公开(公告)号：US20210005475A1

公开(公告)日：2021-01-07

申请号：US16747783

申请日：2020-01-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyeongbin LIM ,  Hyeonjun Yun ,  Gwanghee Jo ,  Jewon Lee ,  Minsoo Han ,  Junhyung Kim ,  Seungdae Seok

IPC: H01L21/67 ,  H01L21/683 ,  H01L21/20 ,  H01L23/00

Abstract: In a wafer to wafer bonding method, a first wafer is vacuum suctions on a first surface of a lower stage and a second wafer is vacuum suctioned on a second surface of an upper stage. Pressure is applied to a middle portion of the first wafer by a lower push rod and pressure is applied to a middle portion of the second wafer by an upper push rod. Bonding of the first and second wafers propagates radially outwards. A bonding propagation position of the first and second wafers is detected. A ratio of protruding lengths of the lower push rod and the upper push rod is changed according to the bonding propagation position.

公开(公告)号：US11443965B2

公开(公告)日：2022-09-13

申请号：US16747783

申请日：2020-01-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyeongbin Lim ,  Hyeonjun Yun ,  Gwanghee Jo ,  Jewon Lee ,  Minsoo Han ,  Junhyung Kim ,  Seungdae Seok

IPC: H01L21/67 ,  H01L21/683 ,  H01L23/00 ,  H01L21/20

Abstract: A wafer bonding apparatus includes lower and upper stages, lower and upper push rods, a position detection sensor, and processing circuitry. The stages may vacuum suction respective wafers on respective surfaces of the stages based on a vacuum pressure being supplied to respective suction holes in the respective surfaces from a vacuum pump. The push rods are movable through respective center holes in the stages to apply pressure to respective middle regions of the respective wafers. The position detection sensor may generate information indicating a bonding propagation position of the wafers based on detecting at least one wafer through a detection hole in at least one stage. The processing circuitry may process the information to detect the bonding propagation position and cause a change of at least one of a ratio of protruding lengths of the push rods, or a ratio of suction areas of the stages.

公开(公告)号：US11805580B2

公开(公告)日：2023-10-31

申请号：US17942689

申请日：2022-09-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Deokhee Han ,  Sangcheol Bong ,  Hyunjung Kim ,  Jongkwan Lee ,  June Jang ,  Minsoo Han

IPC: H05B45/325 ,  H05B45/10 ,  H05B45/46

CPC classification number: H05B45/10 ,  H05B45/325 ,  H05B45/46

Abstract: A light emitting diode (LED) driving device is provided. The LED driving device includes a rectifier configured to generate a rectified voltage, wherein the rectifier is directly connected to an input node of a light source including LEDs; a regulator configured to output a direct current (DC) power supply voltage using the rectified voltage; a microcontroller including a control terminal and a power terminal, wherein the microcontroller is configured to generate a dimming control signal based on a voltage input, receive the DC power supply voltage through the power terminal and output the dimming control signal through the control terminal; a driver configured to control an LED current to flow through the LEDs based on the dimming control signal; and a switch connected between a control node and a ground node, wherein an output terminal of the regulator and the control terminal are connected to the control node.

公开(公告)号：US11581188B2

公开(公告)日：2023-02-14

申请号：US16842083

申请日：2020-04-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junhyung Kim ,  Kyeongbin Lim ,  Minsoo Han ,  Minwoo Rhee ,  Inbae Chang

IPC: H01L21/18 ,  B32B37/00 ,  B23K20/10 ,  H01L21/20 ,  H01L21/683 ,  H01L21/687 ,  H01L21/67 ,  H05K13/08 ,  B32B41/00 ,  B32B37/10 ,  B32B38/18

Abstract: A substrate bonding apparatus for bonding a first substrate to a second substrate includes a first bonding chuck supporting the first substrate, a second bonding chuck disposed above the first bonding chuck and supporting the second substrate, a resonant frequency detector detecting a resonant frequency of a bonded structure with the first substrate and the second substrate which are at least partially bonded to each other, and a controller controlling a distance between the first bonding chuck and the second bonding chuck according to the detected resonant frequency of the bonded structure.

公开(公告)号：US20250054878A1

公开(公告)日：2025-02-13

申请号：US18632437

申请日：2024-04-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sujie Kang ,  Minsoo Han ,  Minwoo Rhee ,  Kyoungwhan Oh ,  Kyeongbin Lim

IPC: H01L23/00 ,  H01L21/66

Abstract: A warpage control method includes measuring displacement in a vertical direction perpendicular to a front surface of a wafer and dividing the front surface of the wafer into a first stress region with a negative displacement value and a second stress region with a positive displacement value, to thereby derive a warpage model, defining a portion of a region, overlapping the first stress region, on the front surface of the wafer as a first compensation region based on the warpage model and defining a region, other than the first compensation region, on the front surface of the wafer as a second compensation region based on the warpage model, to thereby derive a stress compensation film pattern model, and forming a mask pattern in a region on a back surface of the wafer.

公开(公告)号：US12112970B2

公开(公告)日：2024-10-08

申请号：US17460424

申请日：2021-08-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daeho Min ,  Junhyung Kim ,  Minsoo Han ,  Mngu Lee ,  Minwoo Rhee

IPC: H01L21/683 ,  B25J15/06 ,  B65G47/91

CPC classification number: H01L21/6838 ,  B25J15/0683 ,  B65G47/91 ,  B65G2249/045

Abstract: A substrate transfer apparatus includes a body portion having a holding region on a surface thereof corresponding to a substrate. The body portion moves so that the surface thereof approaches the substrate up to at least a first distance. A plurality of vacuum holes are distributed in the holding region and form negative pressure to provide suction force to the substrate disposed at the first distance. At least some of the plurality of vacuum holes are disposed at equal intervals at an edge of the holding region and have the same width. A plurality of air holes are distributed in the holding region and form positive pressure to provide a buoyancy force to the substrate close to the holding region at a second distance smaller than the first distance.

公开(公告)号：US20210104405A1

公开(公告)日：2021-04-08

申请号：US16842083

申请日：2020-04-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junhyung Kim ,  Kyeongbin Lim ,  Minsoo Han ,  Minwoo Rhee ,  Inbae Chang

IPC: H01L21/18 ,  B32B37/00 ,  B23K20/10 ,  H01L21/20 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687

Abstract: A substrate bonding apparatus for bonding a first substrate to a second substrate includes a first bonding chuck supporting the first substrate, a second bonding chuck disposed above the first bonding chuck and supporting the second substrate, a resonant frequency detector detecting a resonant frequency of a bonded structure with the first substrate and the second substrate which are at least partially bonded to each other, and a controller controlling a distance between the first bonding chuck and the second bonding chuck according to the detected resonant frequency of the bonded structure.

公开(公告)号：US10950470B2

公开(公告)日：2021-03-16

申请号：US16397552

申请日：2019-04-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taeyeong Kim ,  Minsoo Han ,  Jun Hyung Kim ,  Hoonjoo Na ,  Kwangjin Moon

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/683

Abstract: A substrate bonding apparatus includes a lower chuck that receives a lower substrate and an upper chuck disposed above the lower chuck. An upper substrate is fixed to the upper chuck. The upper chuck and the lower chuck bond the upper substrate to the lower substrate. The upper chuck has an upper convex surface toward the lower chuck. The upper convex surface includes a plurality of first ridges and a plurality of first valleys disposed alternately along an azimuthal direction.