公开(公告)号：US20210005475A1

公开(公告)日：2021-01-07

申请号：US16747783

申请日：2020-01-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyeongbin LIM ,  Hyeonjun Yun ,  Gwanghee Jo ,  Jewon Lee ,  Minsoo Han ,  Junhyung Kim ,  Seungdae Seok

IPC: H01L21/67 ,  H01L21/683 ,  H01L21/20 ,  H01L23/00

Abstract: In a wafer to wafer bonding method, a first wafer is vacuum suctions on a first surface of a lower stage and a second wafer is vacuum suctioned on a second surface of an upper stage. Pressure is applied to a middle portion of the first wafer by a lower push rod and pressure is applied to a middle portion of the second wafer by an upper push rod. Bonding of the first and second wafers propagates radially outwards. A bonding propagation position of the first and second wafers is detected. A ratio of protruding lengths of the lower push rod and the upper push rod is changed according to the bonding propagation position.

公开(公告)号：US12027401B2

公开(公告)日：2024-07-02

申请号：US17203036

申请日：2021-03-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gwanghee Jo ,  Dongjoo Moon ,  Siwoong Woo ,  Sunjung Kim ,  Donggil Shim ,  Huijae Kim ,  Seungdae Seok

IPC: H01L21/68 ,  G03F7/00 ,  H01L21/677 ,  H01L21/683

CPC classification number: H01L21/68 ,  G03F7/70775 ,  H01L21/67742 ,  H01L21/683 ,  H01L2224/75701 ,  H01L2224/75703

Abstract: A semiconductor substrate alignment device includes: a lower chuck; a lower chuck driving unit; an upper chuck above and overlapping the lower chuck; observation windows in the upper chuck, imaging units respectively configured to irradiate light through the observation windows and to obtain images by detecting light reflected from the semiconductor substrates; a distance sensor configured to detect a distance between an edge of the lower chuck and an edge of the upper chuck; and a control unit configured to identify first and second alignment keys from images of first and second semiconductor substrates, determine an alignment error value of the first and second semiconductor substrates, and compensate for the alignment error value by driving the lower chuck driving unit.

公开(公告)号：US11443965B2

公开(公告)日：2022-09-13

申请号：US16747783

申请日：2020-01-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyeongbin Lim ,  Hyeonjun Yun ,  Gwanghee Jo ,  Jewon Lee ,  Minsoo Han ,  Junhyung Kim ,  Seungdae Seok

IPC: H01L21/67 ,  H01L21/683 ,  H01L23/00 ,  H01L21/20

Abstract: A wafer bonding apparatus includes lower and upper stages, lower and upper push rods, a position detection sensor, and processing circuitry. The stages may vacuum suction respective wafers on respective surfaces of the stages based on a vacuum pressure being supplied to respective suction holes in the respective surfaces from a vacuum pump. The push rods are movable through respective center holes in the stages to apply pressure to respective middle regions of the respective wafers. The position detection sensor may generate information indicating a bonding propagation position of the wafers based on detecting at least one wafer through a detection hole in at least one stage. The processing circuitry may process the information to detect the bonding propagation position and cause a change of at least one of a ratio of protruding lengths of the push rods, or a ratio of suction areas of the stages.