H04M1/0266 ,  H04M1/0277 ,  H04M1/0279 ,  H05K7/20509 ,  H05K9/0007

Abstract: A method for manufacturing an electronic device, according to the present disclosure, may include: detecting positions of one or more heat sources, which are disposed in a printed circuit board or in a display of the electronic device, or a path of the heat that is diffused from the heat sources; selecting a heat radiating structure to correspond to the positions of the heat sources or the diffusion path; selecting an adiabatic member or a heat radiating member, which is disposed based the selected heat radiating structure to block or radiate the heat transferred from the heat source; and forming the selected heat radiating structure or disposing the selected adiabatic member or heat radiating member on the periphery of the heat source or on the diffusion path. According to various embodiments of the disclosure, the heat radiation improvement can be maximized and/or improved by improving the structure of a heat radiation path of the electronic device and by selecting and disposing heat radiating members in appropriate positions.

公开(公告)号：US20220377875A1

公开(公告)日：2022-11-24

申请号：US17882418

申请日：2022-08-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chung-Hyo JUNG ,  Kang-Sik KIM ,  Young-San KIM ,  Won-Min KIM ,  Chi-Hyun CHO

IPC: H05K1/02 ,  H05K7/20 ,  H05K9/00 ,  H05K1/18

Abstract: According to various embodiments of the present invention, an electronic device can comprise: a circuit board; an electronic component arranged on one surface of the circuit board; a thermal conductive member arranged so as to correspond to the upper surface of the electronic component; and a thermal interface member arranged between the electronic component and the thermal conductive member and comprising a carbon fiber. The electronic device can be variously implemented according to embodiments.

公开(公告)号：US20200352057A1

公开(公告)日：2020-11-05

申请号：US16763074

申请日：2018-08-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chung-Hyo JUNG ,  Kang-Sik KIM ,  Young-San KIM ,  Won-Min KIM ,  Chi-Hyun CHO

IPC: H05K7/20 ,  H01L23/552 ,  H05K9/00

Abstract: According to various embodiments of the present invention, an electronic device can comprise: a circuit board; an electronic component arranged on one surface of the circuit board; a thermal conductive member arranged so as to correspond to the upper surface of the electronic component; and a thermal interface member arranged between the electronic component and the thermal conductive member and comprising a carbon fiber. The electronic device can be variously implemented according to embodiments.

公开(公告)号：US20200073460A1

公开(公告)日：2020-03-05

申请号：US16466089

申请日：2017-12-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong-Min LEE ,  Kwang-Eun GO ,  Kang-Sik KIM ,  Dong-Sub KIM ,  Young-San KIM ,  Won-Min KIM ,  Young-Hyun BAN ,  Min-Woo SONG ,  Chung-Hyo JUNG

IPC: G06F1/3206 ,  G06F1/08 ,  G06F1/324 ,  G06F1/20 ,  G06F1/3234

Abstract: Various embodiments of the present invention relate to an electronic device and a method for controlling heat generated on the surface of the electronic device. The electronic device may comprise a display and a processor, wherein the processor: displays, on the display, graphic elements at the request of a first application; during a first period of time, acquires first information corresponding to the graphic performance of the displayed graphic elements, and identifies a clock control level for controlling operation performance according to execution of the first application; and during a second period of time following the first period of time, identifies a clock value corresponding to the identified clock control level on the basis of the acquired first information, and controls the operation performance according to execution of the first application by using the identified clock value.