公开(公告)号：US20170076965A1

公开(公告)日：2017-03-16

申请号：US15203399

申请日：2016-07-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Nam Hoon Lee ,  Jungwoo Seo ,  Joonghan Shin ,  Byung Joo Oh ,  Jeongmin Lee ,  Gi-Nam Park ,  Jonghyun Lee

IPC: H01L21/67 ,  H01L21/687 ,  G02B5/00 ,  H05B3/00 ,  C23C14/48 ,  G02B5/20

CPC classification number: H01L21/67115 ,  C23C14/48 ,  G02B5/003 ,  G02B5/205 ,  H01L21/68735 ,  H01L21/6875 ,  H01L21/68757 ,  H05B3/0047

Abstract: A transparent plate and a substrate processing system including the same are disclosed. The substrate processing system may include a chamber, a lamp provided below the chamber, and a plate provided in the chamber to load a substrate. The plate may include a center region having a first transmittance value and an edge region having with a second transmittance value higher than the first transmittance value.

Abstract translation: 公开了一种透明板和包括该透明板的基板处理系统。 衬底处理系统可以包括腔室，设置在腔室下方的灯以及设置在腔室中以加载衬底的板。 该板可以包括具有第一透射率值的中心区域和具有比第一透射率值高的第二透射率值的边缘区域。

公开(公告)号：US11733077B2

公开(公告)日：2023-08-22

申请号：US17504212

申请日：2021-10-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sanga Bang ,  Geunhyung Kim ,  Sangmin Kim ,  Gi-Nam Park ,  Chul-Jun Park ,  Yong-Jun Ahn ,  JongJin Ahn ,  Min Kyun Lee ,  Sangkyung Lee ,  Kyubum Cho

IPC: G01F1/42 ,  G01F1/37

CPC classification number: G01F1/42 ,  G01F1/37

Abstract: A measurement carrier includes a housing having an internal space, and a flow-rate measuring device located within the internal space. A bottom surface of the housing includes a first inflow hole, a second inflow hole, and an outflow hole, which provide fluid communication between the internal space and an outer space. The flow-rate measuring device may include a first flow-rate measuring sensor in fluid communication with the first inflow hole, and a second flow-rate measuring sensor in fluid communication with the second inflow hole.

公开(公告)号：US20170098563A1

公开(公告)日：2017-04-06

申请号：US15250186

申请日：2016-08-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gi-Nam Park ,  Bokyung Jung ,  Leekwon Gil ,  Jungwoo Seo ,  Dongseok Baek ,  Nam Hoon Lee ,  Jonghyun Lee

IPC: H01L21/67 ,  H05B3/00

CPC classification number: H01L21/67115 ,  H01L21/68735 ,  H01L21/6875 ,  H01L21/68785 ,  H05B3/0047

Abstract: An apparatus for treating a substrate includes a chamber including a space in which a substrate is treated, a support member disposed in the chamber and supporting the substrate, and a heating member for heating the substrate. The space is divided into an upper space and a lower space by the support member. The support member includes a support plate receiving the substrate, a base supporting the support plate, exposing a bottom surface of the support plate and including a cut region formed in an edge portion of the base, and an adjustment block held in the cut region and coupled to the base. The cut region fluidly connects the upper space to the lower space. The adjustment block divides the cut region into a plurality of vents.

公开(公告)号：US20220336241A1

公开(公告)日：2022-10-20

申请号：US17543025

申请日：2021-12-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Wook Kim ,  Sang Min Kim ,  Ji Hun Kim ,  Gi-Nam Park ,  Chul-Jun Park ,  Yong-Jun Ahn ,  Youn Gon Oh ,  Byung Kook Yoo ,  Hyun Woo Lee ,  Jeong Hun Lim

IPC: H01L21/67 ,  H01L21/677

Abstract: A substrate transfer device includes a transfer unit configured to transfer, in a first direction, a carrier in which substrates are stored, an upper interface unit configured to move the transfer unit, a lower interface unit configured to receive the carrier from the transfer unit, and a controller configured to control the upper interface unit and the lower interface unit integrally such that the transfer unit and the carrier move in the first direction at the same time.

公开(公告)号：US10269594B2

公开(公告)日：2019-04-23

申请号：US15203399

申请日：2016-07-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Nam Hoon Lee ,  Jungwoo Seo ,  Joonghan Shin ,  Byung Joo Oh ,  Jeongmin Lee ,  Gi-Nam Park ,  Jonghyun Lee

IPC: H05B3/00 ,  F21V9/00 ,  G02B5/00 ,  G02B5/20 ,  C23C14/48 ,  H01L21/67 ,  H01L21/687

Abstract: A transparent plate and a substrate processing system including the same are disclosed. The substrate processing system may include a chamber, a lamp provided below the chamber, and a plate provided in the chamber to load a substrate. The plate may include a center region having a first transmittance value and an edge region having with a second transmittance value higher than the first transmittance value.

公开(公告)号：US12283502B2

公开(公告)日：2025-04-22

申请号：US17543025

申请日：2021-12-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Wook Kim ,  Sang Min Kim ,  Ji Hun Kim ,  Gi-Nam Park ,  Chul-Jun Park ,  Yong-Jun Ahn ,  Youn Gon Oh ,  Byung Kook Yoo ,  Hyun Woo Lee ,  Jeong Hun Lim

IPC: G06F7/00 ,  H01L21/67 ,  H01L21/677

Abstract: A substrate transfer device includes a transfer unit configured to transfer, in a first direction, a carrier in which substrates are stored, an upper interface unit configured to move the transfer unit, a lower interface unit configured to receive the carrier from the transfer unit, and a controller configured to control the upper interface unit and the lower interface unit integrally such that the transfer unit and the carrier move in the first direction at the same time.

公开(公告)号：US10964570B2

公开(公告)日：2021-03-30

申请号：US16529082

申请日：2019-08-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangkyung Lee ,  Yong-Jun Ahn ,  Taijo Jeon ,  Kyubum Cho ,  Jongsam Kim ,  Gi-Nam Park ,  Chul-Jun Park ,  Junyong Lee

IPC: H01L21/673 ,  H01L21/67 ,  B05B1/30

Abstract: A semiconductor wafer storage system includes a container that provides a space in which a semiconductor wafer is to be stored, a fluid supply that provides a fluid to the container, a connection part that receives the fluid from the fluid supply and transfers the fluid to the container, and a nozzle part that connects the connection part to the container. The container may include a coupling plate to which the nozzle part is coupled, and the nozzle part may include a first nozzle and a second nozzle.

公开(公告)号：US10665483B2

公开(公告)日：2020-05-26

申请号：US15250186

申请日：2016-08-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gi-Nam Park ,  Bokyung Jung ,  Leekwon Gil ,  Jungwoo Seo ,  Dongseok Baek ,  Nam Hoon Lee ,  Jonghyun Lee

IPC: H01L21/67 ,  H01L21/687 ,  H05B3/00

Abstract: An apparatus for treating a substrate includes a chamber including a space in which a substrate is treated, a support member disposed in the chamber and supporting the substrate, and a heating member for heating the substrate. The space is divided into an upper space and a lower space by the support member. The support member includes a support plate receiving the substrate, a base supporting the support plate, exposing a bottom surface of the support plate and including a cut region formed in an edge portion of the base, and an adjustment block held in the cut region and coupled to the base. The cut region fluidly connects the upper space to the lower space. The adjustment block divides the cut region into a plurality of vents.